New photosensitive polyimide compositions and processes of using the same in the fabrication of electronic components are provided. These compositions are comprised of (CF₃)₂C-(6F) containing polyamic acids and/or the corresponding hydroxy-polyamic esters, or hydroxypolyimides and a photoactive component as an additive or as covalently bonded functionality on the polymer chain. These compositions provide positive or negative patterning options and may be used as conventional resist materials, as imageable dielectric or passivating layers,as high Tg ion implant as imageable lift-off layers inthe fabrication of multilevel metal structures.
本发明提供了新的光敏聚
酰亚胺组合物以及将其用于制造电子元件的工艺。这些组合物由(CF₃)₂C-(6F) 含聚酰胺酸和/或相应的羟基聚酰胺酯或羟基聚
酰亚胺以及作为添加剂或作为聚合物链上共价键功能的光活性成分组成。这些组合物可提供正或负图案化选择,可用作传统抗蚀剂材料、可成像的介电层或钝化层、高 Tg 离子植入层、多层次
金属结构制造中的可成像升离层。