N-(4-乙烯苯)顺丁烯二酰亚胺 | 19007-91-1

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡咯啉
• 中文名称: N-(4-乙烯苯)顺丁烯二酰亚胺
• 中文别名: N-(4-乙烯基苯基)马来酰亚胺
• 英文名称: N-(4-Vinylphenyl)maleimide
• 英文别名: 1-(4-ethenylphenyl)pyrrole-2,5-dione
• CAS: 19007-91-1
• 化学式: C₁₂H₉NO₂
• mdl: MFCD00144835
• 分子量: 199.2
• InChiKey: CJFAYQNLIBPJJY-UHFFFAOYSA-N

物化性质

• 沸点：
  336.72°C (rough estimate)
• 密度：
  1.1919 (rough estimate)
• 稳定性/保质期：
  遵照规定使用和储存，则不会分解。

计算性质

• 辛醇/水分配系数(LogP)：
  1.9
• 重原子数：
  15
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  37.4
• 氢给体数：
  0
• 氢受体数：
  2

安全信息

• 安全说明：
  S24/25

反应信息

• 作为产物：
  描述：

  4-乙烯苯胺 、 马来酸酐 生成 N-(4-乙烯苯)顺丁烯二酰亚胺
  参考文献：
  名称：

  KLEMARCZYK, PHILIP

  摘要：

  DOI：

文献信息

• Curable resin composition
  申请人：MITSUI TOATSU CHEMICALS, Inc.

  公开号：EP0077840A1

  公开（公告）日：1983-05-04

  Disclosed is a curable resin composition comprising a) at least one maleimide compound selected from the group consisting of N-(alkenylphenyllmaleimide derivatives, and dimers and polymers thereof and b) one or more kinds of epoxy resins, each having at least one epoxy group in the unit molecule thereof. The resin composition may contain, besides the above two components, an amino compound as a further component c). The resin composition may comprise a prepolymer of any two components among the three components a), b) and c) and the remaining component.

  本发明公开了一种可固化树脂组合物，该树脂组合物包含 a) 至少一种马来酰亚胺化合物，该化合物选自由 N-(烯基苯基)马来酰亚胺衍生物及其二聚体和聚合物组成的组，以及 b) 一种或多种环氧树脂，每种环氧树脂的单位分子中至少有一个环氧基团。除上述两种成分外，树脂组合物还可含有一种氨基化合物作为 c) 成分。树脂组合物可包括 a)、b)和 c)三种组分中任意两种组分的预聚物和其余组分。
• Heat-resistant resin composition
  申请人：SHOWA DENKO KABUSHIKI KAISHA

  公开号：EP0348906A1

  公开（公告）日：1990-01-03

  A resin composition comprising (A) at least one heat-resistant resin, (B) at least one thermoplastic resin, (C) an antimony oxide, (D) at least one bromine-­containing reaction product selected from the group consisting of (1) a compound having a molecular weight of from 1,200 to 6,000 and a bromine content of from 5.0 to 60% by weight which is obtained by reacting a bromine-containing epoxy compound and 1,3,5-­tribromophenol, and (2) a compound obtained by reacting a bromine-containing epoxy compound having an epoxy equivalent of from 450 to 7,000 and a bromine content of from 5.0 to 52% by weight and an acrylonitrile-butadiene copolymer having a carboxyl group at the both terminals thereof and a molecular weight of from 1,000 to 10,000, and (E) at least one silicon-containing compound selected from the group consisting of (1) silicone oil, (2) a ladder silicone resin, and (3) an alkoxysilane having a mercapto group, a vinyl group or a methacryloyl group, is disclosed. The resin composition is excellent in heat resistance, impact resistance, flame retardancy, and molding properties.

  一种树脂组合物，包括(A) 至少一种耐热树脂，(B) 至少一种热塑性树脂，(C) 氧化锑，(D) 至少一种含溴反应产物，该反应产物选自以下组别：(1) 一种化合物，其分子量为 1,200 至 6,000 之间，溴含量为 5.0至60%(重量)的化合物，它是由含溴环氧化合物和1,3,5-三溴苯酚反应得到的；和(2)由含溴环氧化合物和含溴环氧化合物反应得到的化合物，含溴环氧化合物的环氧当量为450至7,000，溴含量为5.(E) 至少一种含硅化合物，选自(1)硅油，(2)阶梯硅树脂和(3)具有巯基、乙烯基或甲基丙烯酰基的烷氧基硅烷组成的组。该树脂组合物具有优异的耐热性、抗冲击性、阻燃性和成型性能。
• Polymerizable compound, process for producing same and setting composition containing polymerizable compound
  申请人：HITACHI, LTD.

  公开号：EP0546550A1

  公开（公告）日：1993-06-16

  A polymerzable compound represented by the general formula (1) X-R, -Y where X is an unsaturated imide group having substituents R2 and R3, or an itacon imide group where R2 and R3 are selected from the group consisting of hydrogen, a lower alkyl group and an aromatic group having a substituent p which is hydrogen, a lower alkyl group, or an alkoxy group, and Y is a styryl group, and R1 is a divalent organic group. The polymerizable compounds is excellent in formability, and find a wide variety of applications because they have functional groups different in reactivity from each other and hence allow the curing conditions to control. The cured polymers are excellent in thermal durability, mechanical properties and electrical properties, making it possible to achieve higher performance, higher reliability, highly compact and lower weight of electric apparatuses and electronic parts.

  由通式（1）X-R，-Y 所代表的可聚合化合物 其中 X 是具有取代基 R2 和 R3 的不饱和酰亚胺基团，或者是具有取代基 p（氢、低级烷基或烷氧基）的烷酰亚胺基团，其中 R2 和 R3 选自氢、低级烷基和芳香基组成的组，Y 是苯乙烯基团，R1 是二价有机基团。 可聚合化合物具有优异的成型性，而且应用广泛，因为它们的官能团之间的反应活性不同，因此可以控制固化条件。固化后的聚合物在热耐久性、机械性能和电气性能方面都非常出色，因此可以实现电气设备和电子零件的高性能、高可靠性、高紧凑性和低重量。
• Polymer polyol, and flame retardant polyurethane resin and foam prepared therefrom
  申请人：Mitsui Chemicals, Inc.

  公开号：EP0861861A1

  公开（公告）日：1998-09-02

  A polymer dispersed polyol has a vinyl polymer dispersed in polyol, the vinyl polymer comprising containing 5 to 80 wt% of acrylamide compound (A) represented by the formula (1):         CH2=CR1CONR2R3     (1) wherein R1, R2 and R3 are a hydrogen atom or hydrocarbon group having 1 to 10 carbon atoms, 0 to 70 wt% of one or more monomer (B) selected from acrylonitrile and methacrylonitrile, and 0 to 95 wt% of a vinyl monomer (C) which can copolymerize with (A) and (B), and 95 to 20 wt% of the total amount of (B) and (C); and when (C) is 0 wt%, (A) is the polymer of a vinyl monomer mixture containing an acrylamide derivative represented by the formula (2):         CH2=CR4CONR5R6     (2) wherein R4, R5 and R6 are a hydrogen atom or hydrocarbon group having 1 to 10 carbon atoms, and not simultaneously the hydrogen atom; and said polyol comprising containing 5 to 50 wt% of the vinyl polymer. Flame retardant polyurethane resins and flame retardant polyurethane foams are obtainable from the polymer dispersed polyol.

  一种聚合物分散多元醇具有分散在多元醇中的乙烯基聚合物，该乙烯基聚合物包含 5 至 80 wt%由式（1）表示的丙烯酰胺化合物（A）： CH2=CR1CONR2R3 (1) 其中 R1、R2 和 R3 为氢原子或具有 1 至 10 个碳原子的烃基；0 至 70 wt%的选自丙烯腈和 甲基丙烯腈的一种或多种单体（B）；0 至 95 wt%的可与（A）和（B）共聚的乙烯基单体 （C）；95 至 20 wt%的（B）和（C）总量；当(C)为 0 wt%时，(A)为含有式(2)表示的丙烯酰胺衍生物的乙烯基单体混合物的聚合物： CH2=CR4CONR5R6 (2) 其中 R4、R5 和 R6 为氢原子或具有 1 至 10 个碳原子的烃基，且不同时为氢原子；所述多元醇包括含有 5 至 50 wt%的乙烯基聚合物。阻燃聚氨酯树脂和阻燃聚氨酯泡沫可从聚合物分散多元醇中获得。
• THERMOSETTING RESIN COMPOSITION
  申请人：Showa Denko K.K.

  公开号：EP3239200A1

  公开（公告）日：2017-11-01

  Provided is a thermosetting resin composition which is capable of obtaining, as a result of being cured, a highly reliable cured product exhibiting excellent moisture resistance, heat resistance, and mechanical strength. The present invention includes a polyalkenyl phenol resin (A) and an aromatic polymaleimide compound (B). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (a1) which has or does not have a 2-alkenyl group bonded thereto, and in which a phenolic hydroxyl group is alkyl-etherified, and at least one aromatic ring unit (a2) which has a phenolic hydroxyl group, and which has or does not have a 2-alkenyl group bonded thereto. At least one of the aromatic ring units (a1, a2) has a 2-alkenyl group. Each of the aromatic ring units is bonded by a linking group. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of n to (m + n) is 10-60%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).

  本发明提供了一种热固性树脂组合物，该组合物在固化后能够获得高可靠性的固化产品，该产品具有优异的耐湿性、耐热性和机械强度。本发明包括聚烯基苯酚树脂（A）和芳香族聚马来酰亚胺化合物（B）。聚烯基苯酚树脂（A）在其分子中至少有一个芳环单元（a1），该单元上有或没有 2-烯基，其中一个酚羟基被烷基醚化，以及至少有一个芳环单元（a2），该单元上有一个酚羟基，其中有或没有 2-烯基。芳环单元（a1、a2）中至少有一个具有 2-烯基。每个芳香环单元都由一个连接基团键合。当 m 代表芳香环单元（a1）的数量，n 代表芳香环单元（a2）的数量时，n 与（m + n）的比例为 10-60%。聚烯基苯酚树脂（A）的加入量为芳香族聚马来酰亚胺化合物（B）中每摩尔马来酰亚胺基中 2-烯基的含量为 0.4-1.5 摩尔。