申请人:AIR PRODUCTS AND CHEMICALS, INC.
公开号:EP2779217A2
公开(公告)日:2014-09-17
Chemical mechanical polishing (CMP) compositions for polishing tungsten or tungsten-containing substrates comprise an abrasive, at least one solid catalyst, a chemical additive selected from the groups consisting of piperazine derivatives, salts of cyanate, and combinations thereof; and a liquid carrier. Systems and processes use the aqueous formulations for polishing tungsten or tungsten-containing substrates.
用于抛光
钨或含
钨基材的
化学机械抛光(
CMP)组合物包括磨料、至少一种固体
催化剂、一种选自
哌嗪衍
生物、
氰酸盐及其组合的
化学添加剂;以及一种液体载体。系统和工艺使用
水性制剂抛光
钨或含
钨基材。