申请人:Toray Industries, Inc.
公开号:US20040053156A1
公开(公告)日:2004-03-18
A photosensitive resin precursor composition exhibiting an excellent film thickness uniformity contains: a heat resistant resin precursor polymer; a radiation sensitive compound; and a solvent expressed by formula (1):
1
R
1
represents an alkyl group having a carbon number in the range of 1 to 3. R
2
, R
3
, R
4
, and R
5
each represent hydrogen or an alkyl group having a carbon number in the range of 1 to 3, and l represents an integer in the range of 0 to 3.
一种具有优异膜厚均匀性的光敏树脂前体组合物包含:耐热树脂前体聚合物;辐射敏感化合物;以及由式(1)表示的溶剂:
1
R
1
代表碳原子数在 1 至 3 之间的烷基。R
2
, R
3
, R
4
和 R
5
各自代表氢或碳原子数在 1 至 3 之间的烷基,l 代表 0 至 3 之间的整数。