This invention relates to a curable resin composition which shows excellent chemical resistance, dielectric characteristics, heat resistance, flame retardancy and mechanical properties and low water absorption and is suitable for dielectric materials, insulating materials, heat-resistant materials, structural materials and the like. This curable resin composition comprises component (A) or polyphenylene ether resin and component (B) or a solvent-soluble polyfunctional vinyl aromatic copolymer having constitutional units derived from monomers composed of divinyl aromatic compound (a) and monovinyl aromatic compound (b) or, more particularly, having 20 mol % or more of a repeating unit derived from divinyl aromatic compound (a) and constitutional units represented by the following formulas (2) and (3)
wherein R
5
represents an aromatic hydrocarbon group containing 6-30 carbon atoms, Y represents an aliphatic hydrocarbon group, an aromatic hydrocarbon group or an unsubstituted or substituted aromatic ring condensed with the benzene ring of the indane ring and n is an integer of 0-4.
本发明涉及一种可固化
树脂组合物,该组合物具有优异的耐
化学性、绝缘性、耐热性、阻燃性和机械性能,且吸
水性低,适用于绝缘材料、绝缘材料、耐热材料、结构材料等。这种可固化
树脂组合物由组分(A)或聚苯醚
树脂和组分(B)或溶剂可溶的多官能度
乙烯基芳香族共聚物组成,该共聚物具有由二
乙烯基芳香族化合物(a)和单
乙烯基芳香族化合物(b)组成的单体衍生出的构型单元,或者更具体地说,具有 20 摩尔%或更多的由二
乙烯基芳香族化合物(a)衍生出的重复单元和由以下公式(2)和(3)表示的构型单元
其中 R
5
代表含有 6-30 个碳原子的
芳香烃基团,Y 代表脂肪烃基团、
芳香烃基团或与
茚环的苯环缩合的未取代或取代的芳香环,n 为 0-4 的整数。