摩熵化学
数据库官网
小程序
打开微信扫一扫
首页 分子通 化学资讯 化学百科 反应查询 关于我们
请输入关键词

sulfuric acid bis-(4-amino-phenyl ester) | 13320-41-7

中文名称
——
中文别名
——
英文名称
sulfuric acid bis-(4-amino-phenyl ester)
英文别名
Schwefelsaeure-bis-(4-amino-phenylester);4,4'-Diaminodiphenylsulphate;bis(4-aminophenyl) sulfate
sulfuric acid bis-(4-amino-phenyl ester)化学式
CAS
13320-41-7
化学式
C12H12N2O4S
mdl
——
分子量
280.304
InChiKey
BZNLEPSVOGWFFQ-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    2
  • 重原子数:
    19
  • 可旋转键数:
    4
  • 环数:
    2.0
  • sp3杂化的碳原子比例:
    0.0
  • 拓扑面积:
    113
  • 氢给体数:
    2
  • 氢受体数:
    6

上下游信息

  • 上游原料
    中文名称 英文名称 CAS号 化学式 分子量
  • 下游产品
    中文名称 英文名称 CAS号 化学式 分子量

反应信息

点击查看最新优质反应信息

文献信息

  • Polyaniline-containing solution and method for preparing the same
    申请人:Conpoly Technology Co., Ltd
    公开号:EP1132415A1
    公开(公告)日:2001-09-12
    A process for producing a conductive polyaniline is disclosed. The process includes mixing an aniline monomer, a water-immiscible organic solvent, at least one protonic acid doping agent and water together to form an emulsion via agitation, stopping agitation to allow the emulsion to separate into an aqueous phase and a non-aqueous phase, separating the non-aqueous phase from the aqueous phase, and adding an oxidation agent into the non-aqueous phase to carry out polymerization. A non-aqueous in-situ formed transparent polyaniline solution prepared by the process is also disclosed.
    本发明公开了一种生产导电聚苯胺的工艺。该工艺包括将苯胺单体、不溶于水的有机溶剂、至少一种质子酸掺杂剂和水混合在一起,通过搅拌形成乳液;停止搅拌,使乳液分离成水相和非水相;将非水相从水相中分离出来;在非水相中加入氧化剂进行聚合。此外,还公开了通过该工艺制备的非水原位形成的透明聚苯胺溶液。
  • POLYIMIDE RESIN, RESIN COMPOSITION WITH IMPROVED MOISTURE RESISTANCE COMPRISING THE SAME, ADHESIVE SOLUTION, FILMY BONDING MEMBER, LAYERED ADHESIVE FILM, AND PROCESSES FOR PRODUCING THESE
    申请人:Kaneka Corporation
    公开号:EP1193280A1
    公开(公告)日:2002-04-03
    The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures. Specifically, the present invention provides a novel polyimide resin having low water absorption obtained by a reaction between tetracarboxylic acid dianhydride containing ester-acid dianhydride represented by the general formula (1): wherein X represents -(CH2)k-, or is a divalent group which comprises an aromatic ring, and k is an integer from 1 to 10; and aromatic diamine, where the resin composition and the film-state joining component which comprise a thermosetting resin with excellent adhesion using this resin are preferably used for flexible printed circuit boards, tapes for TAB (Tape Automated Bonding), composite lead frames, and lamination materials, or the like, and an adhesive laminate film suitable for coating of a superconductive wire rod.
    本发明提供了一种可溶于溶剂的聚酰亚胺树脂、树脂组合物、粘合剂溶液、膜态接合成分和粘合层压膜,具有优异的耐热性和粘合性,能够在相对较低的温度下粘合和固化。具体地说,本发明提供了一种吸水性低的新型聚酰亚胺树脂,它是由含有通式 (1) 所代表的酯酸二酐的四羧酸二酐反应得到的: 其中 X 代表-(CH2)k-,或者是由芳香环组成的二价基团,k 是 1 至 10 的整数;和芳香二胺,其中树脂组合物和薄膜状态连接组分由具有优异粘合性的热固性树脂组成,使用这种树脂最好用于柔性印刷电路板、TAB(胶带自动粘合)用胶带、复合引线框架和层压材料或类似材料,以及适用于涂覆超导线棒的粘合层压薄膜。
  • Polyimide resin and resin composition, adhesive solution, film-state joining component,and adhesive laminate film improved in moisture resistance using it,and production methods therefor
    申请人:——
    公开号:US20030045669A1
    公开(公告)日:2003-03-06
    The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures. Specifically, the present invention provides a novel polyimide resin having low water absorption obtained by a reaction between tetracarboxylic acid dianhydride containing ester-acid dianhydride represented by the general formula (1): 1 wherein X represents —(CH 2 ) k —, or is a divalent group which comprises an aromatic ring, and k is an integer from 1 to 10; and aromatic diamine, where the resin composition and the film-state joining component which comprise a thermosetting resin with excellent adhesion using this resin are preferably used for flexible printed circuit boards, tapes for TAB (Tape Automated Bonding), composite lead frames, and lamination materials, or the like, and an adhesive laminate film suitable for coating of a superconductive wire rod.
    本发明提供了一种可溶于溶剂的聚酰亚胺树脂、树脂组合物、粘合剂溶液、膜态接合成分和粘合层压膜,具有优异的耐热性和粘合性,能够在相对较低的温度下粘合和固化。具体地说,本发明提供了一种吸水性低的新型聚酰亚胺树脂,它是由含有通式(1)所代表的酯酸二酐的四羧酸二酐反应得到的: 1 其中 X 代表-(CH 2 ) k -或包含芳香环的二价基团,且 k 是 1 到 10 的整数;以及芳香族二胺,其中树脂组合物和薄膜态连接组分包含具有优异粘合性的热固性树脂,使用这种树脂最好用于柔性印刷电路板、TAB(胶带自动粘合)胶带、复合引线框架和层压材料或类似材料,以及适用于涂覆超导线棒的粘合层压膜。
  • NOVEL CATALYST FOR PRODUCTION OF OXAZOLIDINE COMPOUNDS
    申请人:H.B. FULLER LICENSING & FINANCING, INC.
    公开号:EP0563316A1
    公开(公告)日:1993-10-06
  • POLYOXAZOLIDONES
    申请人:H.B. FULLER LICENSING & FINANCING, INC.
    公开号:EP0563316B1
    公开(公告)日:1995-03-08
查看更多