5,5'-(9H-fluorene-9,9-diyl)bis(2-aminophenol) | 152480-72-3

• 分子结构分类: 有机化合物 - 苯类化合物 - 芴
• 英文名称: 5,5'-(9H-fluorene-9,9-diyl)bis(2-aminophenol)
• 英文别名: 3,3'-(9H-Fluorene-9,9-diyl)bis(6-aminophenol)；2-amino-5-[9-(4-amino-3-hydroxyphenyl)fluoren-9-yl]phenol
• CAS: 152480-72-3
• 化学式: C₂₅H₂₀N₂O₂
• 分子量: 380.446
• InChiKey: XPAKOSSMKJYGJA-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.6
• 重原子数：
  29
• 可旋转键数：
  2
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.04
• 拓扑面积：
  92.5
• 氢给体数：
  4
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  5,5'-(9H-fluorene-9,9-diyl)bis(2-aminophenol) 、 4-硝基苯甲酰氯 在 methyloxirane 作用下， 以 丙酮 为溶剂， 以98 %的产率得到
  参考文献：
  名称：

  KR2022/140916

  摘要：

  公开号：

文献信息

• Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device
  申请人：——

  公开号：US20020013443A1

  公开（公告）日：2002-01-31

  A precursor of a polybenzoxazole resin which comprises a crosslinking group in a molecule and has a specific structure, a polybenzoxazole resin obtained from the precursor by the condensation reaction and the crosslinking reaction, an insulating film comprising the polybenzoxazole resin and a semiconductor device comprising an insulating interlayer film in multi-layer wiring or a film for protecting surfaces which comprises the above insulating film. The precursor exhibits excellent processability due to excellent solubility in solvents and, after the ring closure, excellent heat stability in applications. The resin exhibits excellent electric, physical and mechanical properties and is advantageously used for insulating interlayer films of semiconductor devices and the like applications.

  一种聚苯并咪唑树脂的前体，其分子中包含交联基团并具有特定的结构，通过缩合反应和交联反应获得的聚苯并咪唑树脂，包括聚苯并咪唑树脂的绝缘膜以及包括上述绝缘膜的多层布线中的绝缘中间层膜或用于保护表面的膜的半导体器件。由于前体在溶剂中具有优异的溶解性，因此表现出优异的加工性能，并且在环闭后具有优异的热稳定性能，树脂表现出优异的电学、物理和机械性能，可优点地用于半导体器件的绝缘中间层膜等应用。
• Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same
  申请人：——

  公开号：US20040002572A1

  公开（公告）日：2004-01-01

  A material for an insulating film which comprises a copolymer obtained by reacting a polyamide having a specific structure and a reactive oligomer as a component forming the film; a coating varnish for an insulating film which comprises this material and an organic solvent; an insulating film which comprises a layer of a resin comprising as a main structure a polybenzoxazole which is obtained by treating the above material or the above coating varnish by heating so that condensation reaction and crosslinking reaction take place and has fine pores; and a semiconductor device which comprises an insulating interlayer film for multi-layer wiring comprising the insulating film and/or a surface protective film comprising the insulating film. Excellent electrical, thermal and mechanical properties are exhibited and a low permittivity can be achieved.

  一种绝缘薄膜材料，包括由特定结构的聚酰胺和反应性低聚物作为成膜组分所反应得到的共聚物；一种用于绝缘薄膜的涂覆清漆，包括该材料和有机溶剂；一种绝缘薄膜，包括一层树脂，其主要结构为通过热处理上述材料或上述涂覆清漆得到的聚苯并咪唑，发生缩聚反应和交联反应并具有细小孔隙；以及一种半导体器件，包括用于多层布线的绝缘中间层膜，包括上述绝缘薄膜和/或表面保护膜，包括上述绝缘薄膜。具有优异的电性能、热性能和机械性能，并且可以实现低介电常数。
• HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE
  申请人：SUMITOMO BAKELITE CO., LTD.

  公开号：EP1327653A1

  公开（公告）日：2003-07-16

  A precursor of a polybenzoxazole resin which comprises a crosslinking group in a molecule and has a specific structure, a polybenzoxazole resin obtained from the precursor by the condensation reaction and the crosslinking reaction, an insulating film comprising the polybenzoxazole resin and a semiconductor device comprising an insulating interlayer film in multi-layer wiring or a film for protecting surfaces which comprises the above insulating film. The precursor exhibits excellent processability due to excellent solubility in solvents and, after the ring closure, excellent heat stability in applications. The resin exhibits excellent electric, physical and mechanical properties and is advantageously used for insulating interlayer films of semiconductor devices and the like applications.

  一种在分子中含有交联基团并具有特定结构的聚苯并恶唑树脂前体，一种由该前体通过缩合反应和交联反应得到的聚苯并恶唑树脂，一种由该聚苯并恶唑树脂组成的绝缘膜，以及一种由多层布线中的绝缘夹层膜或由上述绝缘膜组成的表面保护膜组成的半导体器件。前体在溶剂中具有极佳的溶解性，因此具有极佳的加工性，并且在闭环后具有极佳的热稳定性。该树脂具有优异的电气、物理和机械性能，可用于半导体设备的绝缘夹层薄膜和类似用途。
• RESIN AND RESIN COMPOSITION
  申请人：Asahi Kasei EMD Corporation

  公开号：EP1707588A1

  公开（公告）日：2006-10-04

  Disclosed is a hydroxy polyamide represented by the following general formula (1) and having a 5-amino isophthalic acid derivative structure in the main chain structure. (1) (In the formula, m and n represent integers, X represents at least one tetravalent organic group, Y represents at least one divalent organic group having a 5-amino isophthalic acid derivative structure, and Z represents at least one divalent organic group.)

  所公开的羟基聚酰胺由以下通式(1)表示，在主链结构中具有 5-氨基间苯二甲酸衍生物结构。(1) （式中，m 和 n 代表整数，X 代表至少一个四价有机基团，Y 代表至少一个具有 5-氨基间苯二甲酸衍生物结构的二价有机基团，Z 代表至少一个二价有机基团）。
• ENERGY-SENSITIVE RESIN COMPOSITION
  申请人：Tokyo Ohka Kogyo Co., Ltd.

  公开号：EP3275940A1

  公开（公告）日：2018-01-31

  The present invention provides an energy-sensitive resin composition with which it is possible, even if the precursor polymer is heat-treated at low temperatures, to produce a film or molded article comprising an imide ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance with a low dielectric constant, or a film or molded article comprising an oxazole ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance. Also provided are a method of manufacturing the film or molded article; a method of forming a pattern using the energy-sensitive resin composition; and a permanent film having excellent heat resistance, tensile elongation and chemical resistance. The energy-sensitive resin composition comprises an imidazole compound (A) represented by formula (1a), a resin precursor component (B), and a solvent (S), wherein the resin precursor component (B) is at least one resin precursor component selected from the group consisting of: a monomer component comprising a diamine compound represented by formula (2), a dicarbonyl compound represented by formula (3a) and/or a tetracarboxylic acid dianhydride represented by formula (3b); and a precursor polymer having a repeating unit represented by formula (4).

  本发明提供了一种能量敏感树脂组合物，使用该组合物，即使在低温下对前体聚合物进行热处理，也可以生产出一种薄膜或模塑制品，该薄膜或模塑制品由具有优异耐热性、拉伸伸长率和耐化学性且介电常数较低的含亚胺环聚合物组成，或由具有优异耐热性、拉伸伸长率和耐化学性的含恶唑环聚合物组成。此外，还提供了一种制造薄膜或模塑品的方法；一种使用能量敏感树脂组合物形成图案的方法；以及一种具有优异耐热性、拉伸伸长率和耐化学性的永久性薄膜。能敏树脂组合物包括由式 (1a) 表示的咪唑化合物 (A)、树脂前体组分 (B) 和溶剂 (S)，其中树脂前体组分 (B) 是至少一种选自以下组别的树脂前体组分：由式（2）代表的二胺化合物、式（3a）代表的二羰基化合物和/或式（3b）代表的四羧酸二酐组成的单体组分；以及具有式（4）代表的重复单元的前体聚合物。