申请人:Sekito Yoshihide
公开号:US20140069702A1
公开(公告)日:2014-03-13
The photosensitive resin composition contains a (A) binder polymer, (B) cross-linked polymer particles, (C) thermosetting resin, (D) photo-polymerization initiator, and a (E) phosphoric flame retardant, in which a content of the (B) cross-linked polymer particles is 30 parts by weight to 100 parts by weight with respect to the 100 parts by weight of the (A) binder polymer, and an average particle diameter of the (B) cross-linked polymer particles is 1 μm to 10 μm. Therefore, the photosensitive resin composition (i) obtains an excellent tack-free property after being applied and dried, (ii) can be subjected to fine processing, (iii) is formed into a cured film having excellent flexibility, flame retardancy, and electrical insulation reliability, and (iv) causes a substrate to have a small warpage after being cured.
这种光敏树脂组合物包含(A)粘合剂聚合物、(B)交联聚合物微粒、(C)热固性树脂、(D)光聚合引发剂和(E)磷酸盐阻燃剂,其中(B)交联聚合物微粒的含量相对于(A)粘合剂聚合物的100重量份为30重量份到100重量份,并且(B)交联聚合物微粒的平均粒径为1微米到10微米。因此,这种光敏树脂组合物(i)在涂抹和干燥后获得出色的不粘性能,(ii)可以进行精细加工,(iii)形成具有出色的柔韧性、阻燃性和电气绝缘可靠性的固化膜,(iv)使基板在固化后具有较小的翘曲。