A paste composition which comprises as essential ingredients (A) a thermoplastic resin, (B) an epoxy resin, (C) a coupling agent, (D) a powdery inorganic filler, (E) a powder having rubber elasticity and (F) an organic solvent and which, when applied and dried, gives a coating film having a void content of 3 % by volume or higher and a water vapor permeability as measured at 40°C and 90 %RH of 500 g/m2·24h or less; a protective film which is formed by applying the paste composition to a surface of a semiconductor part and drying it and has a void content of 3 % by volume or higher and a water vapor permeability as measured at 40°C and 90 %RH of 500 g/m2·24h or less; and a semiconductor device having the protective film.
一种糊状组合物,其基本成分包括:(A) 热塑性
树脂;(B) 环氧
树脂;(C)
偶联剂;(D) 粉末状无机填料;(E) 具有橡胶弹性的粉末;(F) 有机溶剂;该糊状组合物在涂抹和干燥后可形成一层涂膜,其空隙率为 3% 或更高,在 40°C 和 90%RH 条件下测得的
水蒸气透过率为 500 g/m2-24h 或更低;一种保护膜,它是通过在半导体部件表面涂抹浆糊组合物并将其干燥而形成的,其空隙率为 3% 或更高,在 40°C 和 90%RH 条件下测量的
水蒸气渗透率为 500 g/m2-24h 或更低;以及一种具有该保护膜的半导体器件。