Photoinitiator and photopolymerizable composition using the same
申请人:Hitachi Chemical Co., Ltd.
公开号:EP0295044A2
公开(公告)日:1988-12-14
A photoinitiator composition comprising (1) an aminobenzylidene carbonyl compound and (2) an N-aryl-α-amino acid is suitable for use in a photopolymerizable composition comprising (a) an addition-polymerizable compound having a boiling point of 100°C or higher at an atmospheric pressure and (b) said photoinitiator composition.
A process for the preparation and/or purification of clavulanic acid or a pharmaceutically acceptable salt or ester thereof comprises
i) contacting impure clavulanic acid or an alkali metal salt thereof in an organic solvent, with an amine of formula (II)
where R¹ is a group of general formula
where R⁴ and R⁵ are independently hydrogen, alkyl, amino-substituted alkyl or substituted amino-substituted alkyl, and R² and R³ are independently selected from hydrogen, alkyl, amino- or hydroxy-substituted alkyl or substituted amino-substituted alkyl, and m is zero or an integer 1 to 5;
ii) isolating the amine salt of clavulanic acid formed;
iii) converting the thus formed salt into clavulanic acid or a pharmaceutically acceptable salt or ester thereof.
A process for the preparation of clavulanic acid or its pharmaceutically acceptable salts and esters in which an amine of formula (II):
is used as an intermediate to form a salt with clavulanic acid, R1, R2 and R3 being selected from various substituent atoms and groups.
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT COMPRISING THE SAME, METHOD FOR PRODUCING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD
申请人:Hitachi Chemical Company, Ltd.
公开号:EP1282010A1
公开(公告)日:2003-02-05
The present invention provides a photosensitive resin composition for laser scanning exposure, which satisfies the following formula (1):-25≦ E1-E0E0 × 100 ≦ 25 wherein E0 represents an exposure amount in mJ/cm2 at which the photosensitive resin composition is cured at the 21st step of the density 1.00 of a 41-step step tablet having a density range from 0.00 to 2.00, a density step of 0.05, a tablet size of 20 mm × 187 mm and a step size of 3 mm × 12 mm, by irradiation with a full wavelength active light of a high pressure mercury lamp and E1 represents an exposure amount in mJ/cm2 at which the photosensitive resin composition after being left for 2 hours under 40 W non-ultraviolet white lamp is cured at the 21st step of the 41-step step tablet by irradiation with a full wavelength active light from a high pressure mercury lamp.
Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board
申请人:Hitachi Chemical Company, Ltd.
公开号:EP2172806A2
公开(公告)日:2010-04-07
The present invention provides a photosensitive resin composition for laser scanning exposure, which satisfies the following formula (1): -25≦E1-E0E0×100≦25
wherein E0 represents an exposure amount in mJ/cm2 at which the photosensitive resin composition is cured at the 21st step of the density 1.00 of a 41-step step tablet having a density range from 0.00 to 2.00, a density step of 0.05, a tablet size of 20 mm × 187 mm and a step size of 3 mm × 12 mm, by irradiation with a full wavelength active light of a high pressure mercury lamp and E1 represents an exposure amount in mJ/cm2 at which the photosensitive resin composition after being left for 2 hours under 40 W non-ultraviolet white lamp is cured at the 21st step of the 41-step step tablet by irradiation with a full wavelength active light from a high pressure mercury lamp.