3-Oxodocosanoic acid | 115097-24-0

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 英文名称: 3-Oxodocosanoic acid
• CAS: 115097-24-0
• 化学式: C₂₂H₄₂O₃
• 分子量: 354.6
• InChiKey: GLJSCOCOXZOMDN-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  9.1
• 重原子数：
  25
• 可旋转键数：
  20
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.91
• 拓扑面积：
  54.4
• 氢给体数：
  1
• 氢受体数：
  3

文献信息

• Verfahren zur Herstellung eines alpha-L-Aspartyl-L-Phenylalanin-alkylesters
  申请人：GEMA S.A.

  公开号：EP0143881A2

  公开（公告）日：1985-06-12

  Vorgeschlagen wird ein Verfahren zur Herstellung von α-L-Aspartyl-L-phenylalanin-alkylestern durch Umsetzung von Asparaginsäure mit einem Alkalihydroxid oder einem organischem Amin, Weiterumsetzung des entstandenen Salzes mit einem Ce bis C20 Alkylacetoacetat oder einem C, bis C20 Acetoacetamid, Ueberführung des erhaltenen DANE-Salzes mit einem Säurechlorid zum gemischten Anhydrid und Kondensation desselben mit Phenylalnin-alkylester zum gewünschten Endprodukt.

  本发明提出了一种制备α-L-天冬氨酰-L-苯丙氨酸烷基酯的工艺，其方法是将天冬氨酸与碱金属氢氧化物或有机胺反应，进一步将生成的盐与Ce至C20乙酰乙酸烷基酯或C、至 C20 乙酰乙酰胺反应，将生成的 DANE 盐与酸氯化物转化为混合酸酐，然后与苯丙氨酸烷基酯缩合，得到所需的最终产品。
• COMPATIBILISING AGENTS
  申请人：IMPERIAL CHEMICAL INDUSTRIES PLC

  公开号：EP0728162B1

  公开（公告）日：1997-12-29
• POLYISOCYANATE COMPOSITION FOR BINDING LIGNOCELLULOSIC MATERIAL
  申请人：HUNTSMAN INTERNATIONAL LLC

  公开号：EP0859805B2

  公开（公告）日：2006-10-11
• Electronic device using coating epoxy resin composition
  申请人：KABUSHIKI KAISHA TOSHIBA

  公开号：US20040183215A1

  公开（公告）日：2004-09-23

  The electronic device of the present invention is an electronic device provided with a nonaqueous solvent battery such as a lithium ion secondary battery and with an electronic circuit arranged adjacent to the battery, the adjacent electronic circuit being protected such that it is not adversely affected by an electrolyte leaked from the nonaqueous solvent battery. An epoxy resin composition which is a resin used to protect the circuit is superior in resistance to an electrolyte, water resistance, heat resistance, adhesion, prevention of resin cracks during a cooling and heating cycle and storage stability and is used to protect the electronic circuit, thereby making it possible to improve the life of an electronic device remarkably. The epoxy resin composition used in the present invention is an epoxy resin composition comprising (a) an epoxy resin, (b) a phenol compound and a metal complex as a latent catalyst, (c) a butyral resin and (d) an inorganic filler. It is preferable that this epoxy resin be a liquid at ambient temperature and the latent catalyst be premixed in an epoxy resin in advance.
• PROCESS FOR MANUFACTURING GAS BARRIER FILM
  申请人：Konica Minolta, Inc.

  公开号：US20150344651A1

  公开（公告）日：2015-12-03

  An object of the present invention is to provide a process for manufacturing a gas barrier film which exhibits excellent storage stability. The process for manufacturing a gas barrier film of the present invention is characterized by including: (a) forming, on a substrate, an unmodified layer A which contains a silicon compound having a structure represented by the following General Formula (1) —[Si(R 1 )(R 2 )—N(R 3 )] n —; (b) forming a layer B which contains a compound having an oxygen element or a nitrogen element on the unmodified layer A; and (c) irradiating with vacuum ultraviolet ray from the layer B side to modify the unmodified layer A.