6,6'-dihydroxy-2,2'-binaphthalene | 90449-28-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: 6,6'-dihydroxy-2,2'-binaphthalene
• 英文别名: 6,6'-Dihydroxy-2,2'-bi-naphthyl；6-(6-hydroxynaphthalen-2-yl)naphthalen-2-ol
• CAS: 90449-28-8
• 化学式: C₂₀H₁₄O₂
• 分子量: 286.33
• InChiKey: SRSIVKZVRZLXLZ-UHFFFAOYSA-N

物化性质

• 沸点：
  539.5±35.0 °C(Predicted)
• 密度：
  1.302±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  5.3
• 重原子数：
  22
• 可旋转键数：
  1
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  40.5
• 氢给体数：
  2
• 氢受体数：
  2

反应信息

• 作为反应物：
  描述：

  3-羟基-2-萘甲酸甲酯 、 6,6'-dihydroxy-2,2'-binaphthalene 在 氧气 、 (S,S)-2,2'-异亚丙基双(4-苯基-2-恶唑啉) 、 copper(l) chloride 作用下， 以 四氢呋喃 为溶剂， 反应 48.0h， 以92%的产率得到2,2',6'',2'''-Tetrahydroxy-[1,1';6',2'';5'',1''']quaternaphthalene-3,3'''-dicarboxylic acid dimethyl ester
  参考文献：
  名称：

  铜（I）催化的2-萘酚衍生物的不对称氧化交叉偶联

  摘要：

  进行了2-萘酚或联萘酚衍生物与3-羟基-2-萘甲酸酯衍生物与铜（I）-（S）-（-）-异亚丙基双（4-苯基-2-恶唑啉）催化剂之间的不对称氧化偶联反应。反应以高度交叉偶联的选择性方式（≤99.7％）进行，以良好的收率（≤92％）产生对萘基或季萘基衍生物，对映选择性高达74％。

  DOI：

  10.1016/j.tet.2006.06.069
• 作为产物：
  描述：

  2-溴-6-甲氧基萘 在 chloride 吡啶盐酸盐 、 magnesium 作用下， 以 四氢呋喃 为溶剂， 反应 4.0h， 生成 6,6'-dihydroxy-2,2'-binaphthalene
  参考文献：
  名称：

  Liquid Crystalline Epoxy Thermosets

  摘要：

  Rigid rod epoxy compounds can be cured in liquid crystalline structure. The so obtained networks exhibit better mechanical properties with respect to the isotropic ones. The mesogenic character of the epoxy compounds appears more crucial than the molecular geometry of the curing agent in developing liquid crystallinity. The curing temperature plays an important role in affecting the state of order of the thermosets.

  DOI：

  10.1080/10587259508033628

文献信息

• EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD OF PREPARING THE SAME, COMPOSITION AND CURED PRODUCT COMPRISING THE SAME, AND USES THEREOF
  申请人：KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

  公开号：US20140179836A1

  公开（公告）日：2014-06-26

  Disclosed are an epoxy compound having an alkoxysilyl group, a composite of which exhibits good heat resistant properties and/or a cured product of which exhibits good flame retardant properties, a method of preparing the same, a composition comprising the same, and a cured product and a use of the composition. An alkoxysilylated epoxy compound comprising at least one of Chemical Formula S1 substituent and at least two epoxy groups in a core, a method of preparing the epoxy compound by an allylation, a claisen rearrangement, an epoxidation and an alkoxysilylation, an epoxy composition comprising the epoxy compound, and a cured product and a use of the composition are provided. The composite of the disclosed exhibits improved chemical bonding, good heat resistant properties, a low CTE, a high glass transition temperature or Tg-less The cured product of the composition exhibits good flame retardant properties.

  揭示了一种具有烷氧基硅基团的环氧化合物，其复合材料具有良好的耐热性能和/或其固化产物具有良好的阻燃性能，以及其制备方法，包括该化合物的组合物，固化产物和组合物的用途。所述的烷氧基硅化环氧化合物包括至少一种化学式S1取代基和至少两个环氧基团在核心中，通过烯丙基化、克莱森重排、环氧化和烷氧基硅化制备环氧化合物的方法，包括该环氧化合物的环氧组合物，固化产物和组合物的用途。所述的复合材料具有改善的化学键合、良好的耐热性能、低CTE、高玻璃转变温度或Tg-less。该组合物的固化产物具有良好的阻燃性能。
• COMPOSITION AND CURED ARTICLE COMPRISING INORGANIC PARTICLES AND EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, USE FOR SAME, AND PRODUCTION METHOD FOR EPOXY COMPOUND HAVING ALKOXYSILYL GROUP
  申请人：KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

  公开号：US20150148452A1

  公开（公告）日：2015-05-28

  There is provided a composition including an alkoxysilylated epoxy compound, a composition of which exhibits good heat resistance properties, low CTE and high glass transition temperature or Tg-less and not requiring a separate coupling agent, and inorganic particles, a cured product formed of the composition, and a use of the cured product. An epoxy composition including an alkoxysilylated epoxy compound and inorganic particles, an epoxy composition including an epoxy compound, inorganic particles and a curing agent, a cured product of the composition, and a use of the composition are provided. Since chemical bonds may be formed between the alkoxysilyl group and the inorganic particles and between the alkoxysilyl groups, a composition of the composition including the alkoxysilylated epoxy compound and the inorganic particles exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less.

  提供一种包括烷氧硅基化环氧化合物的组合物，该组合物的性质具有良好的耐热性能，低CTE和高玻璃转变温度或Tg-无需单独的偶联剂，并且包括无机颗粒，所述组合物形成的固化产物，以及所述固化产物的用途。提供一种包括烷氧硅基化环氧化合物和无机颗粒的环氧组合物，一种包括环氧化合物、无机颗粒和固化剂的环氧组合物，所述组合物的固化产物，以及所述组合物的用途。由于烷氧硅基团与无机颗粒之间以及烷氧硅基团之间可能形成化学键，因此包括烷氧硅基化环氧化合物和无机颗粒的组合物具有改善的耐热性能、降低的CTE和增加的玻璃转变温度或Tg less。
• Treatment of protein folding disorders
  申请人：Carter D. Michael

  公开号：US20070015813A1

  公开（公告）日：2007-01-18

  In certain embodiments, the invention is directed to a method for treating a protein folding disorder comprising administering to a subject a compound of the formulas disclosed. In preferred embodiments, the compounds are bis-indole compounds.

  在某些实施例中，本发明涉及一种治疗蛋白质折叠紊乱的方法，包括向受试者给予公开的配方的化合物。在优选实施例中，这些化合物是双吲哚化合物。
• WAFER LAMINATE, METHOD FOR PRODUCTION THEREOF, AND ADHESIVE COMPOSITION FOR WAFER LAMINATE
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：EP3315301A1

  公开（公告）日：2018-05-02

  Disclosed herein is a wafer laminate suitable for production of thin wafers and a method for producing the wafer laminate. The wafer laminate can be formed easily by bonding between the support and the wafer and it can be easily separated from each other. It promotes the productivity of thin wafers. The wafer laminate includes a support, an adhesive layer formed on the support, and a wafer which is laminated on the adhesive layer in such a way that that surface of the wafer which has the circuit surface faces toward the adhesive layer, wherein the adhesive layer is a cured product of an adhesive composition composed of resin A and resin B, the resin A having the light blocking effect and the resin B having the siloxane skeleton.

  本文公开了一种适用于生产薄晶片的晶片层压板和一种生产晶片层压板的方法。该晶圆层压板可通过在支撑物和晶圆之间进行粘合而轻松形成，并可轻松相互分离。它提高了薄晶片的生产率。 晶片层压板包括支架、形成在支架上的粘合剂层以及以晶片上具有电路表面的表面朝向粘合剂层的方式层压在粘合剂层上的晶片，其中粘合剂层是由树脂 A 和树脂 B 组成的粘合剂组合物的固化产物，树脂 A 具有遮光效果，树脂 B 具有硅氧烷骨架。
• SEMICONDUCTOR DEVICE, MAKING METHOD, AND LAMINATE
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：EP3382742A1

  公开（公告）日：2018-10-03

  A semiconductor device is provided comprising a support, an adhesive resin layer, an insulating layer, a redistribution layer, a chip layer, and a mold resin layer. The adhesive resin layer consists of a resin layer (A) comprising a photo-decomposable resin containing a fused ring in its main chain and a resin layer (B) comprising a non-silicone base thermoplastic resin and having a storage elastic modulus E' of 1-500 MPa at 25°C and a tensile break strength of 5-50 MPa. The semiconductor device is easy to fabricate and has thermal process resistance, the support is easily separated, and a semiconductor package is efficiently produced.

  一种半导体器件由支架、粘合树脂层、绝缘层、再分布层、芯片层和模具树脂层组成。粘合剂树脂层由树脂层（A）和树脂层（B）组成，树脂层（A）由在其主链中含有熔融环的光分解树脂组成，树脂层（B）由非硅基热塑性树脂组成，在 25°C 时的储存弹性模量 E' 为 1-500 兆帕，拉伸断裂强度为 5-50 兆帕。该半导体器件易于制造，具有耐热工艺性，支撑物易于分离，可高效生产半导体封装。