N,N'-bis-formyl-o-tolidine

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: N,N'-bis-formyl-o-tolidine
• 英文别名: N,N'-(3,3'-dimethyl-biphenyl-4,4'-diyl)-bis-formamide；N,N'-(3,3'-Dimethyl-biphenyl-4,4'-diyl)-bis-formamid；N.N'-Diformyl-o-tolidin；N-[4-(4-formamido-3-methylphenyl)-2-methylphenyl]formamide
• 化学式: C₁₆H₁₆N₂O₂
• 分子量: 268.315
• InChiKey: KNGXNIKIUROCEZ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.7
• 重原子数：
  20
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.12
• 拓扑面积：
  58.2
• 氢给体数：
  2
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  甲酸 、 4,4'-二氨基-3,3'-二甲基联苯 以 水 为溶剂， 反应 1.0h， 以77%的产率得到N,N'-bis-formyl-o-tolidine
  参考文献：
  名称：

  N-甲酰邻甲苯胺和 N,N'-双甲酰邻甲苯胺的 CN 酰胺键旋转受限所产生的异构体的 NMR 检测

  摘要：

  据报道，由于在 DMSO-d6 中 N-甲酰基-邻-甲苯胺和 N,N'-双-甲酰基-邻-甲苯胺的 CN 酰胺键旋转受限，异构体的所有 1H-和 13C-NMR 共振得到完全且明确的归属。 . 顺式异构体在两种化合物的平衡混合物中占主导地位，如 1D-NOE 差异实验所示。

  DOI：

  10.3390/70800662

文献信息

• Conductive paste composition, device comprising electrode formed from same, and method for producing conductive paste composition
  申请人：KANEKA CORPORATION

  公开号：US11066509B2

  公开（公告）日：2021-07-20

  A conductive paste composition includes 1 to 10 parts by weight of a binder (A), 2 to 20 parts by weight of an epoxy monomer (B), 1 to 20 parts by weight of a crosslinking agent (C), and 70 to 95 parts by weight of a conductive filler (D). The binder (A) is a reactive oligomer having a siloxane bond as a main skeleton and including a plurality of oxirane rings as an organic group. The epoxy monomer (B) includes an oxirane ring. The total amount of the binder (A), the epoxy monomer (B), the crosslinking agent (C), and the conductive filler (D) is 100 parts by weight.

  导电浆料组合物包括 1 至 10 份（按重量计）粘合剂（A）、2 至 20 份（按重量计）环氧单体（B）、1 至 20 份（按重量计）交联剂（C）和 70 至 95 份（按重量计）导电填料（D）。粘合剂（A）是一种活性低聚物，以硅氧烷键为主骨架，包括多个环氧乙烷环作为有机基团。环氧单体（B）包括一个环氧乙烷环。粘合剂（A）、环氧单体（B）、交联剂（C）和导电填料（D）的总量按重量计为 100 份。
• CURABLE RESIN COMPOSITION FOR OPTICAL FILMS, OPTICAL FILM AND METHOD FOR PRODUCING SAME
  申请人：NITTO DENKO CORPORATION

  公开号：US20200056051A1

  公开（公告）日：2020-02-20

  A curable resin composition for optical films comprises an active-energy-ray-curable component (A) and a chlorinated polyolefin (B). It is preferred that the chlorinated polyolefin (B) has a chlorine content of 25 to 50% by weight. It is also preferred that a ratio by weight of the active-energy-ray-curable component (A) to the chlorinated polyolefin (B) is from 100/1 to 100/40.
• CONDUCTIVE PASTE COMPOSITION, DEVICE COMPRISING ELECTRODE FORMED FROM SAME, AND METHOD FOR PRODUCING CONDUCTIVE PASTE COMPOSITION
  申请人：KANEKA CORPORATION

  公开号：US20200095370A1

  公开（公告）日：2020-03-26

  A conductive paste composition includes 1 to 10 parts by weight of a binder (A), 2 to 20 parts by weight of an epoxy monomer (B), 1 to 20 parts by weight of a crosslinking agent (C), and 70 to 95 parts by weight of a conductive filler (D). The binder (A) is a reactive oligomer having a siloxane bond as a main skeleton and including a plurality of oxirane rings as an organic group. The epoxy monomer (B) includes an oxirane ring. The total amount of the binder (A), the epoxy monomer (B), the crosslinking agent (C), and the conductive filler (D) is 100 parts by weight.
• CURABLE RESIN COMPOSITION FOR POLARIZING FILMS, POLARIZING FILM AND METHOD FOR PRODUCING SAME
  申请人：NITTO DENKO CORPORATION

  公开号：US20210132274A1

  公开（公告）日：2021-05-06

  A curable resin composition for polarizing films, comprising an active-energy-ray-curable component (A) and a compound (B) having a formyl group, and having a content of the compound (B) having a formyl group that is from 1 to 900 ppm.