申请人:SHIN-ETSU CHEMICAL CO., LTD.
公开号:US20220214617A1
公开(公告)日:2022-07-07
A material for forming organic film contains (A) compound shown by general formula (1) and/or polymer having repeating unit shown by general formula (4), and (B) organic solvent. In formula (1), AR1, AR2, AR3, AR4, AR5, and AR6 each represent benzene ring or naphthalene ring; R1 represents any group shown in following formula (2); “n” represents integer of 1 or 2; and W represents divalent organic group having 2-50 carbon atoms. In formula (4), AR1, AR2, AR3, AR4, AR5, AR6, R1, “n”, and W are as defined above; and R2 and R3 each represent hydrogen atom or organic group having 1-20 carbon atoms, and optionally bond to each other within molecule to form cyclic organic group. An object provides a material for forming organic film to enable high etching resistance and excellent twisting resistance without impairing resin-derived carbon content; and compound and polymer suitable for material for forming organic film.
一种用于形成有机薄膜的材料包含(A)通式(1)所示的化合物和/或具有通式(4)所示的重复单元的聚合物,以及(B)有机溶剂。在公式(1)中,AR1、AR2、AR3、AR4、AR5和AR6各代表苯环或萘环;R1代表以下公式(2)中显示的任何基团;“n”表示1或2的整数;W代表具有2-50个碳原子的二价有机基团。在公式(4)中,AR1、AR2、AR3、AR4、AR5、AR6、R1、“n”和W如上所定义;R2和R3各代表氢原子或具有1-20个碳原子的有机基团,并且可选择在分子内彼此结合形成环状有机基团。本发明提供了一种用于形成有机薄膜的材料,以实现高蚀刻抗性和优异的扭曲抗性,而不损害树脂衍生的碳含量;以及适用于形成有机薄膜的化合物和聚合物。