1,3-bis(3-amino-4-hydroxyphenoxy)benzene | 484664-38-2

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 1,3-bis(3-amino-4-hydroxyphenoxy)benzene
• 英文别名: 2-Amino-4-[3-(3-amino-4-hydroxyphenoxy)phenoxy]phenol
• CAS: 484664-38-2
• 化学式: C₁₈H₁₆N₂O₄
• 分子量: 324.336
• InChiKey: HHMSBDXTVPALFJ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.9
• 重原子数：
  24
• 可旋转键数：
  4
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  111
• 氢给体数：
  4
• 氢受体数：
  6

反应信息

• 作为产物：
  描述：

  1,3-bis(4-hydroxy-3-nitrophenoxy)benzene 在 1% Pd/C 、 一水合肼 作用下， 以 甲醇 为溶剂， 生成 1,3-bis(3-amino-4-hydroxyphenoxy)benzene
  参考文献：
  名称：

  4,4'-二羟基-3,3'-二硝基二苯醚和1,3-双(4-羟基-3-硝基苯氧基)苯在碱性水溶液中的实用高效合成

  摘要：

  4,4'-二羟基-3,3'-二硝基二苯醚 (4) 和 1,3-双(4-羟基-3-硝基苯氧基)苯 (9) 是 3,3'-二氨基-4,4 的宝贵前体'-二羟基二苯醚1 (5) 和1,3-双(3-氨基-4-羟基苯氧基)苯2 (10) 分别。后两种化合物很受关注，因为它们在酸碱行为中具有两性特性 3，并且是具有生物学意义的对称双酚曼尼希衍生物的前体。 4 此外，它们还是热稳定塑料（如聚酰胺、聚芳酯、聚酰亚胺和聚苯并恶唑）的重要原材料，它们尤其可用作正性光敏聚合物前体组合物，以形成电夹层绝缘体和半导体保护膜。5-11 关键问题是合成 4 和 9 作为 5 和 10 的前体。到目前为止，它们的合成涉及 4,4'-二羟基二苯醚 4,7 和 1,3-双（4 羟基苯氧基）苯的硝化。 2 然而，这些化合物 12-33 的制备存在非常严重的问题，例如转化率低导致产率低，形成许多不需要的副产物，使用高反应温度和对环境有害的试剂。相比之下，4

  DOI：

  10.1080/00304941003689419

文献信息

• RESIN COMPOSITION AND SEMICONDUCTOR DEVICE BOARD
  申请人：Osaku Yumi

  公开号：US20140087136A1

  公开（公告）日：2014-03-27

  A resin composition which contains a binder resin (A), radiation-sensitive compound (B), silane-modified resin (C), and antioxidant (D), wherein a content of the silane-modified resin (C) is 0.1 to 150 parts by weight with respect to 100 parts by weight of the binder resin (A), a content of the antioxidant (D) is 0.1 to 10 parts by weight with respect to 100 parts by weight of the binder resin (A), and an amount of warping is 14 μm or less when using the resin composition to form a thickness 2 to 3 μm resin film and baking the formed resin film at 230° C. is provided.

  一种树脂组合物，包含粘合剂树脂（A），辐射敏感化合物（B），硅改性树脂（C）和抗氧化剂（D），其中硅改性树脂（C）的含量相对于100份粘合剂树脂（A）为0.1至150份重量，抗氧化剂（D）的含量相对于100份粘合剂树脂（A）为0.1至10份重量，并且使用该树脂组合物形成2至3μm厚度的树脂膜并在230°C下烘烤形成的树脂膜翘曲量为14μm或以下。
• Positive photosensitive polyimide resin composition
  申请人：NISSAN CHEMICAL INDUSTRIES LTD.

  公开号：EP0424940A2

  公开（公告）日：1991-05-02

  A positive photosensitive polyimide resin composition which comprises 100 parts by weight of an organic solvent-soluble polyimide resin and 1-100 parts by weight of an ο-quinonediazide compound, said polyimide resin being composed of the repeating units represented by formulas [I] and [II] below (where R₁ is a divalent organic group to constitute a diamine which has one or more groups of at least one kind selected from the group consisting of phenolic hydroxyl group, carboxyl group, thiophenol group, and sulfonic group; R₃ is a divalent organic group having no phenolic hydroxyl group, carboxyl group, thiophenol group, and sulfonic group; and R₂ and R₄ each are a tetravalent organic group constituting a tetracarboxylic acid and a derivative thereof when R₁ has one or more groups of at least one kind selected from the group consisting of carboxyl group and sulfonic group and has no phenolic hydroxyl group and thiophenol group, or R₂ and R₄ each are a tetravalent organic group constituting a tetracarboxylic acid and a derivative thereof composed of four carbonyl groups which are not attached directly to the aromatic ring when R₁ has a phenolic hydroxyl group and/or thiophenol group) with the molar percentage (a) of the repeating units represented by formula [I] being in the range of 1 mol% ≦ a ≦ 90 mol% and the molar percentage (b) of the repeating units represented by formula [II] being in the range of 10 mol% ≦ b ≦ 99 mol%, and having a reduced viscosity of 0.05-3.0 dℓ/g (measured at a concentration of 0.5 g/ℓ in N-methylpyrrolidone at 30°C).

  一种正性光敏聚酰亚胺树脂组合物，它由重量份数为 100 份的有机溶剂溶性聚酰亚胺树脂和重量份数为 1-100 份的ο-醌噻嗪化合物组成，所述聚酰亚胺树脂由以下式[I]和[II]所代表的重复单元组成 (其中，R₁ 是二价有机基团，以构成二元胺，该二元胺具有一个或多个至少选自酚羟基、羧基、噻吩酚基和磺酸基的基团；R₃ 是不含酚羟基、羧基、噻吩酚基和磺酸基的二价有机基团；和 R₂ 和 R₄ 分别是构成四羧酸及其衍生物的四价有机基团，当 R₁ 具有至少一种选自羧基和磺酰基的一个或多个基团，且不具有酚羟基和噻吩酚基时、或 R₂ 和 R₄ 各为构成四羧酸的四价有机基团及其衍生物，当 R₁ 具有酚羟基和/或噻吩酚基时，由四个不直接连接到芳香环上的羰基组成。） 由式[I]代表的重复单元的摩尔百分比（a）在 1 mol% ≦ a ≦ 90 mol% 的范围内，由式[II]代表的重复单元的摩尔百分比（b）在 10 mol% ≦ b ≦ 99 mol% 的范围内，且具有 0.05-3.0dℓ/g（在N-甲基吡咯烷酮中浓度为0.5g/ℓ，温度为30℃时测量）。
• POSITIVE TYPE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION
  申请人：Nissan Chemical Industries, Ltd.

  公开号：EP1241527A1

  公开（公告）日：2002-09-18

  A positive type photosensitive resin composition which can be developed by an aqueous alkaline solution and which is excellent in the developability and the adhesion to a substrate, is presented. Namely, the present invention presents a positive type photosensitive polyimide resin composition characterized by comprising 100 parts by weight of a solvent-soluble polyimide having repeating units represented by the formula (1) and from 1 to 50 parts by weight of a polyimide precursor having repeating units represented by the formula (2), and by further containing an o-quinonediazide compound in an amount of from 1 to 100 parts by weight per 100 parts by weight of the total amount of the repeating units represented by the formula (1) and the repeating units represented by the formula (2): (wherein R1 and R3 are bivalent organic groups, from 1 to 90 mol% of R1 is a bivalent organic group having one or plural groups of at least one type selected from the group consisting of a phenolic hydroxyl group, a carboxyl group, a thiophenol group and a sulfonic group, and from 10 to 99 mol% is a bivalent organic group having no phenolic hydroxyl, carboxylic, thiophenol or sulfonic group, and R2 and R4 are tetravalent organic groups constituting a tetracarboxylic acid or its derivative).

  本发明提出了一种正型感光树脂组合物，它可以用碱性水溶液显影，并且在显影性和对基底的附着力方面都很出色。即，本发明提出了一种正型感光聚酰亚胺树脂组合物，其特征是含有 100 重量份的具有式（1）所代表重复单元的溶剂可溶性聚酰亚胺和 1 至 50 重量份的具有式（2）所代表重复单元的聚酰亚胺前体、并进一步含有邻醌噻嗪化合物，其用量为式（1）代表的重复单元和式（2）代表的重复单元总量的 1 至 100 份（重量比）： (其中 R1 和 R3 为二价有机基团，1-90 摩尔%的 R1 为二价有机基团，该二价有机基团具有一个或多个至少一种类型的基团，该基团选自由酚羟基、羧基、噻吩酚基团和噻吩酚基团组成的组、R2和R4是构成四羧酸或其衍生物的四价有机基团）。
• POSITIVE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION
  申请人：Nissan Chemical Industries, Ltd.

  公开号：EP1329769A1

  公开（公告）日：2003-07-23

  A novel positive photosensitive resin composition is presented by improving the water repellency at the surface and imparting additional functions to a positive photosensitive resin which can be developed by an alkali aqueous solution and which is excellent in sensitivity and developability, while maintaining such properties. The positive photosensitive polyimide resin composition comprises (a) a solvent-soluble polyimide wherein from 1 to 100 mol% of a bivalent organic group constituting a diamine, has one or more of at least one group selected from the group consisting of a phenolic hydroxyl group, a carboxyl group, a thiophenol group and a sulfonic group, and the reduced viscosity is from 0.05 to 5.0 dl/g (at a concentration of 0.5 g/dl in N-methyl pyrrolidone at a temperature of 30°C), (b) a photosensitive orthoquinonediazide compound, and (c1) a solvent-soluble polyimide wherein from 1 to 100 mol% of a bivalent organic group constituting a diamine, has one or more of at least one group selected from the group consisting of a long chain alkyl group having at least 6 carbon atoms and a fluorinated alkyl group, and the reduced viscosity is from 0.05 to 5.0 dl/g (at a concentration of 0.5g/dl in N-methylpyrrolidone at a temperature of 30°C) or (c2) a polyamic acid wherein from 1 to 100 mol% of a bivalent organic group constituting a diamine, has one or more of at least one group selected from the group consisting of a long chain alkyl having at least 6 carbon atoms and a fluorinated alkyl group, and the reduced viscosity is from 0.05 to 5.0 dl/g (at a concentration of 0.5 g/dl in N-methylpyrrolidone at a temperature of 30°C), wherein component [c1] or component [c2] is from 0.1 to 50 wt%, based on the total weight of all polymers.

  本发明提出了一种新型正性光敏树脂组合物，它通过改善正性光敏树脂表面的憎水性和赋予其附加功能，使其可以用碱水溶液显影，并在保持这些特性的同时，具有优异的灵敏度和显影性。 正性感光聚酰亚胺树脂组合物包括 (a) 溶剂可溶聚酰亚胺，其中 1 至 100 摩尔％的二价有机基团构成二胺，具有一个或多个至少选自酚羟基、羧基、噻吩酚基和磺酸基组成的基团，还原粘度为 0.05 至 5.0 dl/g（在浓度为 0.5克/分升(在N-甲基吡咯烷酮中，温度为30℃)，(b)一种光敏原醌噻嗪化合物，和(c1)一种溶剂溶性聚酰亚胺，其中构成二胺的1至100摩尔%的二价有机基团，具有一个或多个至少一个选自至少有6个碳原子的长链烷基和氟化烷基的基团，且降低的粘度为0.05 至 5.0 分升/克（在 N-甲基吡咯烷酮中的浓度为 0.5 克/分升，温度为 30℃）或 (c2) 聚酰胺酸，其中构成二胺的 1 至 100 摩尔%的二价有机基团具有一个或多个选 自至少具有 6 个碳原子的长链烷基和氟化烷基组成的组中的至少一个基团，且降粘 度为 0.05至5.0分升/克（在N-甲基吡咯烷酮中浓度为0.5克/分升，温度为30℃时），其中组分[c1]或组分[c2]占所有聚合物总重量的0.1至50重量％。
• POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND POLYHYDROXYAMIDE RESIN
  申请人：Nissan Chemical Industries, Ltd.

  公开号：EP2159637A1

  公开（公告）日：2010-03-03

  There is provided a positive photosensitive resin composition that is excellent in electric insulating properties, heat resistance, mechanical strength and electrical characteristics, and capable of forming a high-resolution circuit pattern. The positive photosensitive resin composition comprises at least one type of a polyhydroxyamide resin (A) containing a repeating unit represented by Formula (1) and having a weight average molecular weight of 3,000 to 100,000, and a compound (B) generating an acid by light irradiation. (where X represents a tetravalent aliphatic group or an aromatic group; R1 and R2 independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atom(s); Ar1 and Ar2 independently represent an aromatic group; Y represents an organic group containing an aromatic group substituted with at least one OH group; n represents an integer of 1 or more; and 1 and m independently represent an integer of 0 or 1 or more and satisfy 1+m≤2)

  本发明提供了一种电绝缘性能、耐热性、机械强度和电气特性优良，并能形成高分辨率电路图案的正性感光树脂组合物。该正性光敏树脂组合物包括至少一种含有由式（1）表示的重复单元且重量平均分子量在 3,000 至 100,000 之间的聚羟酰胺树脂（A）和一种通过光照射产生酸的化合物（B）。 (其中 X 代表四价脂肪族基团或芳香族基团；R1 和 R2 独立地代表氢原子或具有 1 至 10 个碳原子的烷基；Ar1 和 Ar2 独立地代表芳香族基团；Y 代表含有至少一个 OH 基团取代的芳香族基团的有机基团； n 代表 1 或以上的整数；1 和 m 独立地代表 0 或 1 或以上的整数，且满足 1+m≤2)