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6,6'-diamino-3,3'-oxy-bis-benzenethiol | 24019-30-5

中文名称
——
中文别名
——
英文名称
6,6'-diamino-3,3'-oxy-bis-benzenethiol
英文别名
3,3'-Dimercapto-4,4'-diaminodiphenyl ether;2-amino-5-(4-amino-3-sulfanylphenoxy)benzenethiol
6,6'-diamino-3,3'-oxy-bis-benzenethiol化学式
CAS
24019-30-5
化学式
C12H12N2OS2
mdl
——
分子量
264.372
InChiKey
AQFWIZKIYOMJED-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

物化性质

  • 沸点:
    462.4±45.0 °C(Predicted)
  • 密度:
    1.392±0.06 g/cm3(Predicted)

计算性质

  • 辛醇/水分配系数(LogP):
    2.4
  • 重原子数:
    17
  • 可旋转键数:
    2
  • 环数:
    2.0
  • sp3杂化的碳原子比例:
    0.0
  • 拓扑面积:
    63.3
  • 氢给体数:
    4
  • 氢受体数:
    5

反应信息

点击查看最新优质反应信息

文献信息

  • RESIN COMPOSITION AND SEMICONDUCTOR DEVICE BOARD
    申请人:Osaku Yumi
    公开号:US20140087136A1
    公开(公告)日:2014-03-27
    A resin composition which contains a binder resin (A), radiation-sensitive compound (B), silane-modified resin (C), and antioxidant (D), wherein a content of the silane-modified resin (C) is 0.1 to 150 parts by weight with respect to 100 parts by weight of the binder resin (A), a content of the antioxidant (D) is 0.1 to 10 parts by weight with respect to 100 parts by weight of the binder resin (A), and an amount of warping is 14 μm or less when using the resin composition to form a thickness 2 to 3 μm resin film and baking the formed resin film at 230° C. is provided.
    一种树脂组合物,包含粘合剂树脂(A),辐射敏感化合物(B),硅改性树脂(C)和抗氧化剂(D),其中硅改性树脂(C)的含量相对于100份粘合剂树脂(A)为0.1至150份重量,抗氧化剂(D)的含量相对于100份粘合剂树脂(A)为0.1至10份重量,并且使用该树脂组合物形成2至3μm厚度的树脂膜并在230°C下烘烤形成的树脂膜翘曲量为14μm或以下。
  • Positive photosensitive polyimide resin composition
    申请人:NISSAN CHEMICAL INDUSTRIES LTD.
    公开号:EP0424940A2
    公开(公告)日:1991-05-02
    A positive photosensitive polyimide resin composition which comprises 100 parts by weight of an organic solvent-soluble polyimide resin and 1-100 parts by weight of an ο-quinonediazide compound, said polyimide resin being composed of the repeating units represented by formulas [I] and [II] below (where R₁ is a divalent organic group to constitute a diamine which has one or more groups of at least one kind selected from the group consisting of phenolic hydroxyl group, carboxyl group, thiophenol group, and sulfonic group; R₃ is a divalent organic group having no phenolic hydroxyl group, carboxyl group, thiophenol group, and sulfonic group; and R₂ and R₄ each are a tetravalent organic group constituting a tetracarboxylic acid and a derivative thereof when R₁ has one or more groups of at least one kind selected from the group consisting of carboxyl group and sulfonic group and has no phenolic hydroxyl group and thiophenol group, or R₂ and R₄ each are a tetravalent organic group constituting a tetracarboxylic acid and a derivative thereof composed of four carbonyl groups which are not attached directly to the aromatic ring when R₁ has a phenolic hydroxyl group and/or thiophenol group) with the molar percentage (a) of the repeating units represented by formula [I] being in the range of 1 mol% ≦ a ≦ 90 mol% and the molar percentage (b) of the repeating units represented by formula [II] being in the range of 10 mol% ≦ b ≦ 99 mol%, and having a reduced viscosity of 0.05-3.0 dℓ/g (measured at a concentration of 0.5 g/ℓ in N-methylpyrrolidone at 30°C).
    一种正性光敏聚酰亚胺树脂组合物,它由重量份数为 100 份的有机溶剂溶性聚酰亚胺树脂和重量份数为 1-100 份的ο-醌噻嗪化合物组成,所述聚酰亚胺树脂由以下式[I]和[II]所代表的重复单元组成 (其中,R₁ 是二价有机基团,以构成二元胺,该二元胺具有一个或多个至少选自酚羟基、羧基、噻吩酚基和磺酸基的基团;R₃ 是不含酚羟基、羧基、噻吩酚基和磺酸基的二价有机基团;和 R₂ 和 R₄ 分别是构成四羧酸及其衍生物的四价有机基团,当 R₁ 具有至少一种选自羧基和磺酰基的一个或多个基团,且不具有酚羟基和噻吩酚基时、或 R₂ 和 R₄ 各为构成四羧酸的四价有机基团及其衍生物,当 R₁ 具有酚羟基和/或噻吩酚基时,由四个不直接连接到芳香环上的羰基组成。) 由式[I]代表的重复单元的摩尔百分比(a)在 1 mol% ≦ a ≦ 90 mol% 的范围内,由式[II]代表的重复单元的摩尔百分比(b)在 10 mol% ≦ b ≦ 99 mol% 的范围内,且具有 0.05-3.0dℓ/g(在N-甲基吡咯烷酮中浓度为0.5g/ℓ,温度为30℃时测量)。
  • POSITIVE TYPE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION
    申请人:Nissan Chemical Industries, Ltd.
    公开号:EP1241527A1
    公开(公告)日:2002-09-18
    A positive type photosensitive resin composition which can be developed by an aqueous alkaline solution and which is excellent in the developability and the adhesion to a substrate, is presented. Namely, the present invention presents a positive type photosensitive polyimide resin composition characterized by comprising 100 parts by weight of a solvent-soluble polyimide having repeating units represented by the formula (1) and from 1 to 50 parts by weight of a polyimide precursor having repeating units represented by the formula (2), and by further containing an o-quinonediazide compound in an amount of from 1 to 100 parts by weight per 100 parts by weight of the total amount of the repeating units represented by the formula (1) and the repeating units represented by the formula (2): (wherein R1 and R3 are bivalent organic groups, from 1 to 90 mol% of R1 is a bivalent organic group having one or plural groups of at least one type selected from the group consisting of a phenolic hydroxyl group, a carboxyl group, a thiophenol group and a sulfonic group, and from 10 to 99 mol% is a bivalent organic group having no phenolic hydroxyl, carboxylic, thiophenol or sulfonic group, and R2 and R4 are tetravalent organic groups constituting a tetracarboxylic acid or its derivative).
    本发明提出了一种正型感光树脂组合物,它可以用碱性水溶液显影,并且在显影性和对基底的附着力方面都很出色。即,本发明提出了一种正型感光聚酰亚胺树脂组合物,其特征是含有 100 重量份的具有式(1)所代表重复单元的溶剂可溶性聚酰亚胺和 1 至 50 重量份的具有式(2)所代表重复单元的聚酰亚胺前体、并进一步含有邻醌噻嗪化合物,其用量为式(1)代表的重复单元和式(2)代表的重复单元总量的 1 至 100 份(重量比): (其中 R1 和 R3 为二价有机基团,1-90 摩尔%的 R1 为二价有机基团,该二价有机基团具有一个或多个至少一种类型的基团,该基团选自由酚羟基、羧基、噻吩酚基团和噻吩酚基团组成的组、R2和R4是构成四羧酸或其衍生物的四价有机基团)。
  • POSITIVE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION
    申请人:Nissan Chemical Industries, Ltd.
    公开号:EP1329769A1
    公开(公告)日:2003-07-23
    A novel positive photosensitive resin composition is presented by improving the water repellency at the surface and imparting additional functions to a positive photosensitive resin which can be developed by an alkali aqueous solution and which is excellent in sensitivity and developability, while maintaining such properties. The positive photosensitive polyimide resin composition comprises (a) a solvent-soluble polyimide wherein from 1 to 100 mol% of a bivalent organic group constituting a diamine, has one or more of at least one group selected from the group consisting of a phenolic hydroxyl group, a carboxyl group, a thiophenol group and a sulfonic group, and the reduced viscosity is from 0.05 to 5.0 dl/g (at a concentration of 0.5 g/dl in N-methyl pyrrolidone at a temperature of 30°C), (b) a photosensitive orthoquinonediazide compound, and (c1) a solvent-soluble polyimide wherein from 1 to 100 mol% of a bivalent organic group constituting a diamine, has one or more of at least one group selected from the group consisting of a long chain alkyl group having at least 6 carbon atoms and a fluorinated alkyl group, and the reduced viscosity is from 0.05 to 5.0 dl/g (at a concentration of 0.5g/dl in N-methylpyrrolidone at a temperature of 30°C) or (c2) a polyamic acid wherein from 1 to 100 mol% of a bivalent organic group constituting a diamine, has one or more of at least one group selected from the group consisting of a long chain alkyl having at least 6 carbon atoms and a fluorinated alkyl group, and the reduced viscosity is from 0.05 to 5.0 dl/g (at a concentration of 0.5 g/dl in N-methylpyrrolidone at a temperature of 30°C), wherein component [c1] or component [c2] is from 0.1 to 50 wt%, based on the total weight of all polymers.
    本发明提出了一种新型正性光敏树脂组合物,它通过改善正性光敏树脂表面的憎水性和赋予其附加功能,使其可以用碱水溶液显影,并在保持这些特性的同时,具有优异的灵敏度和显影性。 正性感光聚酰亚胺树脂组合物包括 (a) 溶剂可溶聚酰亚胺,其中 1 至 100 摩尔%的二价有机基团构成二胺,具有一个或多个至少选自酚羟基、羧基、噻吩酚基和磺酸基组成的基团,还原粘度为 0.05 至 5.0 dl/g(在浓度为 0.5克/分升(在N-甲基吡咯烷酮中,温度为30℃),(b)一种光敏原醌噻嗪化合物,和(c1)一种溶剂溶性聚酰亚胺,其中构成二胺的1至100摩尔%的二价有机基团,具有一个或多个至少一个选自至少有6个碳原子的长链烷基和氟化烷基的基团,且降低的粘度为0.05 至 5.0 分升/克(在 N-甲基吡咯烷酮中的浓度为 0.5 克/分升,温度为 30℃)或 (c2) 聚酰胺酸,其中构成二胺的 1 至 100 摩尔%的二价有机基团具有一个或多个选 自至少具有 6 个碳原子的长链烷基和氟化烷基组成的组中的至少一个基团,且降粘 度为 0.05至5.0分升/克(在N-甲基吡咯烷酮中浓度为0.5克/分升,温度为30℃时),其中组分[c1]或组分[c2]占所有聚合物总重量的0.1至50重量%。
  • POLYBENZAZOLE COMPOUND HAVING SULFO GROUP AND/OR PHOSPHONO GROUP, RESIN COMPOSITION CONTAINING THE SAME, MOLDED RESIN, SOLID POLYMER ELECTROLYTE FILM, SOLID ELECTROLYTE FILM/ELECTRODE CATALYST LAYER COMPOSITE, AND PROCESS FOR PRODUCING THE COMPOSITE
    申请人:Toyo Boseki Kabushiki Kaisha
    公开号:EP1354907A1
    公开(公告)日:2003-10-22
    An object of the present invention is to obtain a novel polymeric material capable of forming a solid polymer electrolyte excellent not only in processability, solvent resistance and durability/stability but also in ion conductivity by introducing sulfonic acid group or phosphonic acid group into a polybenzazole compound having excellent properties in view of heat resistance, solvent resistance, mechanical characteristics and the like. Means attaining the object of the present invention is a polybenzazole compound including an aromatic dicarboxylic acid bond unit having sulfonic acid group and/or phosphonic acid group and satisfying either a condition that inherent viscosity measured in concentrated sulfuric acid is in the range of 0.25 to 10 dl/g or a condition that inherent viscosity measured in a methanesulfonic acid solution is in the range of 0.1 to 50 dl/g. The object of the present invention can be attained also by a resin composition containing the aforementioned polybenzazole compound, a resin molding, a solid polymer electrolyte membrane, a solid polymer electrolyte membrane/electrode assembly and a method of preparing the solid polymer electrolyte membrane/electrode assembly.
    本发明的目的是通过在具有优异耐热性、耐溶剂性、机械特性等特性的聚苯唑化合物中引入磺酸基团或膦酸基团,获得一种新型聚合物材料,这种材料不仅在加工性、耐溶剂性和耐久性/稳定性方面优异,而且在离子传导性方面也优异,能够形成固体聚合物电解质。 实现本发明目的的手段是一种聚苯唑化合物,包括具有磺酸基和/或膦酸基的芳香族二 羧酸键单元,并满足在浓硫酸中测得的固有粘度在 0.25 至 10 分升/克范围内或在甲磺酸溶液 中测得的固有粘度在 0.1 至 50 分升/克范围内的条件。 含有上述聚苯唑化合物的树脂组合物、树脂成型、固体聚合物电解质膜、固体聚合物电解质膜/电极组件和固体聚合物电解质膜/电极组件的制备方法也可实现本发明的目的。
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