2,2'-bis(methoxymethyl)-1,1'-biphenyl | 180092-89-1

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2,2'-bis(methoxymethyl)-1,1'-biphenyl
• 英文别名: 1-(Methoxymethyl)-2-[2-(methoxymethyl)phenyl]benzene
• CAS: 180092-89-1
• 化学式: C₁₆H₁₈O₂
• 分子量: 242.318
• InChiKey: XBKOUTQVCYJNDL-UHFFFAOYSA-N

物化性质

• 熔点：
  97-98 °C(Solv: ligroine (8032-32-4))
• 沸点：
  355.8±37.0 °C(Predicted)
• 密度：
  1.039±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  2.8
• 重原子数：
  18
• 可旋转键数：
  5
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.25
• 拓扑面积：
  18.5
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为反应物：
  描述：

  2,2'-bis(methoxymethyl)-1,1'-biphenyl 以 二氯甲烷 为溶剂， 生成 2,2'-bis(1-methoxy-3-butenyl)biphenyl
  参考文献：
  名称：

  基于 C-C 键解离的“阳离子池”方法。Monocations 和 Dications 的有效生成

  摘要：

  烷氧基芳基碳正离子的“阳离子池”是通过低温电解氧化 CC 键离解有效产生的。本方法对于与碳亲核试剂反应的指示剂的产生和积累特别有效。

  DOI：

  10.1021/ja050414y
• 作为产物：
  描述：

  1-溴-2-(甲氧基甲基)苯 在 1,2,3,4,5-五苯基-1′-(二叔丁基膦)二茂铁 、 (C₅H₅)2Zr(OC₄H₈)N(Si(CH₃)3)CH(C₆H₅) 、 bis(dibenzylideneacetone)-palladium⁽⁰⁾ 作用下， 以 甲苯 为溶剂， 反应 16.0h， 以81%的产率得到2,2'-bis(methoxymethyl)-1,1'-biphenyl
  参考文献：
  名称：

  芳族和杂芳族卤化物的锆-氧化还原-穿梭交叉亲电偶联

  摘要：

  过渡金属催化的交叉亲电偶联 (XEC) 是锻造 C(sp 2 )–C(sp 2 ) 的有力工具) 联芳基分子中来自丰富芳族卤化物的键。虽然通过多金属 XEC 合成不对称联芳基化合物具有很高的合成价值，但两种杂芳族卤化物的选择性 XEC 仍然难以捉摸且具有挑战性。在这里，我们报告了一种均相 XEC 方法，该方法依赖于锆氮丙啶配合物作为双钯催化过程的穿梭。锆氮丙啶介导的钯 (ZAPd) 催化反应显示出与各种官能团和各种杂芳族支架的良好相容性。根据密度泛函理论 (DFT) 计算，氧化加成产物和锆氮丙啶之间的氧化还原金属转移被认为是关键的基本步骤。因此，使用单一过渡金属催化剂的交叉偶联选择性由 Pd(0) 氧化加成到芳族卤化物的相对速率控制。总体而言，组合还原剂和金属转移剂的概念为过渡金属还原偶联催化的发展提供了机会。

  DOI：

  10.1016/j.chempr.2021.06.007

文献信息

• Palladium-Catalyzed, <i>tert-</i> Butyllithium-Mediated Dimerization of Aryl Halides and Its Application in the Atropselective Total Synthesis of Mastigophorene A
  作者：Jeffrey Buter、Dorus Heijnen、Carlos Vila、Valentín Hornillos、Edwin Otten、Massimo Giannerini、Adriaan J. Minnaard、Ben L. Feringa

  DOI：10.1002/anie.201510328

  日期：2016.3.7

  A palladium‐catalyzed direct synthesis of symmetric biaryl compounds from aryl halides in the presence of tBuLi is described. In situ lithium–halogen exchange generates the corresponding aryl lithium reagent, which undergoes a homocoupling reaction with a second molecule of the aryl halide in the presence of the palladium catalyst (1 mol %). The reaction takes place at room temperature, is fast (1 h)

  描述了在t BuLi存在下钯催化芳基卤化物直接合成对称联芳基化合物的方法。原位锂-卤素交换生成相应的芳基锂试剂，该试剂在钯催化剂（1摩尔％）存在下与第二个芳基卤分子进行均偶联反应。反应在室温下进行，反应快速（1小时），并以良好至极好的收率得到相应的联芳基化合物。该方法的应用已证明了高效的igo草烯A的不对称全合成。由于催化剂诱导的远程点对轴手性转移，手性联芳基轴的抗选择性为9：1。
• EPOXY RESIN COMPOSITION, PRODUCTS OF CURING THEREOF, MATERIAL FOR THE ENCAPSULATION OF SEMICONDUCTORS, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, PROCESS FOR PRODUCTION OF NOVEL PHENOL RESIN AND PROCESS FOR PRODUCTION OF NOVEL EPOXY RESIN
  申请人：DAINIPPON INK AND CHEMICALS, INC.

  公开号：EP1785441A1

  公开（公告）日：2007-05-16

  An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).

  一种环氧树脂组合物，包括作为基本成分的环氧树脂和固化剂，其中固化剂包括酚醛树脂，该酚醛树脂具有含酚羟基的芳香烃基团（P）、含烷氧基的芳香烃基团（B）和二价芳烷基（X）的每个结构分子，并且还具有以下特征在分子结构中，含酚羟基的芳香烃基团（P）和含烷氧基的芳香烃基团（B）通过二价芳烷基（X）与另一个含酚羟基的芳香烃基团（P）或含烷氧基的芳香烃基团（B）键合的结构。
• EPOXY RESIN, EPOXY RESIN COMPOSITION, AND UTILIZING THE SAME, PREPREG AND LAMINATED PLATE
  申请人：NIPPON KAYAKU KABUSHIKI KAISHA

  公开号：EP1860133A1

  公开（公告）日：2007-11-28

  An object of the present invention is to provide an epoxy resin exhibiting superior heat resistance, dielectric properties, water resistance, and workability, a resin composition containing the epoxy resin, and a prepreg and a laminated plate. The epoxy resin of the invention is expressed by the following formula. (In the formula, R represents a hydrocarbon group having a carbon number of 1 to 4. m Represents an integer of 1 to 4 and when m is 2 to 4, R's may be the same or different. n Represents a positive number of 1 to 6 on average.) The epoxy resin composition of the invention contains the epoxy resin of the invention and a curing agent.

  本发明的目的是提供一种具有优异耐热性、介电性能、耐水性和可加工性的环氧树脂，一种含有该环氧树脂的树脂组合物，以及一种预浸料和层压板。本发明的环氧树脂用下式表示。(式中，R 代表碳数为 1 至 4 的烃基。m 代表 1 至 4 的整数，当 m 为 2 至 4 时，R 可以相同或不同。n 代表平均为 1 至 6 的正数)。本发明的环氧树脂组合物包含本发明的环氧树脂和固化剂。
• HEAT CURABLE RESIN COMPOSITION FOR LIGHT REFLECTION, PROCESS FOR PRODUCING THE RESIN COMPOSITION, AND OPTICAL SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE AND OPTICAL SEMICONDUCTOR DEVICE USING THE RESIN COMPOSITION
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP2100908A1

  公开（公告）日：2009-09-16

  This invention provides a thermosetting resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature of 100°C to 200°C, molding pressure of not more than 20MPa, and molding time of 60 to 120 sec is not more than 5mmabd the light reflectance after heat curing at a wavelength of 350 nm to 800nm is not less than 80%. The resin composition can be used for constructing the optical semiconductor element mounting substrate and the optical semiconductor device.

  本发明提供了一种光反射用热固性树脂组合物，固化后可实现从可见光到近紫外光范围内的高反射率，具有优异的耐热劣化性和平板成型性，并且在转移成型时不易产生毛刺，还提供了该树脂组合物的生产工艺，以及使用该树脂组合物的光半导体元件安装基板和光半导体器件。光反射用热固化树脂组合物由热固化成分和白色颜料组成，其特征在于，在成型温度为 100℃至 200℃、成型压力不超过 20MPa、成型时间为 60 秒至 120 秒的条件下，转移成型时产生的毛刺长度不超过 5mmabd，在波长为 350nm 至 800nm 的条件下，热固化后的光反射率不低于 80%。该树脂组合物可用于制造光半导体元件安装基板和光半导体器件。
• THERMOSETTING RESIN COMPOSITION FOR LIGHT REFLECTION, SUBSTRATE MADE THEREFROM FOR PHOTOSEMICONDUCTOR ELEMENT MOUNTING, PROCESS FOR PRODUCING THE SAME, AND PHOTOSEMICONDUCTOR DEVICE
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP2199339A1

  公开（公告）日：2010-06-23

  There is provided a thermosetting light-reflecting resin composition that has a high level of various characteristics required of optical semiconductor element mounting boards, such as optical properties and thermal discoloration resistance, provides high releasability during molding such as transfer molding, and allows molding processes to be performed continuously. There are also provided a highly-reliable optical semiconductor element mounting board and an optical semiconductor device each produced with the resin composition, and methods for efficient production thereof. A thermosetting light-reflecting resin composition is prepared and used, which includes (A) an epoxy resin, (B) a curing agent, (C) a curing catalyst, (D) an inorganic filler, (E) a white pigment, (F) an additive, and (G) a release agent as major components, wherein the resin composition, after curing, has a diffuse reflectance of 80% or more at a light wavelength of 400 nm; and the resin composition is possible to perform transfer molding 100 times or more continuously.

  本发明提供了一种热固性光反射树脂组合物，该组合物具有光学半导体元件安装板所需的高水平的各种特性，如光学特性和耐热变色性，在转移模塑等模塑过程中具有高脱模性，并可连续执行模塑工序。此外，还提供了使用该树脂组合物生产的高可靠性光半导体元件安装板和光半导体器件及其高效生产方法。制备并使用了一种热固性光反射树脂组合物，其主要成分包括(A)环氧树脂、(B)固化剂、(C)固化催化剂、(D)无机填料、(E)白色颜料、(F)添加剂和(G)脱模剂，其中固化后的树脂组合物在光波长为 400 纳米时的漫反射率为 80% 或以上；并且该树脂组合物可以连续进行 100 次或更多次的转移成型。