(2E)-2,6-dimethyl-2,5-heptadienoic acid | 261949-42-2

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 英文名称: (2E)-2,6-dimethyl-2,5-heptadienoic acid
• 英文别名: 2,6-dimethyl-hepta-2,5-dienoic acid；2,6-Dimethyl-hepta-2,5-diensaeure；(E)-2,6-Dimethyl-2,5-heptadienoic acid；(2E)-2,6-dimethylhepta-2,5-dienoic acid
• CAS: 261949-42-2
• 化学式: C₉H₁₄O₂
• 分子量: 154.209
• InChiKey: IGQGIACCENRGLM-SOFGYWHQSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.5
• 重原子数：
  11
• 可旋转键数：
  3
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.44
• 拓扑面积：
  37.3
• 氢给体数：
  1
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  2-羟基-2,6-二甲基-庚-5-烯酸 生成 (2E)-2,6-dimethyl-2,5-heptadienoic acid
  参考文献：
  名称：

  Rupe, Chemische Berichte, 1900, vol. 33, p. 1133

  摘要：

  DOI：

文献信息

• USE OF POLYMER DISPERSIONS IN COATING MATERIALS
  申请人：Roschmann Konrad

  公开号：US20100028546A1

  公开（公告）日：2010-02-04

  The present invention relates to the use in coating compositions of polymer dispersions comprising polymer particles having differently crosslinked regions intraparticulately.
• PREPARATION OF AQUEOUS SLURRIES OF FINELY DIVIDED FILLERS AND THEIR USE FOR THE PRODUCTION OF PAPERS HAVING A HIGH FILLER CONTENT AND HIGH DRY STRENGTH
  申请人：Esser Anton

  公开号：US20100186915A1

  公开（公告）日：2010-07-29

  A process for treating aqueous slurries of finely divided fillers, wherein the treatment is carried out by heating an aqueous slurry of at least one finely divided filler and then by adding an aqueous dispersion of at least one latex.
• CLEANING COMPOSITIONS AND METHODS OF USE THEREOF
  申请人：Fujifilm Electronic Materials U.S.A., Inc.

  公开号：US20210292685A1

  公开（公告）日：2021-09-23

  The present disclosure relates to cleaning compositions that can be used to clean semiconductor substrates. These cleaning compositions can be used to remove defects arising from previous processing steps on these semiconductor substrates. These cleaning compositions can remove the defects/contaminants from the semiconductor substrates and thereby make the substrates appropriate for further processing. The cleaning compositions described herein primarily contain at least one organic acid and at least one anionic polymer.
• US8192580B2
  申请人：——

  公开号：US8192580B2

  公开（公告）日：2012-06-05
• [EN] CLEANING COMPOSITIONS AND METHODS OF USE THEREOF<br/>[FR] COMPOSITIONS DE NETTOYAGE ET LEURS PROCÉDÉS D'UTILISATION
  申请人：FUJIFILM ELECTRONIC MAT USA INC

  公开号：WO2021188766A1

  公开（公告）日：2021-09-23

  The present disclosure relates to cleaning compositions that can be used to clean semiconductor substrates. These cleaning compositions can be used to remove defects arising from previous processing steps on these semiconductor substrates. These cleaning compositions can remove the defects/contaminants from the semiconductor substrates and thereby make the substrates appropriate for further processing. The cleaning compositions described herein primarily contain at least one organic acid and at least one anionic polymer.