EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PREPARED THEREFROM, AND METHOD OF PREPARING EPOXY COMPOUND
申请人:Samsung Electronics Co., Ltd.
公开号:US20220185947A1
公开(公告)日:2022-06-16
An epoxy compound having an aromatic ring represented by Formula 1 or Formula 2, a composition prepared from the epoxy compound, a semiconductor device prepared from the epoxy compound, an electronic device prepared from the epoxy compound, an article prepared from the epoxy compound, and a method of preparing the epoxy compound:
E1-(M1)
a1
-(L1)
b1
-(M2)
a2
-L2-A1-L3-(M3)
a3
-(L4)
b2
-(M4)
a4
-E2 Formula 1
E3-(A2)
c1
-(L5)
b3
-(M5)
a5
-L6-(M6)
a6
-L7-(M7)
a7
-(L8)
b4
-(A3)
c2
-E4 Formula 2
In Formulae 1 and 2, M1, M2, M3, M4, M5, M6, M7, A1, A2, A3, L1, L2, L3, L4, L5, L6, L7, L8, E1, E2, E3, E4, a1, a2, a3, a4, a5, a6, a7, b1, b2, b3, b4, c1, and c2 are the same as defined in the detailed description.