2-[[2-[1-[2-(oxiran-2-ylmethoxy)phenyl]-9H-fluoren-9-yl]phenoxy]methyl]oxirane

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 二芳基庚烷
• 英文名称: 2-[[2-[1-[2-(oxiran-2-ylmethoxy)phenyl]-9H-fluoren-9-yl]phenoxy]methyl]oxirane
• 化学式: C₃₁H₂₆O₄
• 分子量: 462.5
• InChiKey: GISSYLJHWBEZDM-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6
• 重原子数：
  35
• 可旋转键数：
  8
• 环数：
  7.0
• sp3杂化的碳原子比例：
  0.23
• 拓扑面积：
  43.5
• 氢给体数：
  0
• 氢受体数：
  4

文献信息

• RESIN COMPOSITION AND SEMICONDUCTOR DEVICE BOARD
  申请人：Osaku Yumi

  公开号：US20140087136A1

  公开（公告）日：2014-03-27

  A resin composition which contains a binder resin (A), radiation-sensitive compound (B), silane-modified resin (C), and antioxidant (D), wherein a content of the silane-modified resin (C) is 0.1 to 150 parts by weight with respect to 100 parts by weight of the binder resin (A), a content of the antioxidant (D) is 0.1 to 10 parts by weight with respect to 100 parts by weight of the binder resin (A), and an amount of warping is 14 μm or less when using the resin composition to form a thickness 2 to 3 μm resin film and baking the formed resin film at 230° C. is provided.

  一种树脂组合物，包含粘合剂树脂（A），辐射敏感化合物（B），硅改性树脂（C）和抗氧化剂（D），其中硅改性树脂（C）的含量相对于100份粘合剂树脂（A）为0.1至150份重量，抗氧化剂（D）的含量相对于100份粘合剂树脂（A）为0.1至10份重量，并且使用该树脂组合物形成2至3μm厚度的树脂膜并在230°C下烘烤形成的树脂膜翘曲量为14μm或以下。
• CURABLE RESIN COMPOSITION, AND IMAGE-SENSOR-CHIP PRODUCTION METHOD AND IMAGE SENSOR CHIP USING SAME
  申请人：FUJIFILM Corporation

  公开号：EP2927716A1

  公开（公告）日：2015-10-07

  To provide a curable resin composition capable of producing an image sensor chip in which the color shading is suppressed, a production method of image sensor chip using the same, and an image sensor chip. A curable resin composition which is capable of being coated on a solid-state imaging device substrate and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, a production method of image sensor chip using the same, and an image sensor chip.

  提供一种能够生产抑制色差的图像传感器芯片的可固化树脂组合物、一种使用该组合物的图像传感器芯片的生产方法以及一种图像传感器芯片。 一种可涂布在固态成像装置基板上的可固化树脂组合物，它含有一种最大吸收波长在 600 至 850 纳米之间的染料，一种使用该组合物的图像传感器芯片的生产方法，以及一种图像传感器芯片。
• US20150259547A1
  申请人：——

  公开号：US20150259547A1

  公开（公告）日：2015-09-17
• CURABLE RESIN COMPOSITION, PRODUCTION METHOD OF IMAGE SENSOR CHIP USING THE SAME, AND IMAGE SENSOR CHIP
  申请人：FUJIFILM Corporation

  公开号：US20150287756A1

  公开（公告）日：2015-10-08

  There is provided a curable resin composition which is capable of being coated on a solid-state imaging device substrate and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, a production method of image sensor chip comprising a step of coating the curable resin composition on a solid-state imaging device substrate to form a dye-containing layer, and a step of adhering a glass substrate having an infrared ray reflecting film onto the dye-containing layer, and an image sensor chip comprising a solid-state imaging device substrate and a dye-containing layer composed of the curable resin composition.
• ORGANIC EL DISPLAY DEVICE
  申请人：TORAY INDUSTRIES, INC.

  公开号：US20170293224A1

  公开（公告）日：2017-10-12

  An object of the present invention is to provide an organic EL display device which causes neither decrease in emission luminance nor pixel shrinkage and is excellent in long-term reliability. The present invention is directed to an organic EL display device including an insulating layer formed on a first electrode of the organic EL display device and constituted of a cured film obtained from a positive type photosensitive resin composition containing (A) an alkali-soluble resin, (B) an o-quinonediazide compound and (C) an organic solvent, wherein the mole ratio S/C obtained when a section of the cured film is measured is greater than or equal to 0.003 and less than or equal to 0.008.