An adhesive composition for use in debonding with light irradiation, which composition can achieve debonding through irradiation with light, characterized in that the adhesive composition contains an adhesive component (S) and a light-absorbing organic compound (X); and the light-absorbing organic compound (X) contains, in the molecule thereof, one or more aromatic rings, one or more rings each containing a heteroatom forming the ring, and one or more groups selected from among a carbonyl group and a thiocarbonyl group.
一种用于光照射脱粘的粘合剂组合物,该组合物可通过光照射实现脱粘,其特征在于,该粘合剂组合物含有粘合剂成分(S)和光吸收有机化合物(X);光吸收有机化合物(X)的分子中含有一个或多个芳香环、一个或多个各自含有一个杂原子形成的环、以及一个或多个选自羰基和
硫代羰基的基团。