ethane-1,2-diyibis(phenyl-t-butylphosphine)dioxane | 115241-63-9

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: ethane-1,2-diyibis(phenyl-t-butylphosphine)dioxane
• 英文别名: [Tert-butyl-[2-[tert-butyl(phenyl)phosphoryl]ethyl]phosphoryl]benzene
• CAS: 115241-63-9
• 化学式: C₂₂H₃₂O₂P₂
• 分子量: 390.442
• InChiKey: SHUQRYJRJVURMI-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.6
• 重原子数：
  26
• 可旋转键数：
  7
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.45
• 拓扑面积：
  34.1
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  dilithium salt of 1,2-bis(phenylphosphino)ethane 在 双氧水 作用下， 以 四氢呋喃 、 丙酮 为溶剂， 反应 2.0h， 生成 ethane-1,2-diyibis(phenyl-t-butylphosphine)dioxane
  参考文献：
  名称：

  Organophosphorus Intermediates. IX. The Cleavage of α,ω-Bisdiphenylphosphinoalkanes With Lithium. A 13P N.M.R. Study

  摘要：

  标题膦，Ph2P(CH2).PPh2（n = 2-5），在四氢呋喃中与锂反应，直接生成相应的 1，n-二硫-1，n-二（苯基膦），很少或根本没有 1-硫代-1-苯基-n-二苯基膦烷烃中间产物，不过，可以通过二膦的芳基化反应得到这些中间产物。亚甲基二苯基膦和 1,4-二苯基-1,4-二膦烷只发生磷-烷基碳裂解。介绍了二膦化物的化学性质和 31P n.m.r.光谱，并讨论了裂解反应的机理。介绍了液氨中的一些裂解反应。

  DOI：

  10.1071/ch9871341

文献信息

• BROOKS, PETER;GALIAGHER, MICHAEL J.;SARROFF, ADRIAN, AUSTRAL. J. CHEM., 40,(1987) N 8, 1341-1351
  作者：BROOKS, PETER、GALIAGHER, MICHAEL J.、SARROFF, ADRIAN

  DOI：——

  日期：——
• LOW DIELECTRIC RESIN COMPOSITION WITH PHOSPHORUS-CONTAINING FLAME RETARDANT AND PREPARATION METHOD AND APPLICATION THEREOF
  申请人：Elite Electronic Material (Zhong Shan) Co., Ltd.

  公开号：US20160021740A1

  公开（公告）日：2016-01-21

  The invention belongs to the technical field of low dielectric resin compositions, and discloses a low dielectric resin composition with phosphorus-containing flame retardant and a prepreg, resin film, laminate and printed circuit board prepared therefrom. The composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I). In the present invention, diphenylphosphine oxide is derivatized, and prepared a phosphorus-containing flame retardant, which has no reactive functional groups, has better dielectric properties, and has high melting point, and upon combining with a vinyl compound, a resin composition is obtained, and a laminate having low thermal expansion ratio, high heat resistance, high glass transition temperature, and low dielectric constant and dissipation factor, can be made from the resin composition, and can effectively achieve the flame resistance effect of UL94 V-0 without using halogen-containing flame retardant, and can be used in the preparation of prepregs, resin films, resin coated coppers, flexible resin coated coppers, laminates and printed circuit boards.
• LOW DIALECTRIC COMPOSITE MATERIAL AND LAMINATE AND PRINTED CIRCUIT BOARD THEREOF
  申请人：ELITE ELECTRONIC MATERIAL (ZHONG SHAN) CO., LTD.

  公开号：US20160021739A1

  公开（公告）日：2016-01-21

  The present invention belongs to the technical field of resin composite materials, in particular relates to a low dielectric composite material and a laminate and printed circuit board prepared therefrom. The composite material is obtained by adhering a low dielectric resin composition with phosphorus-containing flame retardant onto a substrate; the composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I). In the present invention, diphenylphosphine oxide is derivatized, and prepared a phosphorus-containing flame retardant, which has no reactive functional groups, has better dielectric properties, and has high melting point, and upon combining with a vinyl compound, a resin composition is obtained, and a composite material having low thermal expansion ratio, high heat resistance, high glass transition temperature, and low dielectric constant and dissipation factor, can be made from the resin composition, and a laminate and printed circuit board having the properties of high glass transition temperature, low dielectric properties, halogen-free flame retardancy, low thermal expansion coefficient of the laminate, etc., can be made from the composite material.
• US9872382B2
  申请人：——

  公开号：US9872382B2

  公开（公告）日：2018-01-16
• US9867287B2
  申请人：——

  公开号：US9867287B2

  公开（公告）日：2018-01-09