A polymerzable compound represented by the general formula (1) X-R, -Y where X is an unsaturated imide group having substituents R2 and R3, or an itacon imide group where R2 and R3 are selected from the group consisting of hydrogen, a lower alkyl group and an aromatic group having a substituent p which is hydrogen, a lower alkyl group, or an alkoxy group, and Y is a styryl group, and R1 is a divalent organic group.
The polymerizable compounds is excellent in formability, and find a wide variety of applications because they have functional groups different in reactivity from each other and hence allow the curing conditions to control. The cured polymers are excellent in thermal durability, mechanical properties and electrical properties, making it possible to achieve higher performance, higher reliability, highly compact and lower weight of electric apparatuses and electronic parts.
由通式(1)X-R,-Y 所代表的可聚合化合物 其中 X 是具有取代基 R2 和 R3 的不饱和
酰亚胺基团,或者是具有取代基 p(氢、低级烷基或烷氧基)的烷
酰亚胺基团,其中 R2 和 R3 选自氢、低级烷基和芳香基组成的组,Y 是
苯乙烯基团,R1 是二价有机基团。
可聚合化合物具有优异的成型性,而且应用广泛,因为它们的官能团之间的反应活性不同,因此可以控制固化条件。固化后的聚合物在热耐久性、机械性能和电气性能方面都非常出色,因此可以实现电气设备和电子零件的高性能、高可靠性、高紧凑性和低重量。