1-Methyl-4-[4-(4-phenoxyphenyl)sulfonylphenoxy]benzene

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 1-Methyl-4-[4-(4-phenoxyphenyl)sulfonylphenoxy]benzene
• 化学式: C₂₅H₂₀O₄S
• 分子量: 416.5
• InChiKey: MTCCIMLRPOQLQF-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.1
• 重原子数：
  30
• 可旋转键数：
  6
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.04
• 拓扑面积：
  61
• 氢给体数：
  0
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  1-Methyl-4-[4-(4-phenoxyphenyl)sulfonylphenoxy]benzene 以90%的产率得到
  参考文献：
  名称：

  MOSKVICHEV YU. A.; KRAMEROVA S. K.; BELYSHEVA M. S.; MIRONOV G. S.; ALOV +, ZH. PRIKL. XIMII, 1980, 53, HO 3, 706-709

  摘要：

  DOI：
• 作为产物：
  描述：

  sodium 4-methylphenoxide 、 4'-Chlor-4-phenoxy-diphenylsulfon 以84%的产率得到
  参考文献：
  名称：

  MOSKVICHEV YU. A.; KRAMEROVA S. K.; BELYSHEVA M. S.; MIRONOV G. S.; ALOV +, ZH. PRIKL. XIMII, 1980, 53, HO 3, 706-709

  摘要：

  DOI：

文献信息

• CIRCUIT MATERIAL AND CIRCUIT BOARD CONTAINING THE SAME
  申请人：Shengyi Technology Co., Ltd.

  公开号：EP3889233A1

  公开（公告）日：2021-10-06

  The present application provides a circuit material and a circuit board containing the same. The circuit material comprises a conductive metal layer and a dielectric substrate layer, and an adhesive layer arranged therebetween, wherein the adhesive layer is made of a material which comprises an adhesive composition comprising a resin component and a non-resin component, wherein the resin component is composed of unsaturated polyphenylene ether resin, SBS resin and maleimide resin; and the non-resin component comprises an initiator; and the adhesive layer is obtained by applying the adhesive composition dissolved in a solvent onto the surface of the conductive metal layer or the dielectric substrate layer in the form of a solution, or by applying to a release material and removing the release material after partially curing or completely curing.

  本申请提供了一种电路材料和含有这种材料的电路板。电路材料包括导电金属层和电介质基板层，以及布置在其间的粘合剂层，其中粘合剂层由一种材料制成，该材料包括由树脂成分和非树脂成分组成的粘合剂组合物，其中树脂成分由不饱和聚苯醚树脂、SBS 树脂和马来酰亚胺树脂组成；粘合剂层是通过将溶解在溶剂中的粘合剂组合物以溶液的形式涂抹在导电金属层或电介质基底层的表面，或涂抹在脱模材料上，并在部分固化或完全固化后去除脱模材料而得到的。
• POLYIMIDE POLYMERS FOR FLEXIBLE ELECTRICAL DEVICE SUBSTRATE MATERIALS AND FLEXIBLE ELECTRICAL DEVICES COMPRISING THE SAME
  申请人：Tseng Chi-Fu

  公开号：US20110155235A1

  公开（公告）日：2011-06-30

  A polyimide polymer of Formula (I) for flexible electrical device substrate material is provided. In Formula (I), B is a polycyclic aliphatic group, A is an aromatic group containing at least one ether bond, A′ is an aromatic or aliphatic group, and 1≦n/m≦4. The invention also provides a flexible electrical device including the polyimide polymer.
• METHOD FOR FABRICATING FLEXIBLE ELECTRICAL DEVICES
  申请人：Industrial Technology Research Institute

  公开号：US20130267061A1

  公开（公告）日：2013-10-10

  A method for fabricating a flexible electrical device is provided. The method includes providing a first substrate, providing a second substrate opposed to the first substrate, wherein one of the first and second substrates includes a polyimide polymer of Formula (I) wherein B is a polycyclic aliphatic group, A is an aromatic group containing at least one ether bond, A′ is an aromatic or aliphatic group, and 1≦n/m≦4, directly fabricating a thin film transistor (TFT) on one of the first and second substrates which includes the polyimide polymer of Formula (I), and disposing a medium layer between the first substrate and the second substrate.
• US9209403B2
  申请人：——

  公开号：US9209403B2

  公开（公告）日：2015-12-08
• US9553326B2
  申请人：——

  公开号：US9553326B2

  公开（公告）日：2017-01-24