Thermosetting compositions based on polyarylacetylenes and substituted polyphenylene oxides and resins obtained by curing them
申请人:HERCULES INCORPORATED
公开号:EP0000385A1
公开(公告)日:1979-01-24
This invention relates to poly(arylacetylene) thermosetting compositions and thermoset resins prepared therefrom. The thermosetting compositions comprise a poly-(phenylene oxide) and a polycetylenically unsaturated prepolymer of a polyacetylenically substituted aromatic compound such as diethynylbenzene. The prepolymer has a number average molecular weight of about 900 to about 12,000 and contains from about 5 to about 20% by weight of terminal acetylenic groups. A representative poly(phenylene oxide) is poly-(2,6-dimethyl-1,4-phenylene oxide).
Oligomer coated electronic circuit component and method of coating
申请人:International Business Machines
Corporation
公开号:EP0095048A2
公开(公告)日:1983-11-30
An electronic circuit having an electrically conductive pattern formed on a substrate (1) and having on at least one surface of the substrate a film (5) obtained from a soluble polymerizable oligomer of the formula:
wherein D is
wherein M is -C.C-, -C≡C-C≡C-. -0-.
wherein R is an alkyl or aromatic group; wherein A is an aromatic group; wherein x is the number of appendant acetylenic groups and is an integer greater than two but less than 30, z is either zero or an integer, and y is an integer with the sum of y and z equal to x; and wherein n is an integer from 1 to 10. The substrate is coated by applying the above composition to the substrate and then hardening the composition by further polymerization. Preferred compositions contain the above described oligomer and certain plasticizers and/or toughening agents.
一种电子电路,其导电图案形成于基板(1)上,并在基板的至少一个表面上具有由式中可溶聚合低聚物获得的薄膜(5):
其中 D 为
其中 M 是 -C.C-,-C≡C-C≡C-。-0-.
其中 R 是烷基或芳香基团;其中 A 是芳香基团;其中 x 是附属乙炔基团的数目,并且是大于 2 但小于 30 的整数,z 是零或整数,y 是 y 与 z 之和等于 x 的整数;以及其中 n 是 1 至 10 的整数。将上述组合物涂在基底上,然后通过进一步聚合使组合物硬化,从而涂覆基底。优选的组合物含有上述低聚物和某些增塑剂和/或增韧剂。