5-(4-ethynylphenoxy)isophthalic acid | 92176-81-3

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 5-(4-ethynylphenoxy)isophthalic acid
• 英文别名: 5-(4-Ethynylphenoxy)benzene-1,3-dicarboxylic acid
• CAS: 92176-81-3
• 化学式: C₁₆H₁₀O₅
• 分子量: 282.252
• InChiKey: BCKVZZISSIHXFT-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.7
• 重原子数：
  21
• 可旋转键数：
  5
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  83.8
• 氢给体数：
  2
• 氢受体数：
  5

反应信息

• 作为反应物：
  描述：

  5-(4-ethynylphenoxy)isophthalic acid 生成 5-(4-ethynylphenoxy)isophthaloyl chloride
  参考文献：
  名称：

  摘要：

  DOI：
• 作为产物：
  描述：

  dimethyl-5-(4-ethynylphenoxy)isophthalate 生成 5-(4-ethynylphenoxy)isophthalic acid
  参考文献：
  名称：

  摘要：

  DOI：

文献信息

• RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME
  申请人：Fujita Kazuyoshi

  公开号：US20090118431A1

  公开（公告）日：2009-05-07

  A main object of the present invention is to provide a resin composition having high heat resistance and a low dielectric constant, a varnish thereof, a resin film thereof and a semiconductor device using the same. In the present invention, the object is achieved by a resin composition comprising a compound having a structure represented by formula (1) and a crosslinking agent: wherein in formula (1), R 0 is a single bond or has a structure represented by formula (2); R 1 to R 8 are respectively any of hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and “X” is any of —O—, —NHCO—, —CONH—, —COO— and —OCO—; further, wherein in formula (2), “Ar” is an aromatic group; “Y” is any of a single bond —O—, —S—, —OCO— and —COO—; “q” is an integer of 1 or more; R 9 is hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when “q” is an integer of 2 or more; at least one of R 1 to R 8 is the group having an alicyclic structure when R 0 is a single bond; at least one of R 1 to R 9 is the group having an alicyclic structure when R 0 has the structure represented by formula (2); and “*” and “**” represent a position to be bonded to a different chemical structure.

  本发明的主要目的是提供一种具有高耐热性和低介电常数的树脂组合物，其清漆，树脂膜以及使用该组合物的半导体器件。在本发明中，通过包括具有以下结构的化合物和交联剂的树脂组合物来实现该目标：其中在公式（1）中，R0是单键或具有以下结构的化合物（2）；R1到R8分别为氢、具有脂环结构的基团、具有1到10个碳原子的有机基团（不包括具有脂环结构的基团）、羟基和羧基中的任意一种；“X”是以下任意一种：—O—、—NHCO—、—CONH—、—COO—和—OCO—；此外，在公式（2）中，“Ar”是芳香族基团；“Y”是以下任意一种：单键—O—、—S—、—OCO—和—COO—；“q”是1或更多的整数；当“q”是2或更多的整数时，R9是氢或具有1个或更多碳原子的有机基团，并且可以相同或不同；当R0是单键时，R1到R8中至少有一个是具有脂环结构的基团；当R0具有以下结构的化合物（2）时，R1到R9中至少有一个是具有脂环结构的基团；“*”和“**”表示要与不同化学结构结合的位置。
• Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device
  申请人：Enoki Takashi

  公开号：US20080206548A1

  公开（公告）日：2008-08-28

  A benzoxazole resin precursor comprising a first repeating unit which is obtained by the reaction of a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has the diamondoid structure; a benzoxazole resin precursor further comprising a second repeating unit which is obtained by the reaction of a bisaminophenol compound having no diamondoid structure and a dicarboxylic acid compound having no diamondoid structure; a polybenzoxazole resin obtained by the ring-closing reaction with dehydration of the above benzoxazole resin precursor; a resin film constituted with the benzoxazole resin precursor or the polybenzoxazole resin. A polybenzoxazole resin and a resin film having excellent heat resistance and a small permittivity and a semiconductor device using the resin film can be obtained from the benzoxazole resin precursor.

  一种苯并噁唑树脂前体，包括第一重复单元，该单元由双氨基酚化合物和二羧酸化合物反应得到，其中至少一个具有金刚烷结构；一种苯并噁唑树脂前体，进一步包括第二重复单元，该单元由不具有金刚烷结构的双氨基酚化合物和不具有金刚烷结构的二羧酸化合物反应得到；通过上述苯并噁唑树脂前体的环合反应和脱水反应得到的聚苯并噁唑树脂；由苯并噁唑树脂前体或聚苯并噁唑树脂构成的树脂膜。可以从苯并噁唑树脂前体中获得具有优异耐热性和小介电常数的聚苯并噁唑树脂和树脂膜，以及使用树脂膜的半导体器件。
• Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same
  申请人：Enoki Takashi

  公开号：US20080255335A1

  公开（公告）日：2008-10-16

  A resin composition having high heat resistance and low dielectric constant after heat treatment, a varnish thereof and a semiconductor device using the same are provided by a resin composition including a compound having a structure represented by the general formula (1): wherein, “Ar” is an aromatic group; “a” is 0 or 1; R 11 is an organic group having one or more carbon atoms and at least one is a group having an alicyclic structure; when “q” is an integer of 2 or more, R 11 s may be the same or different from each other; at least one of R 1 to R 5 and at least one of R 6 to R 10 on respective benzene rings are Ar-binding sites or R 11 -binding sites and the others of R 1 to R 5 and R 6 to R 10 are each hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms, a hydroxyl group or a carboxyl group; when “a” is 0, at least one of R 1 to R 5 and R 6 to R 10 is a group having an alicyclic structure; “q” is an integer of 1 or more; and “X” is any of —O—, —NHCO—, —COHN—, —COO— and —OCO—.

  提供一种高热稳定性和低介电常数的树脂组合物，其在热处理后具有高热稳定性和低介电常数，以及其清漆和半导体器件。该树脂组合物包括具有以下通式（1）所表示结构的化合物：其中，“Ar”为芳香族基；“a”为0或1；R11为具有一个或多个碳原子的有机基，至少有一个是具有脂环结构的基团；当“q”为2或更多的整数时，R11可以相同或不同；R1至R5中的至少一个和R6至R10中的至少一个在各自的苯环上是Ar结合位点或R11结合位点，而R1至R5和R6至R10中的其他部分分别是氢、具有脂环结构的基团、具有1至10个碳原子的有机基、羟基或羧基；当“a”为0时，R1至R5和R6至R10中的至少一个是具有脂环结构的基团；“q”为1或更多的整数；而“X”为—O—、—NHCO—、—COHN—、—COO—和—OCO—中的任意一种。
• Resin Composition, Varnish, Resin Film and Semiconductor Device
  申请人：Enoki Takashi

  公开号：US20090214860A1

  公开（公告）日：2009-08-27

  Disclosed is a resin composition comprising a benzoxazole resin precursor having a first repeating unit obtained by reacting a bisaminophenol compound and a dicarboxylic acid compound, and a cross-linking agent wherein at least one of the bisaminophenol compound and the dicarboxylic acid compound has a diamondoid structure. The benzoxazole resin precursor further comprises a second repeating unit obtained by reacting a bisaminophenol compound not having a diamondoid structure and a dicarboxylic acid compound not having a diamondoid structure. Also disclosed is a resin film comprising the resin composition.

  本发明公开了一种树脂组合物，包括一种苯并噁唑树脂前体，其具有通过反应双氨基酚化合物和二羧酸化合物得到的第一重复单元，以及交联剂，其中双氨基酚化合物和/或二羧酸化合物中至少有一个具有金刚烷结构。苯并噁唑树脂前体还包括通过反应不具有金刚烷结构的双氨基酚化合物和不具有金刚烷结构的二羧酸化合物得到的第二重复单元。此外，本发明还公开了一种包括该树脂组合物的树脂膜。
• 5-(4-ethynylophenoxy)isophthalic chloride
  申请人：The United States of America as represented by the Administrator of the

  公开号：US04622182A1

  公开（公告）日：1986-11-11

  Sulfone-ester polymers containing pendent ethynyl groups and a direct and multi-step process for preparing same are disclosed. The multi-step process involves the conversion of a pendent bromo group to the ethynyl group while the direct route involves reacting hydroxy-terminated sulfone oligomer or polymers with a stoichiometric amount of 5-(4-ethynylphenoxy)isophthaloyl chloride. The 5-(4-ethynylphenoxy)isophthaloyl chloride and process for preparing same are also disclosed.

  本发明揭示了含有侧链乙炔基的磺酮酯聚合物以及制备它们的直接和多步骤过程。多步骤过程涉及将侧链溴基转化为乙炔基，而直接路线涉及将羟基终止的磺酮寡聚物或聚合物与等量的5-(4-乙炔基苯氧基)异苯二甲酰氯反应。本发明还揭示了5-(4-乙炔基苯氧基)异苯二甲酰氯及其制备方法。