Near infrared absorbing composition, near infrared cut filter, method of manufacturing near infrared cut filter, solid image pickup element, camera module, and image display device
申请人:FUJIFILM Corporation
公开号:US10989846B2
公开(公告)日:2021-04-27
Provided are a near infrared absorbing composition with which a cured film having excellent solvent resistance and thermal shock resistance can be manufactured, a near infrared cut filter, a method of manufacturing a near infrared cut filter, a solid image pickup element, a camera module, and an image display device. The near infrared absorbing composition includes: a resin A that satisfies the following condition a1; an infrared absorber B; and a solvent D. At least the resin A has a crosslinking group, or the near infrared absorbing composition further includes a compound C having a crosslinking group that is different from the resin A.
condition a1: in a case where the resin A does not have a crosslinking group, a glass transition temperature of the resin A measured by differential scanning calorimetry is 0° C. to 100° C., and in a case where the resin A has a crosslinking group, a glass transition temperature of a resin having a structure in which a portion which forms a crosslinking bond in the crosslinking group of the resin A is substituted with a hydrogen atom is 0° C. to 100° C., the glass transition temperature being measured by differential scanning calorimetry.
本发明提供了一种近红外吸收组合物、一种近红外切割滤光片、一种近红外切割滤光片的制造方法、一种固体图像拾取元件、一种照相机模块和一种图像显示装置。近红外吸收组合物包括:满足以下条件 a1 的树脂 A;红外线吸收剂 B;以及溶剂 D。至少树脂 A 具有交联基团,或者近红外吸收组合物进一步包括具有不同于树脂 A 的交联基团的化合物 C。
条件 a1:在树脂 A 不具有交联基团的情况下,通过差示扫描量热法测量的树脂 A 的玻璃化转变温度为 0° C 至 100°C;在树脂 A 具有交联基团的情况下,通过差示扫描量热法测量的具有如下结构的树脂的玻璃化转变温度为 0° C 至 100°C:在树脂 A 的交联基团中形成交联键的部分被氢原子取代。