2-Hydroxy-1.3-bis-hydroxymethyl-5-propyl-benzol

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2-Hydroxy-1.3-bis-hydroxymethyl-5-propyl-benzol
• 英文别名: 4-Propyl-2,6-bis-hydroxymethyl-phenol；2,6-Bis(hydroxymethyl)-4-propylphenol
• 化学式: C₁₁H₁₆O₃
• 分子量: 196.246
• InChiKey: DCWGIKSFIRBHOS-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.7
• 重原子数：
  14
• 可旋转键数：
  4
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.45
• 拓扑面积：
  60.7
• 氢给体数：
  3
• 氢受体数：
  3

反应信息

• 作为反应物：
  描述：

  2-Hydroxy-1.3-bis-hydroxymethyl-5-propyl-benzol 生成 聚合甲醛 、 水
  参考文献：
  名称：

  Hanus; Fuchs, Journal fur praktische Chemie (Leipzig 1954), 1939, vol. <2> 153, p. 327,335

  摘要：

  DOI：
• 作为产物：
  描述：

  聚合甲醛 、 4-丙基苯酚 在 sodium hydroxide 作用下， 生成 2-Hydroxy-1.3-bis-hydroxymethyl-5-propyl-benzol
  参考文献：
  名称：

  Strating; Backer, Recueil des Travaux Chimiques des Pays-Bas, 1943, vol. 62, p. 57,60

  摘要：

  DOI：

文献信息

• Polynuclear polyhydric phenols and process for preparation thereof
  申请人：MITSUI PETROCHEMICAL INDUSTRIES, LTD.

  公开号：EP0117759A1

  公开（公告）日：1984-09-05

  A polynuclear polyhydric phenol of the general formula (I); wherein R1 and R2 each represent a hydrogen atom or a C1-C4 alkyl group, R3 represents a hydrogen atom, an alkyl group, an aryl group or a halogen atom, and n is an integer of from 0 to 10, can be used to provide a polyepoxy compound which is a polyglycidyl ether of the polynuclear polyhydric ether. When the polyepoxy compound is combined with a curing agent, a curable epoxy resin composition results which can be used to provide molded cured articles having excellent heat resistance characteristics.

  通式(I)的多核多氢酚； 其中 R1 和 R2 分别代表氢原子或 C1-C4 烷基，R3 代表氢原子、烷基、芳基或卤素原子，n 为 0 至 10 的整数。当该聚环氧化合物与固化剂结合时，可产生一种可固化的环氧树脂组合物，该组合物可用于提供具有优异耐热性能的模塑固化制品。
• DEVELOPER FOR RECORDING MATERIALS
  申请人：Asahi Kasei Chemicals Corporation

  公开号：EP1637337A1

  公开（公告）日：2006-03-22

  A developer which contains a triphenolic compound (B) being a triphenolic compound (A) of the general formula (1) satisfying the requirements: (a) an OH group is present at one or more of 4- and 4'-positions of the left and right aromatic rings and (b) at least one of the substituents adjacent to at least one OH group on the left or right aromatic rings is hydrogen and which exhibits high sensitivity and image stability of images and less fog in non-image areas; and color forming materials and thermal recording materials made by using the same.

  一种含有三酚类化合物（B）的显影剂，该三酚类化合物（B）是通式（1）的三酚类化合物（A），满足以下要求：(a) 在左芳香环和右芳香环的 4- 位和 4'- 位中的一个或多个位置上有一个羟基；(b) 与左芳香环或右芳香环上的至少一个羟基相邻的取代基中至少有一个是氢，并且该显影剂具有高灵敏度和图像稳定性，非图像区域的雾气较少；以及使用该显影剂制成的色彩形成材料和热敏记录材料。
• Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus
  申请人：ASAHI KASEI KABUSHIKI KAISHA

  公开号：US10831101B2

  公开（公告）日：2020-11-10

  A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.

  一种光敏树脂组合物含有一种树脂和一种化合物，每种树脂和化合物都具有本说明书规定的结构，这种组合物提供的固化薄膜对铜线具有极佳的粘合性。
• Resin composition
  申请人：TORAY INDUSTRIES, INC.

  公开号：US10990008B2

  公开（公告）日：2021-04-27

  The present invention provides a resin composition which can result in a cured film which has chemical resistance, low stress property, and high elongation property even by a heat treatment at a low temperature. The resin composition comprising an alkali-soluble resin (a) which contains a phenol skeleton having a crosslinking group and a phenol skeleton not having a crosslinking group and which has a weight average molecular weight in the range of 1,000 to 50,000, wherein the content ratio of the phenol skeleton having a crosslinking group to the total 100% by mole of structural units of the phenol skeleton having a crosslinking group and the phenol skeleton not having a crosslinking group is in the range of 5 to 90% by mole.

  本发明提供了一种树脂组合物，即使在低温下进行热处理，也能形成具有耐化学性、低应力特性和高伸长特性的固化膜。 该树脂组合物包括碱溶性树脂 (a)，它含有具有交联基团的苯酚骨架和不具有交联基团的苯酚骨架，其重量平均分子量在 1,000 至 50,000 之间，其中具有交联基团的苯酚骨架与具有交联基团的苯酚骨架和不具有交联基团的苯酚骨架的结构单元总数的 100%（以摩尔计）的含量比在 5 至 90%（以摩尔计）之间。
• High-molecular-weight novolak substituted phenolic resins and their preparation
  申请人：MITSUI PETROCHEMICAL INDUSTRIES, LTD.

  公开号：EP0032062B1

  公开（公告）日：1985-04-03