3,4,5,6,7,8-hexahydro-2H-pyrrolo[1,2-a]pyrimidin-5-ium

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 二嗪类
• 英文名称: 3,4,5,6,7,8-hexahydro-2H-pyrrolo[1,2-a]pyrimidin-5-ium
• 化学式: C7H13N2+
• 分子量: 125.19
• InChiKey: SGUVLZREKBPKCE-UHFFFAOYSA-O

计算性质

• 辛醇/水分配系数(LogP)：
  -0.5
• 重原子数：
  9
• 可旋转键数：
  0
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.86
• 拓扑面积：
  15
• 氢给体数：
  1
• 氢受体数：
  0

文献信息

• THERMALLY DECOMPOSABLE POLYMER COMPOSITIONS INCORPORATING THERMALLY ACTIVATED BASE GENERATORS
  申请人：Tsang W. C. Peter

  公开号：US20120318854A1

  公开（公告）日：2012-12-20

  Embodiments in accordance with the present invention provide sacrifical polymer compositions and methods for fabricating electronic devices using such sacrifical polymer compositions where such methods include (1) providing a tacky sacrifical polymer composition that holds components in a desired alignment to one another, (2) providing solder fluxing for effecting electrical coupling; and (3) thermal decomposition or depolymerization of the sacrificial polymer composition to provide essentially residue free surfaces.
• THERMALLY DECOMPOSABLE POLYMER COMPOSITIONS FOR FORMING MICROELECTRONIC ASSEMBLIES
  申请人：PROMERUS LLC

  公开号：US20150299509A1

  公开（公告）日：2015-10-22

  Embodiments in accordance with the present invention relate generally to polymer compositions useful in the forming of microelectronic assemblies, and more specifically to such compositions that encompass a thermally decomposable polymer and that provide both tackiness and solder fluxing.
• THERMAL BASE GENERATOR, THERMOSETTING RESIN COMPOSITION, CURED FILM, CURED FILM MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE
  申请人：FUJIFILM Corporation

  公开号：US20170101521A1

  公开（公告）日：2017-04-13

  Provided are a thermal base generator which is capable of performing cyclization of a. thermosetting resin at a low temperature and with which a thermosetting resin composition having excellent stability can be prepared, a thermosetting resin composition, a cured film, a cured film manufacturing method, and a semiconductor device. The thermal base generator includes at least one selected from an acidic compound which generates a base in a case of being heated to 40° C. or higher, and an ammonium salt containing an anion having a pKa1 of 0 to 4 and an ammonium cation. The acidic compound is preferably an ammonium salt and/or a compound represented by the following General Formula (1), in which A 1 represents a p-valent organic group, R 1 represents a monovalent organic group, L 1 represents an (m+1)-valent organic group, m represents an integer of 1 or more, and p represents an integer of 1 or more.
• CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR MANUFACTURING CURED FILM, SEMICONDUCTOR DEVICE, AND POLYMER PRECURSOR
  申请人：FUJIFILM Corporation

  公开号：US20220002488A1

  公开（公告）日：2022-01-06

  There are provided a curable resin composition containing at least one polymer precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor, where the polymer precursor has a heterocyclic ring structure containing two or more nitrogen atoms and an acid value of the polymer precursor is 1 mmol/g or less, a cured film that is obtained by curing the curable resin composition, a laminate that includes the cured film, a method for manufacturing the cured film, and a semiconductor device including the cured film or the laminate, and a novel polymer precursor.
• US9115300B2
  申请人：——

  公开号：US9115300B2

  公开（公告）日：2015-08-25