4,5-Dihydroxycyclohexa-2,6-diene-1,2-dicarboxylic acid

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: 4,5-Dihydroxycyclohexa-2,6-diene-1,2-dicarboxylic acid
• 化学式: C₈H₈O₆
• 分子量: 200.14
• InChiKey: MFSRJRFDIILHFC-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -1.6
• 重原子数：
  14
• 可旋转键数：
  2
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.25
• 拓扑面积：
  115
• 氢给体数：
  4
• 氢受体数：
  6

文献信息

• Cis-4,5-dihydro-4,5-dihydroxyphthalic acid and its salts, and process for producing the same
  申请人：JAPAN SYNTHETIC RUBBER CO., LTD.

  公开号：EP0360407A1

  公开（公告）日：1990-03-28

  Cis-4,5-dihydro-4,5-dihydroxyphthalic acid and its salts are novel compounds, and are useful as a starting monomer for various polymers and also as an intermediate for synthesis. They can be produced from phthalic acid, its salts or their mixture using a microorganism belonging to the Pseudomonas genus whose activity to decompose cis-4,5-dihydro-4,5-dihydroxy­phthalic acid, its salts or all of them has disappeared or diminished.

  Cis-4,5-二氢-4,5-二羟基邻苯二甲酸及其盐是新型化合物，可用作各种聚合物的起始单体，也可用作合成的中间体。它们可以通过使用属于假单胞菌属的微生物从邻苯二甲酸、其盐或它们的混合物中生产出来，该微生物的分解Cis-4,5-二氢-4,5-二羟基邻苯二甲酸，其盐或所有这些物质的活性已经消失或减弱。
• RESIN COMPOSITION, RESIN FILM, COVER LAY FILM, INTERLAYER ADHESIVE, METAL CLAD LAMINATE AND MULTILAYER PRINTED CIRCUIT BOARD
  申请人：Sumitomo Bakelite Co., Ltd.

  公开号：EP1942148A1

  公开（公告）日：2008-07-09

  The present invention provides a resin composition for use as an adhesive material of a printed circuit board, comprising a polyimide siloxane resin. The present invention also provides a resin composition, a resin film, a cover lay film, an interlayer adhesive, a metal-clad laminate and a multilayer printed circuit board, in which flowing out during heating/pressing is prevented and which provide excellent adhesion strength. The present invention also provides a resin composition, a resin film, a cover lay film, an interlayer adhesive, a metal-clad laminate and a multilayer printed circuit board, which exhibit excellent heat resistance.

  本发明提供了一种用作印刷电路板粘合材料的树脂组合物，其中包括聚酰亚胺硅氧烷树脂。本发明还提供了一种树脂组合物、一种树脂薄膜、一种覆盖层薄膜、一种层间粘合剂、一种金属包覆层压板和一种多层印刷电路板，在这些树脂组合物、树脂薄膜、覆盖层薄膜、层间粘合剂、金属包覆层压板和多层印刷电路板中，在加热/压制过程中可防止流出，并提供优异的粘合强度。本发明还提供了一种树脂组合物、树脂薄膜、覆盖层薄膜、层间粘合剂、金属包覆层压板和多层印刷电路板，它们具有优异的耐热性。
• CONDUCTIVE PASTE
  申请人：Sumitomo Bakelite Co., Ltd.

  公开号：EP2099036A1

  公开（公告）日：2009-09-09

  This is to provide a conductive paste with higher electroconductivity containing, as raw materials: a metallic powder; a thermosetting resin; and a flux-activating compound having a carboxyl group and a phenolic hydroxyl group, which is applicable to the fine pitch-utilization.

  这是为了提供一种具有更高导电率的导电浆料，其原料包括：金属粉末；热固性树脂；以及具有羧基和酚羟基的助熔剂活性化合物，适用于细间距利用。
• CYCLOHEXADIENEDIOLS AND THEIR USE
  申请人：ENZYMATIX LTD.

  公开号：EP0466793A1

  公开（公告）日：1992-01-22
• JPH00292292A
  申请人：——

  公开号：JPH00292292A

  公开（公告）日：1990-04-03