3-(triphenylphosphonio)phenolate | 631896-12-3

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 3-(triphenylphosphonio)phenolate
• 英文别名: 3-Triphenylphosphaniumylphenolate
• CAS: 631896-12-3
• 化学式: C₂₄H₁₉OP
• 分子量: 354.388
• InChiKey: VZIJAVAVCAXNET-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.5
• 重原子数：
  26
• 可旋转键数：
  4
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  23.1
• 氢给体数：
  0
• 氢受体数：
  1

反应信息

• 作为产物：
  描述：

  (3-hydroxyphenyl)triphenylphosphonium bromide 在 sodium hydroxide 作用下， 以 乙醇 为溶剂， 以99%的产率得到3-(triphenylphosphonio)phenolate
  参考文献：
  名称：

  Tetraarylphosphonium inner-salts (TAPIS) as both Lewis base catalyst and phase tag

  摘要：

  Tetraarylphosphonium inner-salts (TAPIS) have been designed, synthesized and verified as recyclable and reusable Lewis base catalysts. The resulted TAPIS catalyst has been successfully applied in Michael addition, cyanation and trifluoromethylation reactions. (C) 2017 Elsevier Ltd. All rights reserved.

  DOI：

  10.1016/j.tetlet.2017.06.015
• 作为试剂：
  描述：

  二氧化碳 、 1-iodo-2-hexanol 在 3-(triphenylphosphonio)phenolate 作用下， 以 氯苯 为溶剂， 60.0 ℃ 、101.33 kPa 条件下， 反应 24.0h， 以49%的产率得到4-butyl-1,3-dioxolan-2-one
  参考文献：
  名称：

  甲氧基可提高双功能四芳基phosph盐催化剂对二氧化碳固定的反应性：机理研究。

  摘要：

  在温和条件下二氧化碳固定化的发展是有机合成的中心主题。尽管在过去的二十年中有机催化领域取得了巨大的进步，但是环氧化物与二氧化碳的偶联反应在大气压下，低于100°C的温度下仍具有挑战性。在我们对四芳基phosph盐（TAPS）催化的理想研究中，我们在这里报告了在60°C下使用1 atm的二氧化碳通过化学固定法进行双功能TAPS催化的五元环状碳酸酯的合成。观察到了引人入胜的TAPS取代基效应，其中供电子基团增强了它们的反应性。此外，还通过实验和理论研究对这种机理进行了深入研究，提示TAPS的电子性质会影响二氧化碳插入卤代醇中间体的过程。结果提供了丰富的信息，以了解TAPS行为的起源，这将有助于设计用于二氧化碳捕集的新型催化剂。

  DOI：

  10.1021/acs.joc.9b02581

文献信息

• Epoxy resin composition, process for providing latency to the composition and semiconductor device
  申请人：Akiyama Yoshihito

  公开号：US20060189721A1

  公开（公告）日：2006-08-24

  An epoxy resin composition which comprises an epoxy resin (A), a curing agent (B), a curing accelerator (C) and a component retarding curing of the epoxy resin (D) which is at least one component selected from components (a), (b) and (c) represented by general formulae [1], [2] and [3], respectively, a semiconductor device having a semiconductor element sealed by using the composition, and a process for providing latency to an epoxy resin composition. The epoxy resin exhibits excellent storage stability, excellent fluidity and curing property during sealing by molding and excellent resistance to soldering without forming cleavages or cracks by the soldering treatment at high temperatures in accordance with the lead-free soldering. An epoxy resin composition can be provided with latency by adjusting the amounts of the curing accelerator and the component for retarding curing. (a) An anion component represented by general formula [1]: (b) A compound represented by general formula [2]: (c) A silane compound represented by general formula [3]:

  一种环氧树脂组合物，包括环氧树脂（A）、固化剂（B）、固化促进剂（C）和至少选自由一组分（a）、（b）和（c）中的一种，该组分可以延缓环氧树脂固化（D），该组分分别由通式[1]、[2]和[3]表示。使用该组合物密封半导体元件的半导体器件，以及提供环氧树脂组合物潜伏期的方法。该环氧树脂具有优异的储存稳定性、流动性和在模压密封时的固化性能，以及在符合无铅焊接的高温焊接处理中，具有优异的抗焊接剪切和抗裂纹性能。通过调整固化促进剂和延缓固化组分的量，可以提供一种具有潜伏期的环氧树脂组合物。（a）由通式[1]表示的阴离子组分：（b）由通式[2]表示的化合物：（c）由通式[3]表示的硅烷化合物：
• Curing Accelerator, Curable Resin Composition and Electronic Parts Device
  申请人：Nakamura Shinya

  公开号：US20090012232A1

  公开（公告）日：2009-01-08

  A curing accelerator that enables a composition to exhibit excellent fluidity, reflow crack resistance and high-temperature storage properties, and exhibits excellent curability even upon moisture absorption, as well as a curable resin composition, and an electronic parts device comprising an element that has been encapsulated using the curable resin composition. The curable resin composition is prepared using a curing accelerator comprising a compound represented by a formula (I) shown below. (wherein, R 1 is selected from the group consisting of a hydrogen atom, and substituted or unsubstituted hydrocarbon groups of 1 to 18 carbon atoms, two or more R 1 groups may be bonded together to form a cyclic structure, R 2 and R 3 are selected from the group consisting of a hydrogen atom, a hydroxyl group, and substituted or unsubstituted organic groups of 1 to 18 carbon atoms, two or more R 2 or R 3 groups may be bonded together to form a cyclic structure, YH represents an organic group of 0 to 18 carbon atoms containing one or more releasable protons (H + ), and may be bonded to one or more R 2 groups to form a cyclic structure, m represents an integer from 1 to 4, and p represents a number of 0 or greater).
• US7585904B2
  申请人：——

  公开号：US7585904B2

  公开（公告）日：2009-09-08
• US7723444B2
  申请人：——

  公开号：US7723444B2

  公开（公告）日：2010-05-25
• Tetraarylphosphonium inner-salts (TAPIS) as both Lewis base catalyst and phase tag
  作者：Shuhui Guo、Xueling Mi

  DOI：10.1016/j.tetlet.2017.06.015

  日期：2017.7

  Tetraarylphosphonium inner-salts (TAPIS) have been designed, synthesized and verified as recyclable and reusable Lewis base catalysts. The resulted TAPIS catalyst has been successfully applied in Michael addition, cyanation and trifluoromethylation reactions. (C) 2017 Elsevier Ltd. All rights reserved.