p-phenylphenol glycidyl ether

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: p-phenylphenol glycidyl ether
• 英文别名: 2-(Oxiran-2-ylmethoxymethyl)oxirane;4-phenylphenol
• 化学式: C₆H₁₀O₃*C₁₂H₁₀O
• 分子量: 300.354
• InChiKey: JTWHEOSQYBQIRV-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.86
• 重原子数：
  22
• 可旋转键数：
  5
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.33
• 拓扑面积：
  54.5
• 氢给体数：
  1
• 氢受体数：
  4

反应信息

• 作为产物：
  描述：

  对羟基联苯 、 丁酮 、 环氧溴丙烷 在 potassium carbonate 作用下， 生成 p-phenylphenol glycidyl ether
  参考文献：
  名称：

  NOVEL HOLOGRAPHIC MEDIA AND PHOTOPOLYMERS

  摘要：

  本发明涉及包含特定光聚合物的全息介质，其生产过程，以及适用于制备光聚合物的不饱和环氧丙烯酸酯脲。

  公开号：

  US20110065827A1

文献信息

• Vinyl ester resins containing mesogenic/rigid rodlike moieties
  申请人：THE DOW CHEMICAL COMPANY

  公开号：EP0379058A2

  公开（公告）日：1990-07-25

  Thermosettable vinyl ester resin compositions are prepared from polyepoxide compounds, optionally, monoepoxide compounds, at least one of which contains a mesogenic or rigid rodlike moiety and a monounsaturated monocarboxylic acid. These vinyl ester resins can be mixed with polymerizable ethylenically unsaturated monomers which can, if desired, contain a mesogenic or rigid rodlike moiety.

  热固性乙烯基酯树脂组合物是由多环氧化物化合物和单环氧化物化合物制备而成的，其中至少有一种化合物含有中生或硬杆状分子和单不饱和单羧酸。这些乙烯基酯树脂可以与可聚合的乙烯基不饱和单体混合，如果需要，这些单体可以含有中生或刚性杆状分子。
• CURABLE COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR
  申请人：Daicel Corporation

  公开号：EP3006481A1

  公开（公告）日：2016-04-13

  A curable composition according to the present invention for sealing optical semiconductor includes components (A), (B), and (C). Another curable composition according to the present invention for sealing optical semiconductor further includes a component (D) in addition to the components (A), (B) and (C). The component (A) is a compound containing at least one functional group selected from the group consisting of epoxy groups, oxetanyl groups, vinyl ether groups, and (meth)acryloyl groups. The component (B) is a cycloaliphatic epoxy compound. The component (C) is a curing catalyst including a cationic component and an anionic component and generating an acid upon application of light or heat, where the cationic component contains an aromatic ring, and the anionic component contains a central element selected from boron and phosphorus. The component (D) is conductive fiber-bearing particles each including a particulate substance and a fibrous conductive substance lying on or over the particulate substance.

  根据本发明用于密封光学半导体的可固化组合物包括组分（A）、（B）和（C）。根据本发明的另一种用于密封光学半导体的可固化组合物，除组分（A）、（B）和（C）外，还包括组分（D）。组分（A）是含有至少一个官能团的化合物，该官能团选自由环氧基、氧杂环丁基、乙烯基醚基和（甲基）丙烯酰基组成的组。组分 (B) 是环脂族环氧化合物。组份（C）是一种固化催化剂，包括阳离子组份和阴离子组份，并在光或热作用下产生酸，其中阳离子组份含有芳香环，阴离子组份含有选自硼和磷的中心元素。成分（D）为导电纤维颗粒，每个颗粒包括微粒物质和位于微粒物质上或微粒物质上的纤维状导电物质。
• EPOXY RESIN COMPOSITION, FIBER-REINFORCED COMPOSITE MATERIAL, MOLDED ARTICLE, AND PRESSURE VESSEL
  申请人：Toray Industries, Inc.

  公开号：EP3395851A1

  公开（公告）日：2018-10-31

  The present invention addresses the problem of providing: an epoxy resin composition which enables the production of a fiber-reinforced composite material having an excellent tensile strength utilization factor; a fiber-reinforced composite material which is produced using the epoxy resin composition; a molded article; and a pressure vessel. The present invention also addresses the problem of providing a pressure vessel which has a high weight reduction effect and is highly resistant to repeated loading upon the charging of a high-pressure gas and the pressure discharge. In order to achieve the problems, the epoxy resin composition according to the present invention comprises components [A] to [C] as mentioned below, wherein the component [C] is a component [c1] or [c2] as mentioned below and the rubbery state elastic modulus of a cured article produced by curing the epoxy resin composition in a dynamic viscoelasticity evaluation is 10 MPa or less: [A] phenyl glycidyl ether substituted by a tert-butyl group, a sec-butyl group, an isopropyl group or a phenyl group; [B] a bifunctional or higher aromatic epoxy resin; [C] a curing agent; [c1] an acid anhydride-type curing agent; and [c2] an aliphatic amine-type curing agent.

  本发明所要解决的问题是：提供一种环氧树脂组合物，该组合物能够生产出具有优异拉伸强度利用系数的纤维增强复合材料；提供一种使用该环氧树脂组合物生产的纤维增强复合材料；提供一种模制件；以及提供一种压力容器。本发明还解决了提供一种压力容器的问题，该压力容器具有很高的减重效果，并且在充入高压气体和压力释放时具有很强的抗反复加载能力。为了实现上述问题，根据本发明的环氧树脂组合物包括如下所述的组分[A]至[C]，其中组分[C]为如下所述的组分[c1]或[c2]，通过在动态粘弹性评估中固化环氧树脂组合物而产生的固化物的橡胶态弹性模量为 10 兆帕或以下：[A] 被叔丁基、仲丁基、异丙基或苯基取代的苯基缩水甘油醚；[B] 双官能度或更高的芳香族环氧树脂；[C] 固化剂；[c1] 酸酐型固化剂；[c2] 脂肪胺型固化剂。
• RESIN COMPOSITION
  申请人：Mitsubishi Chemical Corporation

  公开号：EP3438992A1

  公开（公告）日：2019-02-06

  A resin composition for insulating coating material, comprises: a polyimide resin and/or a precursor thereof; and a polymer having a heterocyclic ring at a side chain, wherein the content of the polymer having a heterocyclic ring at a side chain is 0.1 to 7 parts by weight relative to 100 parts by weight of the polyimide resin and/or the precursor thereof. By adding a prescribed amount of the polymer having a heterocyclic ring at a side chain, there can be obtained a resin composition for insulating coating material still maintaining heat resistance and together having excellent bending resistance.

  一种用于绝缘涂层材料的树脂组合物包括：聚酰亚胺树脂和/或其前体；以及侧链上具有杂环的聚合物，其中相对于 100 重量份的聚酰亚胺树脂和/或其前体，侧链上具有杂环的聚合物的含量为 0.1 至 7 重量份。通过添加规定量的侧链上具有杂环的聚合物，可获得一种用于绝缘涂层材料的树脂组合物，该树脂组合物仍能保持耐热性，同时具有优异的抗弯曲性。
• Resin composition
  申请人：Mitsubishi Chemical Corporation

  公开号：US10947353B2

  公开（公告）日：2021-03-16

  A resin composition for insulating coating material, comprises: a polyimide resin and/or a precursor thereof; and a polymer having a heterocyclic ring at a side chain, wherein the content of the polymer having a heterocyclic ring at a side chain is 0.1 to 7 parts by weight relative to 100 parts by weight of the polyimide resin and/or the precursor thereof. By adding a prescribed amount of the polymer having a heterocyclic ring at a side chain, there can be obtained a resin composition for insulating coating material still maintaining heat resistance and together having excellent bending resistance.

  一种用于绝缘涂层材料的树脂组合物包括：聚酰亚胺树脂和/或其前体；以及侧链上具有杂环的聚合物，其中相对于 100 重量份的聚酰亚胺树脂和/或其前体，侧链上具有杂环的聚合物的含量为 0.1 至 7 重量份。通过添加规定量的侧链上具有杂环的聚合物，可获得一种用于绝缘涂层材料的树脂组合物，该树脂组合物仍能保持耐热性，同时具有优异的抗弯曲性。