A method for selective deposition of an organic solderability preservative coating on a copper surface of an article is disclosed. The method includes two steps of organic coatings by two solutions; the first step contains contacting the copper surface with a first solution including azole compound and the second step contains contacting the copper surface treated by the first solution with a second solution including a specific pyrazine derived compound.
本发明公开了一种在物品的
铜表面选择性沉积有机可焊性防腐涂层的方法。该方法包括用两种溶液进行有机涂层的两个步骤;第一步是用包括唑化合物的第一种溶液接触
铜表面,第二步是用包括特定
吡嗪衍生化合物的第二种溶液接触经第一种溶液处理过的
铜表面。