Naphthalin-1,2,4,5-tetracarbonsaeure | 22246-61-3

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: Naphthalin-1,2,4,5-tetracarbonsaeure
• 英文别名: naphthalene-1,2,4,5-tetracarboxylic acid；1,2,4,5-naphthalene tetracarboxylic acid；1,2,4,5-Naphthalenetetracarboxylic acid
• CAS: 22246-61-3
• 化学式: C₁₄H₈O₈
• 分子量: 304.213
• InChiKey: KADGVXXDDWDKBX-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.3
• 重原子数：
  22
• 可旋转键数：
  4
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  149
• 氢给体数：
  4
• 氢受体数：
  8

反应信息

• 作为反应物：
  描述：

  Naphthalin-1,2,4,5-tetracarbonsaeure 在 乙酸酐 、 溶剂黄146 作用下， 生成 naphthalene-1,2,4,5-tetracarboxylic acid-1,2;4,5-dianhydride
  参考文献：
  名称：

  Inter- and Intramolecular Acylations with Hydrogen Fluoride

  摘要：

  DOI：

  10.1021/ja01874a079
• 作为产物：
  描述：

  2-acetyl-naphthalene-1,4,5-tricarboxylic acid 在 alkaline aqueous sodium hypochlorite 作用下， 生成 Naphthalin-1,2,4,5-tetracarbonsaeure
  参考文献：
  名称：

  Inter- and Intramolecular Acylations with Hydrogen Fluoride

  摘要：

  DOI：

  10.1021/ja01874a079

文献信息

• METHOD FOR PRODUCING CARBOXYLIC ACID ANHYDRIDE, METHOD FOR PRODUCING CARBOXYLIC IMIDE, AND METHOD FOR MANUFACTURING ELECTROPHOTOGRAPHIC PHOTOSENSITIVE MEMBER
  申请人：CANON KABUSHIKI KAISHA

  公开号：US20160376285A1

  公开（公告）日：2016-12-29

  A method for producing a carboxylic acid anhydride includes heating a composition containing a specific compound in a solvent to yield the carboxylic acid anhydride. The solvent is an aprotic polar solvent having a boiling point of 50° C. or more.

  生产羧酸酐的方法包括加热含有特定化合物的溶剂中的混合物，以产生羧酸酐。该溶剂是具有沸点为50°C或更高的无水极性溶剂。
• Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof
  申请人：Okada Koji

  公开号：US20060199920A1

  公开（公告）日：2006-09-07

  A photosensitive resin composition according to the present invention includes at least a base resin component (A) and a (meth)acryls compound (B), wherein the base resin component (A) is any one of: a polyimide resin (A-1) having at least either a hydroxyl group or a carboxyl group in its structure; a polyamide resin (A-2) having at least either a hydroxyl group or a carboxyl group in its structure; and photosensitive imide(meth)acrylsiloxaneoligomer (A-3). On this account, it is possible to realize characteristics such as (1) realization and improvement of water system developing property, (2) improvement of utility as an imidized film, (3) improvement of post-curing property, and (4) simplification of manufacture of a print wiring substrate. Thus, the photosensitive resin composition can be favorably used particularly in a photosensitive dry film resin, a laminate using the same, a print wiring substrate using the same, and the like.

  本发明提供的一种光敏树脂组合物包括至少一种基础树脂组分(A)和一种（甲基）丙烯酸化合物(B)，其中基础树脂组分(A)是以下任何一种：具有至少一个羟基或羧基的聚酰亚胺树脂(A-1)；具有至少一个羟基或羧基的聚酰胺树脂(A-2)；和光敏亚胺（甲基）丙烯酰基硅氧烷低聚物(A-3)。因此，可以实现特性，例如(1)实现和改善水系开发性能，(2)改善作为亚胺化膜的实用性，(3)改善后固化性能，以及(4)简化印刷线路基板的制造。因此，该光敏树脂组合物可以特别有利地用于光敏干膜树脂、使用相同的层压板、使用相同的印刷线路基板等。
• Aromatic polyamic acid and polyimide
  申请人：Wang Hongyuan

  公开号：US20070149758A1

  公开（公告）日：2007-06-28

  The present invention relates to an aromatic polyimide which has excellent heat resistance and excellent thermal dimensional stability, and which realizes low hygroscopic property, and an aromatic polyamic acid as a precursor for the aromatic polyimide. Provided are an aromatic polyamic acid including a structural unit represented by the following general formula (1), and an aromatic polyimide obtained by imidating the aromatic polyamic acid. The aromatic polyamic acid or the aromatic polyimide can be a copolymerization-type aromatic polyamic acid or aromatic polyimide having another structural unit: where, Ar 1 represents a tetravalent organic group produced from a tetracarboxylic acid having one or more aromatic rings, and R represents a hydrocarbon having 2 to 6 carbon atoms.

  本发明涉及一种具有优异耐热性和优异热尺寸稳定性的芳香族聚酰亚胺，实现低吸湿性能，并提供作为该芳香族聚酰亚胺前体的芳香族聚酰胺。提供了一种包括下述一般式（1）所表示的结构单元的芳香族聚酰胺和通过对芳香族聚酰胺进行酰亚胺化而得到的芳香族聚酰亚胺。芳香族聚酰胺或芳香族聚酰亚胺可以是具有另一种结构单元的共聚型芳香族聚酰胺或芳香族聚酰亚胺：其中，Ar1表示由具有一个或多个芳环的四羧酸产生的四价有机基团，而R表示具有2至6个碳原子的碳氢化合物。
• FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING SAME
  申请人：Masuko Takashi

  公开号：US20100239858A1

  公开（公告）日：2010-09-23

  An object of the present invention is to provide a film-like adhesive capable of achieving a superior combination of processability and reflow resistance. A film-like adhesive of the present invention is used for bonding a semiconductor element to an adherend, and includes an adhesive layer comprising at least one resin selected from the group consisting of polyurethaneimide resins, polyurethaneamideimide resins and polyurethaneimide-polyurethaneamideimide resins.

  本发明的目的是提供一种类似于薄膜的粘合剂，能够实现优秀的加工性和回流抗性的组合。本发明的类似于薄膜的粘合剂用于将半导体元件粘合到粘合体上，包括一个粘合层，该粘合层包括至少一种树脂，所述树脂从聚氨酯酰亚胺树脂、聚氨酯酰胺酰亚胺树脂和聚氨酯酰亚胺-聚氨酯酰胺酰亚胺树脂组成的群体中选出。
• CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE OF CIRCUIT MEMBER
  申请人：Arifuku Motohiro

  公开号：US20100243303A1

  公开（公告）日：2010-09-30

  The present invention provides a circuit connecting material for electrically connecting a first circuit member having a first circuit electrode formed on a major surface of a first circuit substrate, and a second circuit member having a second circuit electrode formed on a major surface of a second circuit substrate, with the first and the second circuit electrodes opposed to each other, comprising an adhesive component containing a fluorine-containing organic compound, wherein the adhesive component contains 0.10% or less by mass of a silicon-containing compound, in terms of silicon atoms, based on the total amount of the adhesive component.

  本发明提供了一种电路连接材料，用于电性连接第一电路基板的主表面上形成有第一电路电极的第一电路部件和第二电路基板的主表面上形成有第二电路电极的第二电路部件，其中第一和第二电路电极相对，包括含有含氟有机化合物的粘合剂组分，其中粘合剂组分在总量的基础上，含有的含硅化合物质量分数不超过0.10%。