申请人:Arifuku Motohiro
公开号:US20100277884A1
公开(公告)日:2010-11-04
The circuit-connecting material of the invention is a circuit-connecting material for connection between a first circuit member having a first circuit electrode formed on the main side of a first board, and a second circuit member having a second circuit electrode formed on the main side of a second board, with the first circuit electrode and the second circuit electrode laid facing each other, the circuit-connecting material comprising a film-forming material, a curing agent that generates free radicals upon heating, a radical-polymerizing substance, an isocyanate group-containing compound and a ketimine group-containing compound represented by the following general formula (I), wherein the isocyanate group-containing compound content is 0.1-5 parts by weight and the ketimine group-containing compound content is 0.1-5 parts by weight with respect to 100 parts by weight as the total of the film-forming material and radical-polymerizing substance.
Wherein R represents an organic group, R
1
and R
2
each represent a C1-C4 monovalent aliphatic hydrocarbon group, and R
1
and R
2
may be linked together to form a cycloalkyl group.
本发明的电路连接材料是用于连接第一电路成员和第二电路成员的电路连接材料,第一电路成员在第一板的主面上形成有第一电路电极,第二电路成员在第二板的主面上形成有第二电路电极,第一电路电极和第二电路电极相对放置,该电路连接材料包括一种成膜材料、一种加热后产生自由基的固化剂、一种自由基聚合物质、一种含有异氰酸酯基团的化合物和一种含有酮胺基团的化合物,该含有异氰酸酯基团的化合物含量为100份重量中的0.1-5份重量,该含有酮胺基团的化合物含量为100份重量中的0.1-5份重量,作为成膜材料和自由基聚合物质的总量。其中,R代表有机基团,R1和R2各代表C1-C4单价脂肪族碳氢基团,R1和R2可以连接形成环烷基团。