(2Z,6E)-2,6-bis[(4-azidophenyl)methylidene]-4-hydroxycyclohexan-1-one

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 二芳基庚烷
• 英文名称: (2Z,6E)-2,6-bis[(4-azidophenyl)methylidene]-4-hydroxycyclohexan-1-one
• 化学式: C20H16N6O2
• 分子量: 372.4
• InChiKey: QUVZIPHUYYZGMW-CKOAPEAFSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.8
• 重原子数：
  28
• 可旋转键数：
  4
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.15
• 拓扑面积：
  66
• 氢给体数：
  1
• 氢受体数：
  6

文献信息

• Photosensitive resin composition and photosensitive films and laminates made by using the same
  申请人：——

  公开号：US20040265731A1

  公开（公告）日：2004-12-30

  A photosensitive resin composition of the present invention contains a (A) soluble polyimide and a (b) (meth)acrylic compound, the (A) soluble polyimide being soluble in an organic solvent and being synthesized by using an acid dianhydride component and at least one of a diamine component containing a siloxane structure or an aromatic ring structure, and a diamine component having, in its structure, a hydroxyl group a carboxyl group or a carbonyl group, and the (B) (meth)acrylic compound having at least one carbon-carbon double bond, and preferably contains at least one of a (C) photo reaction initiator and a (D) fire retardant. With this arrangement, the photosensitive resin composition of the present invention is capable of having excellent properties. Especially, the photosensitive resin composition of the present invention is so excellently useful that it can be used for electronic parts and the like.

  本发明的光敏树脂组合物包含(A)可溶性聚酰亚胺和(b)(甲基)丙烯酸化合物，其中(A)可溶性聚酰亚胺可在有机溶剂中溶解，并通过使用酸性二酐组分和至少一种含有硅氧烷结构或芳香环结构的二胺组分以及结构中具有羟基、羧基或羰基的二胺组分合成，(B)(甲基)丙烯酸化合物具有至少一个碳-碳双键，并且最好包含至少一个(C)光反应引发剂和(D)阻燃剂。通过这种安排，本发明的光敏树脂组合物具有优异的性能。特别是，本发明的光敏树脂组合物非常有用，可以用于电子零件等。
• Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof
  申请人：Okada Koji

  公开号：US20060199920A1

  公开（公告）日：2006-09-07

  A photosensitive resin composition according to the present invention includes at least a base resin component (A) and a (meth)acryls compound (B), wherein the base resin component (A) is any one of: a polyimide resin (A-1) having at least either a hydroxyl group or a carboxyl group in its structure; a polyamide resin (A-2) having at least either a hydroxyl group or a carboxyl group in its structure; and photosensitive imide(meth)acrylsiloxaneoligomer (A-3). On this account, it is possible to realize characteristics such as (1) realization and improvement of water system developing property, (2) improvement of utility as an imidized film, (3) improvement of post-curing property, and (4) simplification of manufacture of a print wiring substrate. Thus, the photosensitive resin composition can be favorably used particularly in a photosensitive dry film resin, a laminate using the same, a print wiring substrate using the same, and the like.

  本发明提供的一种光敏树脂组合物包括至少一种基础树脂组分(A)和一种（甲基）丙烯酸化合物(B)，其中基础树脂组分(A)是以下任何一种：具有至少一个羟基或羧基的聚酰亚胺树脂(A-1)；具有至少一个羟基或羧基的聚酰胺树脂(A-2)；和光敏亚胺（甲基）丙烯酰基硅氧烷低聚物(A-3)。因此，可以实现特性，例如(1)实现和改善水系开发性能，(2)改善作为亚胺化膜的实用性，(3)改善后固化性能，以及(4)简化印刷线路基板的制造。因此，该光敏树脂组合物可以特别有利地用于光敏干膜树脂、使用相同的层压板、使用相同的印刷线路基板等。
• Photosensitive polymer composition
  申请人：HITACHI, LTD.

  公开号：EP0118764A1

  公开（公告）日：1984-09-19

  A photosensitive polymer construction comprising (A) a poly (amic acid), (B) a compound or a mixture of compounds which can form a compound having two or more amino groups in the molecule, and (C) at least one compound having a boiling point of 150°C or higher at atmospheric pressure and selected from the group consisting of wherein Ra, Rb, Rc, m and n are as defined in the specification, has good properties and does not produce cracks on a pattern at the time of development obtained from said composition.

  一种光敏聚合物结构，包括(A)聚（胺基酸）；(B)一种化合物或化合物混合物，可形成分子中含有两个或两个以上氨基的化合物；和(C)至少一种化合物，在常压下沸点为 150℃或更高，并选自以下组成的组 其中 Ra、Rb、Rc、m 和 n 如说明书中所定义，具有良好的性能，并且在从所述组合物中获得显影图案时不会产生裂纹。
• Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide
  申请人：——

  公开号：US20010056174A1

  公开（公告）日：2001-12-27

  An object of the present invention is to provide an epoxy modified polyimide, which is a resin capable of treating at a low processing temperature and having an excellent heat resistance; photosensitive composition; coverlay film, which is excellent in electrical insulation property, heat resistance for soldering, film-formability, flexibility, and chemical resistance; solder resist; and printed wiring board. The epoxy modified polyimide is obtained by synthesizing polyimide having a hydroxy group or carboxy group and subsequently reacting the polyimide with an epoxy compound. The photosensitive composition is obtained by adding a photoreaction initiator or the like to the epoxy modified polyimide. The coverlay film and the solder resist can be formed from the photosensitive composition. The printed wiring board is produced using the coverlay film and the solder resist.

  本发明的目的是提供一种环氧改性聚酰亚胺，它是一种能在低加工温度下处理的树脂，具有优异的耐热性；感光组合物；覆盖膜，它具有优异的电绝缘性能、焊接耐热性、成膜性、柔韧性和耐化学性；阻焊剂；以及印刷线路板。环氧改性聚酰亚胺是通过合成具有羟基或羧基的聚酰亚胺，然后使聚酰亚胺与环氧化合物反应而得到的。光敏组合物是通过向环氧改性聚酰亚胺中添加光反应引发剂或类似物而获得的。覆盖膜和阻焊可以由光敏组合物形成。使用覆盖膜和阻焊层生产出印刷线路板。
• Polyimide precursor, manufacturing method thereof, and resin composition using polyimide precursor
  申请人：KANEKA CORPORATION

  公开号：US20030149142A1

  公开（公告）日：2003-08-07

  A polyimide precursor in accordance with the present invention contains amide acid ester units, either imide units or amide acid units, and fluorine atoms bonded to some of these structural units. A polyimide precursor resin composition in accordance with the present invention contains either such a polyimide precursor or resins separately containing the structural units. Polyimide precursors in accordance with the present invention and resin compositions based on the same therefore have excellent properties and are suitably used in particular to form a particular pattern and for other purposes by impart photosensitivity to them.

  根据本发明，聚酰亚胺前体含有酰胺酸酯单元、亚胺单元或酰胺酸单元，以及与其中一些结构单元键合的氟原子。根据本发明的聚酰亚胺前体树脂组合物含有这样的聚酰亚胺前体或单独含有结构单元的树脂。因此，符合本发明的聚酰亚胺前体和以聚酰亚胺前体为基础的树脂组合物具有优异的性能，特别适用于形成特定的图案，以及通过赋予其感光性来达到其他目的。