Irradiation with visiblelight of a mixture of an alkene in degassed aqueous acetonitrile containing tetraphenylporphyrinantimony(V) as a sensitizer, methylviologen as an electron acceptor, and hydroxide ion, induced epoxidation of the alkene accompanied by hydrogen evolution, with water acting as the electron donor.
Shaped polyester composite material having an activated surface thereof and process for producing the same
申请人:TEIJIN LIMITED
公开号:EP0048481A2
公开(公告)日:1982-03-31
A shaped polyester composite material having an excellent bonding property to rubber, comprises a shaped substrate comprising an aromatic linear polyester matrix and 0.3 to 15%, based on the weight of the matrix, of silicon dioxide fine particles having an average size of 5 to 100 millimicrons and dispersed in at least a surface portion of the substrate, and;
a surface coating layer formed on the fine particle-containing surface portion of the substrate and comprising a surface-activating material consisting of at least one member selected from silane conpling compounds and organic titanium compounds, the surface coating layer having been heat treated at a temperature of 50°C or more but at least 10°C below the melting point of the polyester matrix.
The present invention relates to a two component epoxy adhesive system comprising an epoxy component comprising (1) at least one aromatic multifunctional epoxy resin; and a hardener component comprising (1) a polyamide of a dimer fatty acid, (2) at least one aliphatic or cycloaliphatic amine and (3) at least one aromatic amine; and wherein CR a polyglycidyl ether of sorbitol, having more than 2 oxirane groups per molecule, as an accelerator is present in the epoxy component and/or a tertiary amine accelerator is present in the hardener component.
High performance epoxy adhesive composition with high flexibility and toughness
申请人:CIBA-GEIGY AG
公开号:EP0527706A1
公开(公告)日:1993-02-17
The present invention relates to a two component epoxy resin adhesive system comprising:
(A) an epoxy component comprising
(a) at least one aromatic multifunctional epoxy resin, and
(B) a liquid elastomer component comprising
(a) a liquid copolymer based on butadiene and at least one ethylenically unsaturated comonomer,
(b) a liquid oligomer reaction product of a polyamine and a dimer acid and
(c) a liquid aromatic or aliphatic polyamine,
which exhibits a combination of high glass transition temperature (Tg), flexibility, fast curing, chemical thixotropy, high temperature resistance and excellent adhesion.
Via fill compositions for direct attach of devices and methods for applying same
申请人:International Business Machines
Corporation
公开号:EP0653904A2
公开(公告)日:1995-05-17
The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes (14) with an epoxy or cyanate fill composition (16). When cured and overplated, the fill composition (16) provides support for the solder joint (22) and provides a flat solderable surface (18) for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.