PROCESS OF COATING A HARD MASK COMPOSITION FOR PATTERN TRANSFER INTO A SILICON SUBSTRATE
申请人:Merck Patent GmbH
公开号:EP3686672A1
公开(公告)日:2020-07-29
The present invention relates to a process of coating a hard mask composition on a silicon substrate comprising:
a4) applying a composition comprised of metal oxide nanoparticles dispersed in an organic solvent onto a substrate to form a hard mask film,
b4) baking the hard mask film,
c4) coating a bottom antireflective coating on top of the hard mask film,
d4) coating a photoresist on top of said antireflective coating,
e4) patterning the resist forming a resist pattern,
f4) etching through the bottom antireflective coating not protected by the resist pattern down to the hard mask coating with a fluorinated plasma,
g4) etching through the hard mask layer not protected by the bottom antireflective coating and photoresist down to the silicon substrate with a chlorine plasma producing a patterned hard mask film, and
h4) etching with a fluorinated plasma into the silicon substrate in those area not protected by the patterned hard mask film producing topographical features into the silicon features.
本发明涉及一种在硅衬底上涂覆硬掩膜组合物的工艺,包括
a4) 将分散在有机溶剂中的金属氧化物纳米颗粒组成的组合物涂在基底上,形成硬掩膜、
b4) 烘烤硬掩膜、
c4) 在硬掩膜上涂覆底部抗反射涂层、
d4) 在所述抗反射涂层上涂覆光刻胶、
e4) 将光刻胶图案化,形成光刻胶图案、
f4) 使用含氟等离子体蚀刻未受抗蚀剂图案保护的底部防反射涂层,直至硬掩膜、
g4) 用氯等离子体蚀刻未受底部抗蚀层和光刻胶保护的硬掩膜层,直至硅衬底,形成图案化的硬掩膜,以及
h4) 用含氟等离子体蚀刻硅衬底上未受图案化硬掩膜保护的区域,在硅特征上产生地形特征。