申请人:——
公开号:US20030045670A1
公开(公告)日:2003-03-06
Polyimides displaying low color in thin films, atomic oxygen resistance, vacuum ultraviolet radiation resistance, solubility in organic solvents in the imide form, high glass transistion (T
g
) temperatures, and high thermal stability are provided. The poly(amide acid)s, copoly(amide acid)s, polyimides and copolyimides are prepared by the reaction of stoichiometric ratios of an aromatic dianhydride with diamines which contain phenylphosphine oxide groups in polar aprotic solvents. Controlled molecular weight oligomeric (amide acid)s and imides can be prepared by offsetting the stoichiometry according to the Carothers equation using excess diamine and endcapping with aromatic anhydrides The polyimide materials can be processed into various material forms such as thin films, fibers, foams, threads, adhesive film, coatings, dry powders, and fiber coated prepreg, and uses include thin film membranes on antennas, second-surface mirrors, thermal optical coatings, and multi-layer thermal insulation (MLI) blanket materials.
提供低颜色的聚酰亚胺薄膜,抗原子氧、真空紫外辐射、有机溶剂溶解性的聚酰亚胺,具有高玻璃转变温度(Tg)和高热稳定性。通过在极性非质子溶剂中的芳香族二酐和含有苯基膦氧基团的二胺的摩尔比反应制备聚酰亚胺和共聚酰亚胺。可以通过根据卡罗瑟方程调整摩尔比,使用过量二胺并用芳香族酐进行端基处理,制备控制分子量寡聚物(酰亚胺)和亚酰亚胺。聚酰亚胺材料可加工成各种形式的材料,如薄膜、纤维、泡沫、线、胶粘膜、涂料、干粉和涂覆纤维的预浸料,用途包括天线上的薄膜膜、第二表面镜、热光学涂层和多层热隔热毯材料。