申请人:——
公开号:US20020055606A1
公开(公告)日:2002-05-09
A polycarbodiimide represented by the formula (I):
1
wherein R
1
is an alkylene group having 2 to 10 carbon atoms, R
2
is a divalent aromatic group, R
3
is a monovalent aromatic group, k is 0 or an integer of 1 to 30, m is an integer of 2 to 100, and n is 0 or an integer of 1 to 30, a process for preparing the same and uses of the polycarbodiimide. The polycarbodiimide is favorably used in the form of films such as adhesive films for die bonding and adhesive films for underfilling, which can be used in semiconductor devices.
由式(I)代表的聚碳二亚胺:
1
其中 R
1
是具有 2 至 10 个碳原子的亚烷基,R
2
是二价芳香基团,R
3
是一价芳香族基团,k 是 0 或 1 至 30 的整数,m 是 2 至 100 的整数,n 是 0 或 1 至 30 的整数。聚碳二亚胺可以薄膜的形式使用,如用于芯片粘合的粘合薄膜和用于底部填充的粘合薄膜,这些薄膜可用于半导体器件中。