申请人:EASTMAN KODAK COMPANY
(a New Jersey corporation)
公开号:EP0300226A2
公开(公告)日:1989-01-25
A laminate, adapted for manufacturing frames of metal beam leads that are bonded to integrated circuit chips, comprises
a) a flexible metal strip,
b) a layer of a first resist adhered to one surface of the metal strip, and
c) a layer of a second resist adhered to the opposite surface of the metal strip,
the second resist being a negative-working resist comprising
(1) a polymeric binder,
(2) a photopolymerizable monomer mixture, and
(3) a photoinitiator composition.
The negative-working resist exhibits excellent flexibility and adhesion to the metal and superior performance during high temperature processing, whereby it serves effectively as a support for the beam leads.
一种层压板,适用于制造与集成电路芯片粘接的金属梁引线框架,包括
a) 柔性金属带
b) 附着在金属带一个表面上的第一抗蚀层,以及
c) 一层第二抗蚀层,粘附在金属带的相反表面上、
第二光刻胶是一种负向工作光刻胶,包括
(1) 聚合物粘合剂
(2) 可光聚合的单体混合物,和
(3) 光引发剂组合物。
阴刻抗蚀层具有极佳的柔韧性和与金属的附着力,在高温加工过程中性能优越,可有效地作为束引线的支撑。