1,3-Bis-<4-(4-amino-phenyl)-thiazolyl-(2)>-benzol | 2588-86-5

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 1,3-Bis-<4-(4-amino-phenyl)-thiazolyl-(2)>-benzol
• 英文别名: 4,4'-(2,2'-m-phenylene-bis-thiazol-4-yl)-bis-aniline；4-[2-[3-[4-(4-Aminophenyl)-1,3-thiazol-2-yl]phenyl]-1,3-thiazol-4-yl]aniline
• CAS: 2588-86-5
• 化学式: C₂₄H₁₈N₄S₂
• 分子量: 426.566
• InChiKey: GPXUPINUTNRGMB-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.3
• 重原子数：
  30
• 可旋转键数：
  4
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  134
• 氢给体数：
  2
• 氢受体数：
  6

反应信息

• 作为产物：
  描述：

  1,3-benzenedicarboxylic acid dithioamide 在 盐酸 、 tin(ll) chloride 作用下， 以 乙醇 、 N,N-二甲基乙酰胺 为溶剂， 生成 1,3-Bis-<4-(4-amino-phenyl)-thiazolyl-(2)>-benzol
  参考文献：
  名称：

  Preston,J., Journal of Heterocyclic Chemistry, 1965, vol. 2, p. 441 - 446

  摘要：

  DOI：

文献信息

• [EN] HIGH HEAT MONOMERS AND METHODS OF USE THEREOF<br/>[FR] MONOMÈRES À CHALEUR ÉLEVÉE ET LEURS PROCÉDÉS D'UTILISATION
  申请人：SABIC GLOBAL TECHNOLOGIES BV

  公开号：WO2016014536A1

  公开（公告）日：2016-01-28

  High purity epoxide compounds, methods for preparing the high purity epoxide compounds, and compositions derived from the epoxide compounds are provided. Also provided are materials and articles derived from the epoxide compounds.

  本发明提供了高纯度环氧化合物、制备高纯度环氧化合物的方法以及从环氧化合物衍生的组合物。还提供了从环氧化合物衍生的材料和物品。
• Bisimide-ether compounds, compositions containing these compounds, and a method for their production
  申请人：Hitachi, Ltd.

  公开号：EP0004592A1

  公开（公告）日：1979-10-17

  A bisimide-ether compound having the general formula is obtained by reacting an ethylenically unsaturated dicarboxylic acid anhydride, a diamine compound and a phenolic compound having in the molecule at least two hydroxyl groups, or by reacting a prepolymer of the anhydride and diamine compound with the phenolic compound : wherein R, is a group containing at least two carbon atoms, R2 is a group containing at least two carbon atoms, R'2 is a group containing at least two carbon atoms and a carbon-carbon double bond, R3 is an aromatic group, the nitrogen atoms of the imide rings being directly connected to different carbon atoms of the group R1, the carbonyl groups of the imide rings being directly connected to different carbon atoms of the group R2 or R'2, the oxygen atoms between the groups R2 and R3 being directly connected to an aromatic nucleus of the group R3, and n is an integer of zero, one or more than 1.

  将乙烯基不饱和二羧酸酐、二胺化合物和分子中含有至少两个羟基的酚类化合物反应，或将酐和二胺化合物的预聚物与酚类化合物反应，可得到通式为...的双亚胺醚化合物： 其中 R, 是至少含有两个碳原子的基团，R2 是至少含有两个碳原子的基团，R'2 是至少含有两个碳原子和一个碳碳双键的基团，R3 是芳香基团，亚胺环的氮原子直接连接到基团 R1 的不同碳原子上、亚胺环的羰基与基团 R2 或 R'2 的不同碳原子直接相连，基团 R2 和 R3 之间的氧原子与基团 R3 的芳香族核直接相连，n 为 0、1 或 1 以上的整数。
• Multi-layer printed circuit board and process for production thereof
  申请人：Hitachi, Ltd.

  公开号：EP0059434A2

  公开（公告）日：1982-09-08

  A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets via prepreg resin sheets, the cured resin in said unit circuit sheet having a glass transition temperature Tg1, said prepreg resin sheets having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg, and that of T92 of the resin in the prepreg resin sheet after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg, and Tg2, has excellent dimensional stability, heat resistance and through-hole reliability.

  一种通过预浸树脂片层压多个单元电路板而生产的多层印刷电路板，所述单元电路板中的固化树脂的玻璃化转变温度为 Tg1，所述预浸树脂片是用一种树脂组合物浸渍增强基板而制备的，该树脂组合物可在等于或低于预浸树脂片中树脂的玻璃化转变温度 Tg 和 T92 的温度下固化、和 T92 的温度下固化，并在等于或低于 Tg 和 Tg2 的温度下加压加热粘合层压板，从而获得具有优异尺寸稳定性、耐热性和通孔可靠性的预浸树脂板。
• Thermosetting resin composition, prepolymer thereof and cured article thereof
  申请人：Hitachi, Ltd.

  公开号：EP0078039A1

  公开（公告）日：1983-05-04

  A thermosetting resin composition comprising (A) at least one dicyanamide compound and (B) at least one polyvalent imide having one or more unsaturated bonds and, if necessary (C) at least one polymerizable compound of epoxy compounds, phenolic compounds and triallyl isocyanurate compounds, and a prepolymer thereof obtained by subjecting the composition to a preliminary reaction with heating to the B stage can give a cured product having excellent heat resistance of class C and flexibility.

  一种热固性树脂组合物，包含(A) 至少一种二氰胺化合物和(B) 至少一种具有一个或多个不饱和键的多价亚胺，必要时还包含(C) 至少一种环氧化合物、酚类化合物和三烯丙基异氰尿酸酯化合物中的可聚合化合物，以及通过将该组合物加热至 B 阶段进行初步反应而得到的预聚物，可以得到具有 C 级优异耐热性和柔韧性的固化产品。
• Heat-resistant resin, thermosetting composition affording the same and prepolymer thereof
  申请人：HITACHI, LTD.

  公开号：EP0102052A2

  公开（公告）日：1984-03-07

  A polymer having excellent heat resistance and mechanical properties and comprising chemical structural units of the following formulae [I] and [II]: (polymer unit having an isomelamine ring) (polymer unit having a normal melamine ring) wherein A and B each represents an at least divalent organic group having at least one aromatic ring and m and n each represents a number of at least 1.

  一种具有优异耐热性和机械性能的聚合物，由下式[I]和[II]的化学结构单元组成： (具有异戊胺环的聚合物单元） (具有一个普通三聚氰胺环的聚合物单元） 其中 A 和 B 分别代表至少具有一个芳香环的二价有机基团，m 和 n 分别代表至少为 1 的数字。