4-Chloro-2-(3-phenylpropyl)-1H-benzimidazole | 152937-24-1

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 苯并咪唑类
• 英文名称: 4-Chloro-2-(3-phenylpropyl)-1H-benzimidazole
• CAS: 152937-24-1
• 化学式: C₁₆H₁₅ClN₂
• 分子量: 270.75
• InChiKey: ICZMYHOUGXQUMI-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.6
• 重原子数：
  19
• 可旋转键数：
  4
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.19
• 拓扑面积：
  28.7
• 氢给体数：
  1
• 氢受体数：
  1

文献信息

• Water-based organic solderability preservative, and electronic board and surface treatment method using the same
  申请人：TAMURA CORPORATION

  公开号：US10149395B2

  公开（公告）日：2018-12-04

  A water-based organic solderability preservative includes (A) an imidazole compound, (B) an organic acid, (C) a complex coating formation aid, (D) an organic solvent and (E) water. The component (D) (organic solvent) has a solubility to water of 10 g/100 g or more at 20 degrees C. and a boiling temperature in a range from 100 degrees C. to 300 degrees C.

  一种水基有机可焊性防腐剂包括 (A) 一种咪唑化合物、(B) 一种有机酸、(C) 一种复合涂层形成助剂、(D) 一种有机溶剂和 (E) 水。成分(D)（有机溶剂）在 20 摄氏度时对水的溶解度为 10 克/100 克或以上，沸腾温度范围为 100 摄氏度至 300 摄氏度。
• Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board
  申请人：——

  公开号：US20030141351A1

  公开（公告）日：2003-07-31

  The invention provides a water-soluble prefluxe that can solve problems with a soldering land array having a narrow spacing in that fused solder is likely to cause soldering bridges with defective soldering, a printed circuit board with its film formed thereon, and a surface treatment process for a metal in that circuit. The water-soluble preflus comprises given two different benzimidazoles compound and an iodine-based compound optionally with an amino acid, etc. The invention provides a printed circuit board with a film of that preflux formed thereon, and a surface treatment process for the metal in that circuit.

  本发明提供了一种水溶性预熔剂，它可以解决焊接地阵列间距较窄，熔化焊料容易造成焊接桥和焊接缺陷的问题，还提供了一种印刷电路板及其上形成的薄膜，以及该电路中金属的表面处理工艺。水溶性预熔剂包括给定的两种不同的苯并咪唑化合物和一种碘基化合物（可选）以及一种氨基酸等。本发明提供了一种印刷电路板，其上形成了一层该预熔剂的薄膜，以及该电路中金属的表面处理工艺。
• Surface treatment agents for metal films of printed circuit boards
  申请人：Miura Ichiro

  公开号：US20050173678A1

  公开（公告）日：2005-08-11

  A surface treatment agent is applied onto a metal film of a printed circuit board to form a rust preventive film. The surface treatment agent for metal comprises an aqueous solution comprising an organic acid having a boiling point of 170° C. or higher and one or more compound selected from the group consisting of an imidazole based compound and a benzimidazole based compound.
• WATER-BASED ORGANIC SOLDERABILITY PRESERVATIVE, AND ELECTRONIC BOARD AND SURFACE TREATMENT METHOD USING THE SAME
  申请人：TAMURA CORPORATION

  公开号：US20170327702A1

  公开（公告）日：2017-11-16

  A water-based organic solderability preservative includes (A) an imidazole compound, (B) an organic acid, (C) a complex coating formation aid, (D) an organic solvent and (E) water. The component (D) (organic solvent) has a solubility to water of 10 g/100 g or more at 20 degrees C. and a boiling temperature in a range from 100 degrees C. to 300 degrees C.
• US6712262B2
  申请人：——

  公开号：US6712262B2

  公开（公告）日：2004-03-30