Latent curing agents, epoxy resin compositions containing the same, sealing materials, and organic EL displays
申请人:Tamatani Hiroaki
公开号:US08466238B2
公开(公告)日:2013-06-18
The invention aims to provide latent curing agents which exert high low-temperature curing properties when used together with ionically polymerizable compounds and which exhibit high storage stability at room temperature. Latent curing agents for ionically polymerizable compounds which agents each contain a hydroxyl-free amine imide compound having an N—N bond energy of 100 to 210 kJ/mol as determined by B3LYP functional theory method.
该发明旨在提供潜在的固化剂,当与离子聚合化合物一起使用时,这些固化剂具有高低温固化性能,并在常温下表现出高储存稳定性。离子聚合化合物的潜在固化剂,每个固化剂都含有一种不含羟基的胺亚酰化合物,其N-N键能为100至210 kJ/mol,由B3LYP功能理论方法确定。