1-<2-Acetoxy-ethyl>-aziridin | 6498-79-9

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: 1-<2-Acetoxy-ethyl>-aziridin
• 英文别名: 1-acetoxy-2-aziridin-1-yl-ethane；2-(Aziridin-1-yl)ethyl acetate
• CAS: 6498-79-9
• 化学式: C₆H₁₁NO₂
• 分子量: 129.159
• InChiKey: LLNCSHGKCWFIIB-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -0.1
• 重原子数：
  9
• 可旋转键数：
  4
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.83
• 拓扑面积：
  29.3
• 氢给体数：
  0
• 氢受体数：
  3

文献信息

• ACID-CURABLE COMPOSITION
  申请人：3M Innovative Properties Company

  公开号：EP3650485A1

  公开（公告）日：2020-05-13

  The present disclosure relates to an acid-curable composition, comprising: a) a base component comprising a cationically self-curable oligomeric compound; b) a curing system for the cationically self-curable oligomeric compound, which comprises: i. an ionogenic compound comprising an anion and ammonium as a cation; and ii. water. According to another aspect, the present disclosure is directed to a curing system suitable for an acid-curable composition comprising a cationically self-curable oligomeric compound. According to still another aspect, the present disclosure relates to a method of manufacturing an acid-curable composition. In yet another aspect, the disclosure relates to the use of an acid-curable composition for industrial applications, in particular for thermal management applications in the automotive industry.

  本公开涉及一种酸固化组合物，包括 a) 包含阳离子自固化低聚物化合物的基础成分； b) 阳离子自固化低聚化合物的固化体系，包括 i. 由阴离子和作为阳离子的铵组成的离子化合物；和 ii. 水。 另一方面，本公开涉及一种固化体系，适用于包含阳离子自固化低聚化合物的酸固化组合物。还有一方面，本公开涉及一种制造酸固化组合物的方法。在另一个方面，本公开涉及酸固化组合物在工业应用中的使用，特别是在汽车工业的热管理应用中的使用。
• THERMALLY-CONDUCTIVE CURABLE COMPOSITION
  申请人：3M Innovative Properties Company

  公开号：EP3819328A1

  公开（公告）日：2021-05-12

  The present disclosure relates to a thermally-conductive curable composition comprising: a) a base component comprising a cationically self-curable silicone-based oligomeric compound; b) a curing system for the cationically self-curable silicone-based oligomeric compound; and c) a thermally-conductive filler. According to another aspect, the present disclosure is directed to a method of manufacturing a thermally-conductive curable composition. In yet another aspect, the disclosure relates to the use of a thermally-conductive curable composition for industrial applications, in particular for thermal management applications in the automotive industry.

  本公开涉及一种导热固化组合物，包括 a) 包含阳离子自固化硅基低聚物化合物的基础成分； b) 用于阳离子自固化硅基低聚化合物的固化体系；以及 c) 导热填料。 根据另一个方面，本公开涉及一种热导性可固化组合物的制造方法。在另一个方面，本公开涉及热导性可固化组合物在工业应用中的使用，特别是在汽车工业中的热管理应用。
• US5298568A
  申请人：——

  公开号：US5298568A

  公开（公告）日：1994-03-29
• US5371135A
  申请人：——

  公开号：US5371135A

  公开（公告）日：1994-12-06