5-nitro-2-sulfo-benzoic acid | 40567-35-9

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 5-nitro-2-sulfo-benzoic acid
• 英文别名: 5-Nitro-2-sulfo-benzoesaeure；2-Carboxy-4-nitro-benzolsulfonsaeure；5-Nitro-sulfobenzoesaeure；5-Nitro-2-sulfobenzoic acid
• CAS: 40567-35-9
• 化学式: C₇H₅NO₇S
• 分子量: 247.185
• InChiKey: CWBVCXZBOUPOQE-UHFFFAOYSA-N

物化性质

• 密度：
  1.809±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  0.1
• 重原子数：
  16
• 可旋转键数：
  2
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  146
• 氢给体数：
  2
• 氢受体数：
  7

反应信息

• 作为反应物：
  描述：

  5-nitro-2-sulfo-benzoic acid 在 盐酸 、 tin 作用下， 生成 5-amino-2-sulfo-benzoic acid
  参考文献：
  名称：

  van Dorssen, Recueil des Travaux Chimiques des Pays-Bas, 1910, vol. 29, p. 373

  摘要：

  DOI：
• 作为产物：
  描述：

  alkaline earth salt of/the/ methylsulfuric acid 在 水 作用下， 生成 5-nitro-2-sulfo-benzoic acid
  参考文献：
  名称：

  Stubbs, American Chemical Journal, 1913, vol. 50, p. 193

  摘要：

  DOI：

文献信息

• When users drive the network
  作者：H. Whyte

  DOI：10.1109/101.876904

  日期：——

  These are interesting times for networking and telecommunications. In recent years, the focus has shifted from connectivity to bandwidth. Soon the focus will shift from bandwidth to services. The author is a leading advocate of open systems for service creation. He has more than 30 years of expertise in the telecommunications industry, much of it in challenging and often high-risk roles in which his entrepreneurial spirit has been called upon to dramatically alter the strategies and the fortunes of the companies he has led. He gives an excellent overview of what to expect in the years ahead. These changes will have profound effects on the way we communicate.

  对于网络和电信来说，这是一个有趣的时代。近年来，关注的焦点已从连接性转向带宽。很快，重点将从带宽转向服务。作者是服务创建开放系统的主要倡导者。他在电信行业拥有 30 多年的专业经验，其中大部分时间都是在充满挑战、往往是高风险的岗位上度过的，在这些岗位上，他的创业精神被要求极大地改变他所领导的公司的战略和命运。他出色地概述了未来几年的预期。这些变化将对我们的沟通方式产生深远影响。
• METHOD FOR NON-ENZYMATIC COMBINATION OF NUCLEIC ACID CHAINS
  申请人：Japan Science and Technology Agency

  公开号：EP3187584A1

  公开（公告）日：2017-07-05

  Provided, as a technique for binding a nucleic acid chain and a nucleic acid chain by a natural structure or an analogous structure thereto, is a non-enzymatic nucleic acid chain binding method, which is a method for binding a nucleic acid chain and a nucleic acid chain not via an enzymatic reaction, including a step of reacting a nucleic acid chain having a phosphorothioate group and a nucleic acid chain having a hydroxyl group or amino group in the presence of an electrophile.

  作为一种通过天然结构或类似结构结合核酸链和核酸链的技术，提供了一种非酶结合核酸链的方法，它是一种不通过酶反应结合核酸链和核酸链的方法，包括在亲电子体存在的情况下，使具有硫代磷酸基的核酸链和具有羟基或氨基的核酸链发生反应的步骤。
• CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers
  申请人：Carter K. Melvin

  公开号：US20050090109A1

  公开（公告）日：2005-04-28

  The invention relates to chemical mechanical polishing of substrates using an abrasive and a fluid composition, wherein certain organosulfonic acid compounds are used as oxidizers, and particularly relates to a method of polishing substrates comprising copper, tungsten, titanium, and/or polysilicon using a chemical-mechanical polishing system comprising organosulfonic acids having an electrochemical oxidation potential greater than 0.2V as an oxidizer.

  本发明涉及使用磨料和流体组合物对基底进行化学机械抛光，其中使用某些有机磺酸化合物作为氧化剂，特别是涉及一种使用化学机械抛光系统对由铜、钨、钛和/或多晶硅组成的基底进行抛光的方法，该系统包含电化学氧化电位大于 0.2V 的有机磺酸作为氧化剂。
• Taverne, Recueil des Travaux Chimiques des Pays-Bas, 1906, vol. 25, p. 53
  作者：Taverne

  DOI：——

  日期：——
• CMP composition of boron surface-modified abrasive and nitro-substituted sulfonic acid and method of use
  申请人：Compton Frederick Timothy

  公开号：US20070054495A1

  公开（公告）日：2007-03-08

  A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition contains a boron surface-modified abrasive, a nitro-substituted sulfonic acid compound, a per-compound oxidizing agent, and water. The composition affords high removal rates for barrier layer materials in metal CMP processes. The composition is particularly useful in conjunction with the associated method for metal CMP applications (e.g., step 2 copper CMP processes).