N,N'-biphenyl-4,4'-diyl-bis-hydroxylamine

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: N,N'-biphenyl-4,4'-diyl-bis-hydroxylamine
• 英文别名: N,N'-Biphenyl-4,4'-diyl-bis-hydroxylamin；(Diphenylen-(4.4'))-di-hydroxylamin；4.4'-Bis-hydroxylamino-diphenyl；Dihydroxybenzidine；N-[4-[4-(hydroxyamino)phenyl]phenyl]hydroxylamine
• 化学式: C₁₂H₁₂N₂O₂
• 分子量: 216.239
• InChiKey: CMDHNEAPXOZXBI-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.3
• 重原子数：
  16
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  64.5
• 氢给体数：
  4
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  盐酸 、 N,N'-biphenyl-4,4'-diyl-bis-hydroxylamine 、 alkaline earth salt of/the/ methylsulfuric acid 生成 联苯胺
  参考文献：
  名称：

  Fischer,O.; Hepp, Chemische Berichte, 1887, vol. 20, p. 2474

  摘要：

  DOI：
• 作为产物：
  描述：

  联苯胺 在 dipotassium peroxodisulfate 作用下， 以 水 为溶剂， 生成 N,N'-biphenyl-4,4'-diyl-bis-hydroxylamine
  参考文献：
  名称：

  Habib, A. M.; Ebeid, E. M.; Abdel-Kader, M. H., Zeitschrift für Physikalische Chemie, 1988, vol. 159, p. 113 - 122

  摘要：

  DOI：

文献信息

• POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND POLYHYDROXYAMIDE RESIN
  申请人：Nissan Chemical Industries, Ltd.

  公开号：EP2159637A1

  公开（公告）日：2010-03-03

  There is provided a positive photosensitive resin composition that is excellent in electric insulating properties, heat resistance, mechanical strength and electrical characteristics, and capable of forming a high-resolution circuit pattern. The positive photosensitive resin composition comprises at least one type of a polyhydroxyamide resin (A) containing a repeating unit represented by Formula (1) and having a weight average molecular weight of 3,000 to 100,000, and a compound (B) generating an acid by light irradiation. (where X represents a tetravalent aliphatic group or an aromatic group; R1 and R2 independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atom(s); Ar1 and Ar2 independently represent an aromatic group; Y represents an organic group containing an aromatic group substituted with at least one OH group; n represents an integer of 1 or more; and 1 and m independently represent an integer of 0 or 1 or more and satisfy 1+m≤2)

  本发明提供了一种电绝缘性能、耐热性、机械强度和电气特性优良，并能形成高分辨率电路图案的正性感光树脂组合物。该正性光敏树脂组合物包括至少一种含有由式（1）表示的重复单元且重量平均分子量在 3,000 至 100,000 之间的聚羟酰胺树脂（A）和一种通过光照射产生酸的化合物（B）。 (其中 X 代表四价脂肪族基团或芳香族基团；R1 和 R2 独立地代表氢原子或具有 1 至 10 个碳原子的烷基；Ar1 和 Ar2 独立地代表芳香族基团；Y 代表含有至少一个 OH 基团取代的芳香族基团的有机基团； n 代表 1 或以上的整数；1 和 m 独立地代表 0 或 1 或以上的整数，且满足 1+m≤2)
• Fischer,O., Chemische Berichte, 1899, vol. 32, p. 248
  作者：Fischer,O.

  DOI：——

  日期：——
• POLYBENZAZOLES AND POLYBENZAZOLE PRECURSORS
  申请人：Teijin Aramid B.V.

  公开号：EP2152781A1

  公开（公告）日：2010-02-17
• Process for Production of Polybenzazole Polymer and the Polymer
  申请人：Watanabe Naoki

  公开号：US20080269455A1

  公开（公告）日：2008-10-30

  PROBLEMS The present invention relates to a process for producing a polybenzoxazole polymer and provides a process for producing the polybenzoxazole polymer within a short reaction time. MEANS FOR SOLVING PROBLEMS A process for producing a polybenzazole polymer comprises producing the polybenzazole polymer in a non-oxidizing dehydrating solvent while employing a compound represented by the following general formula (1) as a raw material including a first polymerization step in which polymerization is performed at a temperature of 150° C. or less and a latter polymerization step in which polymerization is performed at a temperature of 200° C. or more, wherein at least the latter polymerization step is performed in a kneading-type reaction apparatus to complete the polymerization reaction: wherein X represents an O atom, an S atom or an NH group; Ar 1 represents a tetravalent organic group having two or less of benzene rings, naphthalene rings or pyridine rings; Ar 2 represents a bivalent organic group having two or less of benzene rings, naphthalene rings or pyridine rings; both of Ar 1 and Ar 2 may have one or more functional groups such as a methyl group and a hydroxyl group; and R represents H or a univalent organic group with a carbon number of 1 to 6.
• POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND DPOLYHYDROXYAMIDE RESIN
  申请人：Ebara Kazuya

  公开号：US20100119969A1

  公开（公告）日：2010-05-13

  There is provided a positive photosensitive resin composition that is excellent in electric insulating properties, heat resistance, mechanical strength and electrical characteristics, and capable of forming a high-resolution circuit pattern. The positive photosensitive resin composition comprises at least one type of a polyhydroxyamide resin containing a repeating unit represented by Formula (1) and having a weight average molecular weight of 3,000 to 100,000, and a compound generating an acid by light irradiation. (where X represents a tetravalent aliphatic group or an aromatic group; R 1 and R 2 independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atom(s); Ar 1 and Ar 2 independently represent an aromatic group; Y represents an organic group containing an aromatic group substituted with at least one OH group; n represents an integer of 1 or more; and l and m independently represent an integer of 0 or 1 or more and satisfy l+m≦2).