Curable resinous composition comprising epoxy resin and silicon-containing elastomeric polymer
申请人:Kanegafuchi Chemical Industry Co., Ltd.
公开号:EP0186191A2
公开(公告)日:1986-07-02
A curable resinous composition comprising:
(A) an organic elastomeric polymer having at least one silicon-containing reactive group in a molecule,
(B) an epoxy resin,
(C) a silicone compound having a silicon-containing group and a functional group reactive with an epoxy group, and
(D) a curing agent for the epoxy resin, wherein said silicon-containing reactive group is a group of the formula:
wherein X is a hydroxyl group or a hydrolyzable group, R1 is a monovalent hydrocarbon group having 1 to 20 carbon atoms or an organosiloxy group, "a" is 0, 1, 2 or 3, "b" is 0, 1 or 2 provided that the total of "a" and "b" is at least 1, and "m" is 0 or an integer of 1 to 18, a weight ratio of (A) to (B) being from 1:100 to 100:1 and a weight ratio of (A) + (B) to (C) being from 100:0.1 to 100:20.
可固化树脂组合物,包括
(A) 分子中含有至少一个含硅活性基团的有机弹性聚合物、
(B) 环氧树脂
(C) 具有一个含硅基团和一个与环氧基团反应的官能团的有机硅化合物,以及
(D) 用于环氧树脂的固化剂,其中所述含硅活性基团是式中的基团:
其中 X 为羟基或可水解基团,R1 为具有 1 至 20 个碳原子的一价烃基或有机硅氧基,"a "为 0、1、2 或 3,"b "为 0、1 或 2,条件是 "a "和 "b "的总和至少为 1,以及 "m "为 0 或 1 至 18 的整数,(A)与(B)的重量比为 1:100至100:1,(A)+(B)至(C)的重量比为100:0.1 至 100:20。