PHOTOSENSITIVE COMPOSITION, PATTERN FORMING METHOD USING THE PHOTOSENSITIVE COMPOSITION AND COMPOUND FOR USE IN THE PHOTOSENSITIVE COMPOSITION
申请人:Wada Kenji
公开号:US20100233617A1
公开(公告)日:2010-09-16
A photosensitive composition includes: (A) a resin containing a repeating unit corresponding to a compound represented by the following formula (I); the resin being capable of producing an acid group upon irradiation with an actinic ray or radiation:
Z-A-X—B—R (I)
wherein Z represents a group capable of becoming an acid group resulting from leaving of a cation upon irradiation with an actinic ray or radiation; A represents an alkylene group; X represents a single bond or a heteroatom-containing divalent linking group; B represents a single bond, an oxygen atom or —N(Rx)-; Rx represents a hydrogen atom or a monovalent organic group; R represents a monovalent organic group substituted by Y; when B represents —N(Rx)-, R and Rx may combine with each other to form a ring; and Y represents a polymerizable group.
PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE, ELECTRONIC DEVICE AND COMPOUND
申请人:FUJIFILM CORPORATION
公开号:US20160070167A1
公开(公告)日:2016-03-10
There is provided a pattern forming method comprising (i) a step of forming a film containing an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a compound represented by the specific formula, (B) a compound different from the compound (A) and capable of generating an acid upon irradiation with an actinic ray or radiation, and (P) a resin that does not react with the acid generated from the compound (A) and is capable of decreasing the solubility for an organic solvent-containing developer by the action of the acid generated from the compound (B), (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using an organic solvent-containing developer to form a negative pattern; the actinic ray-sensitive or radiation-sensitive resin composition above; a resist film using the composition.
COMPOUND, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, AND PATTERN FORMATION METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE USING SAME, AND ELECTRONIC DEVICE
申请人:FUJIFILM CORPORATION
公开号:US20160024005A1
公开(公告)日:2016-01-28
There is provided an actinic ray-sensitive or radiation-sensitive resin composition containing a compound represented by the following formula (1) or (2), and the formula (1) and (2) are defined as herein,
and a resist film comprising the actinic ray-sensitive or radiation-sensitive resin composition, and a pattern forming method comprising a step of exposing the resist film, and a step of developing the exposed film, and a method for manufacturing an electronic device, comprising the pattern forming method, and an electronic device manufactured by the manufacturing method of an electronic device.
PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST FILM
申请人:Enomoto Yuichiro
公开号:US20120282548A1
公开(公告)日:2012-11-08
Provided is a pattern forming method comprising (i) a step of forming a film from an actinic ray-sensitive or radiation-sensitive resin composition, (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using an organic solvent-containing developer, wherein the actinic ray-sensitive or radiation-sensitive resin composition comprises (A) a resin capable of decreasing the solubility for an organic solvent-containing developer by the action of an acid, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (D) a solvent, and (G) a compound having at least either one of a fluorine atom and a silicon atom and having basicity or being capable of increasing the basicity by the action of an acid.
Chemical amplification type positive resist composition
申请人:Takata Yoshiyuki
公开号:US20050031984A1
公开(公告)日:2005-02-10
The present invention provides a resin which comprises a structural unit of the formula (I)
wherein R
1
represents alkylene having 1 to 4 carbon atoms, R
2
represents alkyl having 1 to 4 carbon atoms, and R
3
represents hydrogen or methyl, and also prvides a chemical amplification type positive resist composition comprising a resin defined above and an acid generator.