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2,6-bis((4-(pyridin-3-yl)pyrimidin-2-ylthio)methyl)-4-chlorophenol | 944956-85-8

中文名称
——
中文别名
——
英文名称
2,6-bis((4-(pyridin-3-yl)pyrimidin-2-ylthio)methyl)-4-chlorophenol
英文别名
ClPPT3;4-Chloro-2,6-bis[(4-pyridin-3-ylpyrimidin-2-yl)sulfanylmethyl]phenol;4-chloro-2,6-bis[(4-pyridin-3-ylpyrimidin-2-yl)sulfanylmethyl]phenol
2,6-bis((4-(pyridin-3-yl)pyrimidin-2-ylthio)methyl)-4-chlorophenol化学式
CAS
944956-85-8
化学式
C26H19ClN6OS2
mdl
——
分子量
531.061
InChiKey
GJBSJVVWHHWJMM-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    4.6
  • 重原子数:
    36
  • 可旋转键数:
    8
  • 环数:
    5.0
  • sp3杂化的碳原子比例:
    0.08
  • 拓扑面积:
    148
  • 氢给体数:
    1
  • 氢受体数:
    9

反应信息

  • 作为反应物:
    描述:
    copper(l) chloride2,6-bis((4-(pyridin-3-yl)pyrimidin-2-ylthio)methyl)-4-chlorophenol 在 Et3N 作用下, 以 甲醇乙腈 为溶剂, 生成 Cu4(4-(pyridin-3-yl)pyrimidine-2-thiolato)4
    参考文献:
    名称:
    Cleavage of C−S Bonds with the Formation of a Tetranuclear Cu(I) Cluster
    摘要:
    The treatment of a ligand, 2,6-bis((4-(pyridin-2-yl)pyrimidin-2-ylthio)methyl)-4-chlorophenol (ClPPT2), with cuprous chloride under a weak base condition led to the formation of a neutral Cu-4(I)-centered cluster [Cu-4(PPT2)(4)], whose X-ray diffraction analysis indicated that C-S bonds of the ligand were cleaved in the course of the reaction. To explain the C-S bond cleavage, a reasonable mechanism has been proposed. In support of it, four additional ligands, 2,6-bis((4-(pyridin-2-yl)pyrimidin-2-ylthio)methyl)-4-methylphenol (MePPT2), 2,6-bis((4-(pyridin-3-yl)pyrimidin-2-ylthio)methyl)-4-methylphenol (MePPT3), 2,6-bis((4-(pyridin-3-yl)pyrimidin-2-ylthio)methyl)-4-chlorophenol (ClPPT3), and 5-((4-(pyridin-3-yl)pyrimidin-2-ylthio)methyl)-2-hydroxybenzaldehyde (HBPPT2) were further tested to undertake the analogous reaction, and the cleaved products in these experiments were detected by electrospray ionization mass spectrometry techniques to clarify the process.
    DOI:
    10.1021/ic062059y
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