申请人:KABUSHIKI KAISHA TOSHIBA
公开号:EP0273729A2
公开(公告)日:1988-07-06
A solder resist ink composition is disclosed which contains a photo-curable resin (A2) obtained by causing an unsaturated monocarboxylic acid to react with a cresolnovolak- or phenolnovolak-type epoxy resin, and causing a polybasic carboxylic anhydride to react with the resultant reaction product, a photo-curable resin (B2) obtained by causing an unsaturated monocarboxylic acid to react with a bisphenol A novolak- or cycloaliphatic oxirane novolak-type epoxy resin, and causing a polybasic carboxylic anhydride to react with the resultant reaction product, at least one photo-polymerizable compound (C) selected from photo-polymerizable monomers, a photo-polymerization initiator, an organic solvent, and an inorganic filler. Also disclosed are two other solder resist ink compositions each having a different photo-curable component.
本发明公开了一种阻焊油墨组合物,其中含有一种光固化树脂(A2),该树脂是通过使不饱和单羧酸与甲酚诺伏拉克型或苯酚诺伏拉克型环氧树脂反应,并使多碱性羧酸酐与反应产物反应而得到的、一种光固化树脂 (B2),它是通过使不饱和单羧酸与双酚 A 新戊醚或环脂族环氧乙烷新戊醚型环氧树脂反应,并使多碱性羧酸酐与反应生成物反应而得到的;至少一种可光聚合化合物 (C),它选自可光聚合单体、光聚合引发剂、有机溶剂和无机填料。还公开了另外两种阻焊油墨组合物,每种组合物都具有不同的光固化成分。